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198 条记录 (耗时 0.034 秒)

    RETAINING RING WITH CONDUCTIVE PORTION
    15.
    发明申请
    RETAINING RING WITH CONDUCTIVE PORTION 审中-公开
    带导电部件的保持环

    公开(公告)号：US20080038999A1

    公开(公告)日：2008-02-14

    申请号：US11865303

    申请日：2007-10-01

    申请人： Antoine Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

    发明人： Antoine Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

    IPC分类号： H01L21/302 ,  B24B5/00

    CPC分类号： B23H5/08 ,  B24B37/32

    摘要： A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.

    摘要翻译： 描述了一种用于电化学机械加工的保持环。 保持环具有形成有导电部分和非导电部分的大致环形体。 非导电部分在抛光期间接触基板。 导电部分在抛光期间被电偏置以减少常规电化学机械处理系统倾向于发生的边缘效应。

    Hydrogen bubble reduction on the cathode using double-cell designs
    16.
    发明授权
    Hydrogen bubble reduction on the cathode using double-cell designs 失效
    使用双电池设计在阴极上进行氢气还原

    公开(公告)号：US07229535B2

    公开(公告)日：2007-06-12

    申请号：US10455861

    申请日：2003-06-06

    申请人： Yan Wang ,  Feng Q. Liu ,  Alain Duboust ,  Siew S. Neo ,  Liang-Yuh Chen ,  Yongqi Hu

    发明人： Yan Wang ,  Feng Q. Liu ,  Alain Duboust ,  Siew S. Neo ,  Liang-Yuh Chen ,  Yongqi Hu

    IPC分类号： C25F7/00 ,  B23H5/06 ,  C25F3/00 ,  C25F3/12 ,  C25F3/30 ,  B23H3/00

    CPC分类号： B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/04 ,  C25F3/02 ,  H01L21/32125 ,  H01L21/32134

    摘要： An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing system that reduces the number of defects found on the substrate surface after polishing. An exemplary electrochemical apparatus includes a physical barrier that prevents any trapped gas or gas generated during processing from residing in areas that can cause defects on the substrate. The process can be aided by the addition of various chemical components to the electrolyte that tend to reduce the gas generation at the cathode surface during the ECMP anodic dissolution process.

    摘要翻译： 使用通过膜分离成两部分的室来平坦化基板的表面的装置和方法，以及两个单独的电解质。 本发明的实施方案通常提供一种电化学机械抛光系统，其减少抛光后在基底表面上发现的缺陷数量。 示例性电化学装置包括物理屏障，其防止在处理期间产生的任何捕获的气体或气体驻留在可能导致基板上的缺陷的区域中。 该方法可以通过在电解质中添加各种化学成分来辅助，该电解质在ECMP阳极溶解过程期间倾向于减少阴极表面的气体产生。