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公开(公告)号：US20080186124A1
公开(公告)日：2008-08-07
申请号：US11985156
申请日：2007-11-13
CPC分类号： H01F27/2895 , H01F17/0033
摘要： A wire-less inductive device and methods of manufacturing and use are disclosed. In one embodiment, the inductive device comprises a plurality of through-hole vias which act to replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a plurality of connection elements disposed or formed within channels which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices is disclosed. In a third aspect of the invention, an electronics assembly and circuit comprising the wire-less inductive devices are disclosed.
摘要翻译： 公开了一种无线感应装置及其制造和使用方法。 在一个实施例中，感应装置包括多个通孔，其用于替代围绕磁导芯的绕组。 在另一个实施例中，感应装置包括设置或形成在通道内的多个连接元件，其作为围绕磁导芯的绕组。 在本发明的第二方面，公开了一种制造上述电感器件的方法。 在本发明的第三方面中，公开了一种包括无线感应装置的电子组件和电路。
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公开(公告)号：US20080220657A1
公开(公告)日：2008-09-11
申请号：US12074131
申请日：2008-02-28
CPC分类号： H01R13/64 , H01R13/6456 , Y10T29/4921
摘要： Connector apparatus and methods providing for “keep-out” functionality against improperly sized plugs or inserts are disclosed. In one embodiment the invention discloses a connector assembly incorporating an integrated keep-out feature associated with the housing. In one variant, the connector assembly comprises a modular jack connector, and the keep-out feature(s) is/are formed substantially within one or more the sidewall(s) of the housing, thereby simplifying its assembly and reducing its cost, as well as conserving on connector interior space. In another embodiment, the keep-out feature comprises an element disposed substantially within a plane parallel to the front face of the connector. Methods for manufacturing and using connectors with integrated keep-out features are also disclosed.
摘要翻译： 公开了针对不正确尺寸的插头或插入件提供“保持”功能的连接器装置和方法。 在一个实施例中，本发明公开了一种连接器组件，其包括与壳体相关联的集成的保留功能。 在一个变型中，连接器组件包括模块化插座连接器，并且保持部件基本上形成在壳体的一个或多个侧壁内，从而简化其组装并降低其成本，如 以及节省连接器内部空间。 在另一个实施例中，保持特征包括基本上设置在平行于连接器前表面的平面内的元件。 还公开了具有集成保护功能的连接器的制造和使用方法。
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13.发明授权Semiconductor device module with flip chip devices on a common lead frame 有权半导体器件模块，带有倒装芯片器件的公共引线框架公开(公告)号：US07301235B2
公开(公告)日：2007-11-27
申请号：US11144169
申请日：2005-06-03
申请人： Christopher P. Schaffer , Chuan Cheah , Kevin Hu
发明人： Christopher P. Schaffer , Chuan Cheah , Kevin Hu
IPC分类号： H01L23/34
CPC分类号： H01L25/162 , H01L23/5385 , H01L24/01 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： The semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing. The plurality of flip chip devices are connected to each other without wire bonding. The common housing includes a packaging structure, the packaging structure including a connective portion and at least one web portion, which aids in the thermal management of the heat emitted by the plurality of flip chip devices and which connects the flip chip devices to each other. Passive devices in the circuit may also be arranged in a planar fashion in the common housing.
摘要翻译： 电路的半导体部分包括在共同的壳体中以平面方式布置的多个倒装芯片器件。 多个倒装芯片器件彼此连接而不引线接合。 公共壳体包括包装结构，该包装结构包括连接部分和至少一个卷筒纸部分，其有助于热管理由多个倒装芯片装置发出的热量，并将倒装芯片装置彼此连接。 电路中的无源器件也可以以平面方式布置在公共壳体中。
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公开(公告)号：US06946740B2
公开(公告)日：2005-09-20
申请号：US10620029
申请日：2003-07-14
CPC分类号： H01L25/072 , H01L24/37 , H01L24/40 , H01L2224/0401 , H01L2224/06181 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/371 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2224/40139 , H01L2224/40247 , H01L2224/73253 , H01L2224/73263 , H01L2224/83801 , H01L2224/8385 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A multi-chip module that includes a conductive element to serve as an electrical connector for electrically connecting respective electrical contacts of at least two power semiconductor devices and serving as an output connector. The conductive element improving heat transfer from the power semiconductor devices through the top of the module.
