公开(公告)号：US20220270923A1

公开(公告)日：2022-08-25

申请号：US17742962

申请日：2022-05-12

Applicant: Applied Materials, Inc.

Inventor： Paul McHugh ,  Kwan Wook Roh ,  Gregory J. Wilson

IPC: H01L21/768 ,  H01L21/288 ,  G06F30/394

Abstract: Exemplary methods of producing a semiconductor substrate may include plating a metal within a plurality of vias on the semiconductor substrate. A target average fill thickness of the metal within the plurality of vias may be between about a thickness equal to an average via radius of the plurality of vias and a thickness twice the average via radius of the plurality of vias. At least one via of the plurality of vias may be filled to a height below the target average fill thickness of the metal. The methods may include heating the metal to cause reflow of the metal within each via of the plurality of vias. The reflow may adjust the metal within the at least one via to increase in height towards the target average fill thickness.

公开(公告)号：US20230313406A1

公开(公告)日：2023-10-05

申请号：US18130004

申请日：2023-04-03

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Forrest G. Reinhart ,  Gregory J. Wilson ,  Kwan Wook Roh ,  Kyle M. Hanson ,  James E. Brown ,  David J. Reis

IPC: C25D17/00 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

CPC classification number: C25D17/002 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

Abstract: Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemical cell. The first compartment and second compartment may be separated by a membrane. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the membrane. The methods may include forming an anolyte and catholyte precursor.

公开(公告)号：US20230272547A1

公开(公告)日：2023-08-31

申请号：US18304200

申请日：2023-04-20

Applicant: Applied Materials, Inc.

Inventor： Jing Xu ,  John L. Klocke ,  Marvin L. Bernt ,  Eric J. Bergman ,  Kwan Wook Roh

IPC: C25D3/38 ,  C25D5/54 ,  C25D5/02 ,  H01L21/288 ,  C23C14/18 ,  H01L21/28 ,  H01L21/768 ,  C23C16/455

CPC classification number: C25D3/38 ,  C25D5/54 ,  C25D5/02 ,  H01L21/2885 ,  C23C14/18 ,  H01L21/28114 ,  H01L21/76873 ,  C23C16/45525

Abstract: Exemplary methods of electroplating include contacting a patterned substrate with a plating bath in an electroplating chamber, where the pattern substrate includes at least one opening having a bottom surface and one or more sidewall surfaces. The methods may further include forming a nanotwin-containing metal material in the at least one opening. The metal material may be formed by two or more cycles that include delivering a forward current from a power supply through the plating bath of the electroplating chamber for a first period of time, plating a first amount of the metal on the bottom surface of the opening on the patterned substrate and a second amount of the metal on the sidewall surfaces of the opening, and delivering a reverse current from the power supply through the plating bath of the electroplating chamber to remove some of the metal plated in the opening on the patterned substrate.

公开(公告)号：US11686005B1

公开(公告)日：2023-06-27

申请号：US17587063

申请日：2022-01-28

Applicant: Applied Materials, Inc.

Inventor： Kwan Wook Roh ,  Charles Sharbono ,  Kyle M. Hanson

IPC: C25D3/38 ,  C25D7/12 ,  C25D21/14 ,  C25D17/00

CPC classification number: C25D3/38 ,  C25D7/12 ,  C25D17/001 ,  C25D17/002 ,  C25D21/14

Abstract: Electroplating methods and systems are described that include adding a metal-ion-containing starting solution to a catholyte to increase a metal ion concentration in the catholyte to a first metal ion concentration. The methods and systems further include measuring the metal ion concentration in the catholyte while the metal ions electroplate onto a substrate and the catholyte reaches a second metal ion concentration that is less than the first metal ion concentration. The methods and systems additionally include adding a portion of an anolyte directly to the catholyte when the catholyte reaches the second metal ion concentration. The addition of the portion of the anolyte increases the metal ion concentration in the catholyte to a third metal ion concentration that is greater than or about the first metal ion concentration.

公开(公告)号：US11634830B2

公开(公告)日：2023-04-25

申请号：US17411305

申请日：2021-08-25

Applicant: Applied Materials, Inc.

Inventor： Jing Xu ,  John L. Klocke ,  Marvin L. Bernt ,  Eric J. Bergman ,  Kwan Wook Roh

IPC: C25D3/38 ,  C25D5/02 ,  C25D5/54 ,  H01L21/288 ,  C23C14/18 ,  H01L21/28 ,  H01L21/768 ,  C23C16/455

Abstract: Exemplary methods of electroplating include contacting a patterned substrate with a plating bath in an electroplating chamber, where the pattern substrate includes at least one opening having a bottom surface and one or more sidewall surfaces. The methods may further include forming a nanotwin-containing metal material in the at least one opening. The metal material may be formed by two or more cycles that include delivering a forward current from a power supply through the plating bath of the electroplating chamber for a first period of time, plating a first amount of the metal on the bottom surface of the opening on the patterned substrate and a second amount of the metal on the sidewall surfaces of the opening, and delivering a reverse current from the power supply through the plating bath of the electroplating chamber to remove some of the metal plated in the opening on the patterned substrate.