公开(公告)号：US20140270735A1

公开(公告)日：2014-09-18

申请号：US14182879

申请日：2014-02-18

Applicant: APPLIED MATERIALS, INC.

Inventor： JOHN GERLING ,  JOSEPH M. RANISH ,  OLEG V. SEREBRYANOV ,  JOSEPH JOHNSON

IPC: H01L21/02

CPC classification number: H01L21/67115 ,  C23C14/541 ,  C23C16/46

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include: a process chamber body of the semiconductor process chamber; one or more solid state source arrays providing pulsed or continuous energy to the process chamber, wherein each of the one or more solid state source arrays include a substrate having a plurality of solid state light sources disposed on a first surface of the substrate, wherein the plurality of solid state light sources are connected in series and in a recursive pattern on the first surface of the substrate, and a heat sink coupled to a second surface of the substrate configured to remove heat from the substrate; and a power source coupled to the one or more solid state source arrays to electrically power the plurality of solid state sources.

Abstract translation: 本文提供了用于在处理室中提供脉冲或连续能量的装置。 该装置可以包括：半导体处理室的处理室主体; 一个或多个固态源阵列向处理室提供脉冲或连续的能量，其中所述一个或多个固态源阵列中的每一个包括设置在所述基板的第一表面上的多个固态光源的基板，其中， 多个固态光源在衬底的第一表面上串联连接并以递归图案连接，散热片耦合到衬底的第二表面，该第二表面构造成从衬底移除热量; 以及耦合到所述一个或多个固态源阵列以对所述多个固态源供电的电源。

公开(公告)号：US20140105583A1

公开(公告)日：2014-04-17

申请号：US14043091

申请日：2013-10-01

Applicant: Applied Materials, Inc.

Inventor： JOSEPH JOHNSON ,  JOSEPH M. RANISH ,  JOHN GERLING ,  MATHEW ABRAHAM ,  AARON MUIR HUNTER ,  ANEESH NAINANI

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  H01L21/67103 ,  H01L21/67109

Abstract: Apparatus for providing heat energy to a process chamber are provided herein. The apparatus may include a process chamber body of the process chamber, a solid state source array having a plurality of solid state sources, disposed on a first substrate, to provide heat energy to the process chamber to heat a target component disposed in the process chamber body, and at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the target component.

Abstract translation: 本文提供了用于向处理室提供热能的设备。 该装置可以包括处理室的处理室主体，具有多个固态源的固态源阵列，其设置在第一基板上，以向处理室提供热能，以加热设置在处理室中的目标部件 主体和至少一个反射器，其布置在靠近所述多个固态源中的一个或多个固态源的第一基板上，以将由所述多个固态源中的一个或多个的所述固态源提供的热能引导到所述目标部件。

公开(公告)号：US20130287377A1

公开(公告)日：2013-10-31

申请号：US13866505

申请日：2013-04-19

Applicant: APPLIED MATERIALS, INC.

Inventor： OLEG SEREBRYANOV ,  JOSEPH M. RANISH ,  ALEXANDER GOLDIN

IPC: H01L21/67

CPC classification number: H01L21/67115

Abstract: Methods and apparatus for heating a substrate in a process chamber are provided herein. In some embodiments, an apparatus for heating a substrate in a process chamber includes a lamp group comprising one or more sets of lamps to provide radiant energy to heat a substrate when disposed in the process chamber, wherein each set of lamps comprises a plurality of lamps wired in series, and wherein each set of lamps is wired in parallel with respect to other sets of the one or more sets of lamps; an alternating current (AC) power source to produce an AC input waveform; and a lamp driver to power the lamp group, the lamp driver including a rectifier coupled to the AC power source to convert the AC input waveform to DC voltage; and a direct current to direct current (DC/DC) converter to reduce voltage of the DC power.

Abstract translation: 本文提供了用于加热处理室中的衬底的方法和装置。 在一些实施例中，用于加热处理室中的衬底的装置包括灯组，其包括一组或多组灯，以在设置在处理室中时提供辐射能量以加热衬底，其中每组灯包括多个灯 串联连接，并且其中每组灯相对于所述一组或多组灯的其它组并联布线; 用于产生交流输入波形的交流（AC）电源; 以及灯驱动器，为所述灯组供电，所述灯驱动器包括耦合到所述AC电源的整流器，以将所述AC输入波形转换为DC电压; 以及直流直流（DC / DC）转换器以降低直流电力的电压。

公开(公告)号：US20130256962A1

公开(公告)日：2013-10-03

申请号：US13788573

申请日：2013-03-07

Applicant: APPLIED MATERIALS, INC.

Inventor： JOSEPH M. RANISH ,  KAILASH PATALAY

IPC: B05C13/00

CPC classification number: B05C13/00 ,  C30B23/02 ,  C30B35/00 ,  H01L21/67115 ,  H01L21/68735

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus includes a process kit, the process kit comprising a first ring to support a substrate proximate a peripheral edge of the substrate; a second ring disposed about the first ring; and a path formed between the first and second rings that allows the first ring to rotate with respect to the second ring, wherein the path substantially prevents light from travelling between a first volume disposed below the first and second rings and a second volume disposed above the first and second rings.

Abstract translation: 本文提供了处理衬底的方法和装置。 在一些实施例中，一种装置包括处理套件，该处理套件包括第一环以支撑靠近衬底的周边边缘的衬底; 设置在所述第一环周围的第二环; 以及形成在所述第一和第二环之间的路径，其允许所述第一环相对于所述第二环旋转，其中所述路径基本上防止光在设置在所述第一和第二环下方的第一容积和设置在所述第二环之上的第二体积 第一和第二个戒指。

公开(公告)号：US20130044493A1

公开(公告)日：2013-02-21

申请号：US13657935

申请日：2012-10-23

Applicant: Applied Materials, Inc.

Inventor： JOSEPH M. RANISH ,  KHURSHED SORABJI ,  KEDARNATH SANGAM ,  ALEXANDER LERNER

IPC: F21V29/00

CPC classification number: F27B17/0025 ,  F27D5/0037 ,  F27D21/0014 ,  H01L21/67109 ,  H01L21/67115

Abstract: Embodiments of a lamphead and apparatus utilizing same are provided. In some embodiments, a lamphead for thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage, wherein the at least one heat transfer member extends into each coolant passage up to the full height of each coolant passage. The lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.

Abstract translation: 提供了一种灯头和利用其的装置的实施例。 在一些实施例中，用于热处理的灯头可以包括具有多个冷却剂通道和多个灯通道和反射器腔的整体构件，其中每个灯通道被配置为容纳灯，并且每个反射器腔被成形为充当 反射器或接收用于灯的可替换反射器，并且其中所述多个冷却剂通道设置成靠近所述多个灯通道; 以及至少一个传热构件，其从所述整体构件延伸到每个冷却剂通道中，其中所述至少一个传热构件延伸到每个冷却剂通道中直到每个冷却剂通道的全高度。 灯头可以设置在包括具有基板支撑件的处理室的设备中，其中灯头被定位成向基板支撑件提供能量。

公开(公告)号：US20170259294A1

公开(公告)日：2017-09-14

申请号：US15604900

申请日：2017-05-25

Applicant: APPLIED MATERIALS, INC.

Inventor： JOSEPH M. RANISH ,  KAILASH PATALAY

IPC: B05C13/00 ,  H01L21/687 ,  C30B23/02 ,  H01L21/67 ,  C30B35/00

CPC classification number: B05C13/00 ,  C30B23/02 ,  C30B35/00 ,  H01L21/67115 ,  H01L21/68735

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus includes a process kit, the process kit comprising a first ring to support a substrate proximate a peripheral edge of the substrate; a second ring disposed about the first ring; and a path formed between the first and second rings that allows the first ring to rotate with respect to the second ring, wherein the path substantially prevents light from travelling between a first volume disposed below the first and second rings and a second volume disposed above the first and second rings.

公开(公告)号：US20160027671A1

公开(公告)日：2016-01-28

申请号：US14727136

申请日：2015-06-01

Applicant: Applied Materials, Inc.