摘要翻译： 一种多芯片模块，其包括导电元件，用作电连接器，用于电连接至少两个功率半导体器件的各个电触点并用作输出连接器。 导电元件改善了功率半导体器件通过模块顶部的热传递。
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15.发明授权Microelectronic device structure with metallic interlayer between substrate and die 有权微电子器件结构，在基片和裸片之间具有金属中间层公开(公告)号：US06534792B1
公开(公告)日：2003-03-18
申请号：US09573249
申请日：2000-05-18
IPC分类号： H01L23373
CPC分类号： H01L24/32 , H01L23/3732 , H01L24/48 , H01L2224/05599 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01327 , H01L2924/3011 , H01L2924/351 , H01L2924/3512 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic device structure includes a diamond-containing substrate, and a metallic interlayer affixed to the diamond. The interlayer is made of a metal such as copper, silver, or gold, has a thickness of from about 0.003 inch to about 0.009 inch, and has an upper surface. A microelectronic device die is affixed to the upper surface of the metallic interlayer. The material of construction and thickness of the metallic interlayer are selected such that a coefficient of thermal expansion at the upper surface of the metallic interlayer is greater than a coefficient of thermal expansion of the die of the microelectronic device by up to about 3 parts per million per degree Centigrade.
摘要翻译： 微电子器件结构包括含金刚石的衬底和贴在金刚石上的金属夹层。 中间层由诸如铜，银或金的金属制成，具有约0.003英寸至约0.009英寸的厚度，并且具有上表面。 微电子器件裸片固定到金属中间层的上表面。 选择金属中间层的结构材料和厚度，使得金属中间层上表面的热膨胀系数大于微电子器件的管芯的热膨胀系数高达约百万分之3 每摄氏度。
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公开(公告)号：US20120011709A1
公开(公告)日：2012-01-19
申请号：US13185312
申请日：2011-07-18
IPC分类号： H01F41/02
CPC分类号： H01F17/0033 , H01F17/062 , H01F27/40 , H01F41/046 , H05K1/165 , Y10T29/4902
摘要： Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
摘要翻译： 用于提供低成本和高精度感应装置的方法和装置。 在一个实施例中，感应装置包括具有延伸端的多个通孔，其替代设置在磁导芯周围的绕组。 在另一个实施例中，感应装置包括有线中心芯以及具有延伸端的多个通孔，其作为围绕磁导芯的绕组。 在本发明的第二方面，公开了一种制造上述感应装置以及有线核心中心的方法。
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17.发明授权公开(公告)号：US07745257B2
公开(公告)日：2010-06-29
申请号：US12246001
申请日：2008-10-06
CPC分类号： H01L21/56 , H01L21/566 , H01L21/568 , H01L23/3675 , H01L25/165 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： A structure and a manufacturing method providing improved coplanarity accommodation and heat dissipation in a multi-chip module. One of the components in a multi-chip module (MCM) is provided with a recess formed in its respective top surface; and a film is applied so as to cover the top surfaces of the components and so that any excess film can enter into the recess. The recess is preferably a peripheral groove. Then when molding material is injected, it may surround and seal the side surfaces of the components, while not substantially covering the top surfaces that are covered by the film. Since the recess receives any excess film material that may be present, it may prevent such excess film material from covering the respective side surfaces of the corresponding component and creating a void between the component and the molding material. This advantageous effect of the invention is particularly useful when the top component surface in which the recess is formed is higher above the circuit substrate than the respective top surface of another one of the components.
