中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

24 records (took 0.017 seconds)

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    12.
    发明申请
    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20230078564A1

    公开(公告)日：2023-03-16

    申请号：US17990645

    申请日：2022-11-18

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN ,  Meng-Wei HSIEH ,  Yu-Pin TSAI

    IPC: H01L23/552 ,  H01L23/31 ,  H01L21/50

    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    14.
    发明申请
    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20220181267A1

    公开(公告)日：2022-06-09

    申请号：US17111347

    申请日：2020-12-03

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Cheng-Yuan KUNG ,  Meng-Wei HSIEH

    IPC: H01L23/552 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00

    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes an electronic component, a conductive contact, and a first shielding layer. The electronic component has a first surface, a lateral surface angled with the first surface, and a second surface opposite to the first surface. The conductive contact is connected to the first surface of the electronic component. The first shielding layer is disposed on the lateral surface of the electronic component and a portion of the first surface of the electronic component. The first shielding layer contacts the conductive contact.

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    16.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210249368A1

    公开(公告)日：2021-08-12

    申请号：US16789243

    申请日：2020-02-12

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Meng-Wei HSIEH ,  Kuo-Chang KANG

    IPC: H01L23/66 ,  H01L23/00 ,  H01L23/373 ,  H01L21/768

    Abstract: A semiconductor device package includes a first circuit layer, a first emitting device and a second emitting device. The first circuit layer has a first surface and a second surface opposite to the first surface. The first emitting device is disposed on the second surface of the first circuit layer. The first emitting device has a first surface facing the first circuit layer and a second surface opposite to the first surface. The first emitting device has a first conductive pattern disposed on the first surface of the first emitting device. The second emitting device is disposed on the second surface of the first emitting device. The second emitting device has a first surface facing the second surface of the first emitting device and a second surface opposite to the first surface. The second emitting device has a second conductive pattern disposed on the second surface of the emitting device. A coefficient of thermal expansion (CTE) of the first emitting device is greater than a CTE of the second emitting device.

    SEMICONDUCTOR DEVICE PACKAGE
    19.
    发明公开
    SEMICONDUCTOR DEVICE PACKAGE 审中-公开

    公开(公告)号：US20230268638A1

    公开(公告)日：2023-08-24

    申请号：US17676088

    申请日：2022-02-18

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Cheng-Yu HO ,  Meng-Wei HSIEH

    IPC: H01Q1/22 ,  H01L23/66

    CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L2223/6677

    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first antenna pattern disposed at a first elevation and a second antenna pattern disposed at a second elevation different from the first elevation. The first antenna pattern and the second antenna pattern define an air cavity. The semiconductor device package also includes a circuit layer. The air cavity is between the first antenna pattern, the second antenna pattern, and the circuit layer.

Patent Agency Ranking