Inventor： JOSEPH M. RANISH ,  Aaron Muir HUNTER

IPC: H01L21/67 ,  H05B3/00 ,  G02B6/00

Abstract: A processing chamber is described. The processing chamber includes a chamber having an interior volume, a light pipe array coupled to the chamber, the light pipe array comprising a wall member that defines a boundary of the interior volume of the chamber, wherein the light pipe array includes a plurality of non-metallic light pipe structures, and a radiant heat source comprising a plurality of energy sources in optical communication with each of the plurality of light pipe structures.

Abstract translation: 描述处理室。 所述处理室包括具有内部容积的室，耦合到所述室的光管阵列，所述光管阵列包括限定所述室的内部容积的边界的壁构件，其中所述光管阵列包括多个非 - 金属光管结构和辐射热源，其包括与多个光管结构中的每一个光学连通的多个能量源。

公开(公告)号：US20140270731A1

公开(公告)日：2014-09-18

申请号：US14182858

申请日：2014-02-18

Applicant: APPLIED MATERIALS, INC.

Inventor： JOHN GERLING ,  JOSEPH M. RANISH

IPC: H01L21/02

CPC classification number: H01L21/67109 ,  C23C14/541 ,  C23C16/46 ,  H01L21/67115 ,  H01S5/024 ,  H01S5/02423 ,  H01S5/4025

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include a process chamber comprising a chamber body, a solid state light source array, having a plurality of solid state light sources disposed on a first substrate, to provide pulsed or continuous energy to the process chamber, and a cooling mechanism including a band pass filter to reduce an amount of reflected light from heating the solid state source array.

Abstract translation: 本文提供了用于在处理室中提供脉冲或连续能量的装置。 该装置可以包括处理室，该处理室包括室主体，固态光源阵列，其具有设置在第一基板上的多个固态光源，以向处理室提供脉冲或连续的能量;以及冷却机构，包括： 带通滤波器以减少来自加热固态源阵列的反射光量。

公开(公告)号：US20140265862A1

公开(公告)日：2014-09-18

申请号：US14199563

申请日：2014-03-06

Applicant: Applied Materials, Inc.

Inventor： JOSEPH M. RANISH

IPC: H01J37/24 ,  H01J37/32

CPC classification number: H01K1/16 ,  H01K1/40 ,  H01K1/66 ,  H01L21/67115 ,  H05B3/0038 ,  H05B3/0047

Abstract: Embodiments of the present invention generally relate to simplified, high voltage, tungsten halogen lamps for use as source of heat radiation in a rapid thermal processing (RTP) chamber or other lamp heated thermal processing chambers. Embodiments include a lamp design that includes an external fuse while reducing the number of part and expense of prior art lamps. In addition, embodiments of the lamps described herein provide sufficient rigidity to handle compressive forces of inserting the lamps into a heating assembly base, while maintaining a simplified fuse design.

Abstract translation: 本发明的实施例通常涉及用于在快速热处理（RTP）室或其他灯加热的热处理室中用作热辐射源的简化的高电压钨卤素灯。 实施例包括灯设计，其包括外部保险丝，同时减少现有技术灯的部件数量和费用。 此外，本文所述的灯的实施例提供足够的刚度来处理将灯插入加热组件基座中的压缩力，同时保持简化的熔断器设计。

公开(公告)号：US20140241707A1

公开(公告)日：2014-08-28

申请号：US13778991

申请日：2013-02-27

Applicant: APPLIED MATERIALS, INC.

Inventor： JOSEPH JOHNSON ,  JOSEPH M. RANISH

IPC: H01L21/67 ,  H01L33/08

CPC classification number: H01L25/0753 ,  H01L33/60 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber, and methods of fabricated said apparatus, are provided herein. The apparatus may include a substrate having a plurality of electrical terminals disposed on one or more surfaces of the substrate, a plurality of solid state sources grown on top of the plurality of electrical terminals, the plurality of solid state sources providing pulsed or continuous energy when electrically powered, and one or more cooling channels formed in one or more areas of the substrate.

Abstract translation: 在处理室中提供脉冲或连续能量的装置，以及制造的所述装置的方法。 该装置可以包括具有设置在基板的一个或多个表面上的多个电端子的基板，在多个电端子的顶部上生长的多个固态源，多个固态源提供脉冲或连续的能量，当 电动的，以及形成在衬底的一个或多个区域中的一个或多个冷却通道。