摘要翻译： 一种在多芯片模块中提供改善的共平面调节和散热的结构和制造方法。 多芯片模块（MCM）中的一个部件设置有形成在其各自顶表面上的凹部; 并且施加膜以覆盖部件的顶表面，并且使得任何多余的膜可以进入凹部。 凹部优选为周边槽。 然后当模制材料被注入时，它可以围绕和密封部件的侧表面，而基本上不覆盖被膜覆盖的顶表面。 由于凹部容纳可能存在的多余的薄膜材料，因此可以防止这种多余的薄膜材料覆盖相应的部件的各个侧表面，并在组件和模制材料之间产生空隙。 当形成凹部的顶部部件表面比另一个部件的相应顶部表面高于电路基板时，本发明的这种有益效果是特别有用的。
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公开(公告)号：US08234778B2
公开(公告)日：2012-08-07
申请号：US13185312
申请日：2011-07-18
CPC分类号： H01F17/0033 , H01F17/062 , H01F27/40 , H01F41/046 , H05K1/165 , Y10T29/4902
摘要： Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
摘要翻译： 用于提供低成本和高精度感应装置的方法和装置。 在一个实施例中，感应装置包括具有延伸端的多个通孔，其替代设置在磁导芯周围的绕组。 在另一个实施例中，感应装置包括有线中心芯以及具有延伸端的多个通孔，其作为围绕磁导芯的绕组。 在本发明的第二方面，公开了一种制造上述感应装置以及有线核心中心的方法。
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公开(公告)号：US08118619B2
公开(公告)日：2012-02-21
申请号：US12961359
申请日：2010-12-06
IPC分类号： H01R24/00
CPC分类号： H01R13/6658 , H01R12/716 , H01R13/514 , Y10T29/49826 , Y10T307/406
摘要： An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a multi-port modular jack, and incorporates a PSE controller board disposed in the rear portion of the connector assembly, e.g., outside the connector housing. The PSE controller board controls the power to a powered device and may be adapted to, for example, distinguish whether the device is a short circuit or a network interface card, guarantee the supply of power to selected ports, and prevent cables from transmitting abnormal power. Heat removal features are also optionally utilized to effectively dissipate heat produced by the electronic or signal conditioning components utilized on said multi-port modular jack. In some embodiments, the PSE controller board is also optionally made removable from the jack housing.
摘要翻译： 一个先进的连接器组件，能够接收和分配电源信号。 在一个实施例中，连接器包括多端口模块插座，并且包括设置在连接器组件的后部中的PSE控制器板，例如在连接器外壳的外部。 PSE控制器板控制供电设备的电源，并且可以适应于例如区分设备是短路还是网络接口卡，保证所选端口的供电，防止电缆发送异常电源 。 还可选地使用热去除特征来有效地消散由所述多端口模块化插座上使用的电子或信号调理部件产生的热量。 在一些实施例中，PSE控制器板也可任选地从插座外壳移除。
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公开(公告)号：US20110074213A1
公开(公告)日：2011-03-31
申请号：US12961359
申请日：2010-12-06
IPC分类号： H02J1/00
CPC分类号： H01R13/6658 , H01R12/716 , H01R13/514 , Y10T29/49826 , Y10T307/406
摘要： An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a multi-port modular jack, and incorporates a PSE controller board disposed in the rear portion of the connector assembly, e.g., outside the connector housing. The PSE controller board controls the power to a powered device and. may be adapted to, for example, distinguish whether the device is a short circuit or a network interface card, guarantee the supply of power to selected ports, and prevent cables from transmitting abnormal power. Heat removal features are also optionally utilized to effectively dissipate heat produced by the electronic or signal conditioning components utilized on said multi-port modular jack. In some embodiments, the PSE controller board is also optionally made removable from the jack housing.
摘要翻译： 一个先进的连接器组件，能够接收和分配电源信号。 在一个实施例中，连接器包括多端口模块插座，并且包括设置在连接器组件的后部中的PSE控制器板，例如在连接器外壳的外部。 PSE控制器板控制供电设备的电源。 可以适应于例如区分设备是短路还是网络接口卡，保证向所选端口供电，并防止电缆发送异常电源。 还可选地使用热去除特征来有效地消散由所述多端口模块化插座上使用的电子或信号调理部件产生的热量。 在一些实施例中，PSE控制器板也可任选地从插座外壳移除。
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