摘要:
An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
摘要:
Traditionally, pipelined continuous-time (CT) sigma-delta modulators (SDM) have been difficult to build due at least in part to the difficulties in calibrating the pipeline. Here, however, a pipelined CT SDM is provided that has an architecture that is conducing to being calibrated. Namely, the system includes a digital filter and other features that can be adjusted to account for input imbalance errors and well as quantization leakage noise.
摘要:
An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
摘要:
A method for determining the location of an object on a touch panel is provided. Initially, a pulse of terahertz radiation is transmitted through a touch panel, which formed of a dielectric material such that the pulse generates a evanescent field in a region adjacent to a touch surface of the touch panel. A reflected pulse is generated by an object located within the region adjacent to the touch surface of the touch panel, and a position of the object on the touch surface of the touch panel is triangulated at least in part from the reflected pulse.
摘要:
Traditionally, pipelined continuous-time (CT) sigma-delta modulators (SDM) have been difficult to build due at least in part to the difficulties in calibrating the pipeline. Here, however, a pipelined CT SDM is provided that has an architecture that is conducing to being calibrated. Namely, the system includes a digital filter and other features that can be adjusted to account for input imbalance errors and well as quantization leakage noise.
摘要:
A method for determining the position of a target is provided. Several emitted pulses of terahertz radiations are emitted from a phased array (which has several transceivers) in consecutive cycles (typically). These emitted pulses are generally configured to be reflected by a target so as to be received by the phased array within a scan range (which includes a digitization window with several sampling periods). Output signals from each of the transceivers are then combined to generate a combined signal for each cycle. The combined signal in each sampling period within the digitization window for emitted pulses is averaged to generate an averaged signal for each sampling period within the digitization window. These averaged signals are then digitized.
摘要:
At very high frequencies, generally above 100 GHz, the performance of traditional radio frequency (RF) circuitry begins to significantly limit performance. An example is the hybrid coupler, which can have a relatively narrow 90° bandwidth in these frequency ranges. Here, however, a branch-line hybrid coupler (which has been integrated into a quadrature downconversion mixer) has been modified. Namely, an adjustable impedance network has been coupled to isolation port (which has traditionally been terminated) to substantially increase the tuning range and expand the bandwidth of the quadrature mixer within these very high frequency ranges.
摘要:
One aspect of the invention provides a semiconductor device that includes a microchip having an outermost surface. First and second bond pads are located on the microchip and near the outermost surface. A first UBM contact is located on the outermost surface and between the first and second bond pads. The first UBM contact is offset from the first bond pad. A second UBM contact is located on the outermost surface and between the first and second bond pads. The second UBM contact is offset from the second bond pad, and a capacitor supported by the microchip is located between the first and second UBM contacts.
摘要:
An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation.
摘要:
An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation.