公开(公告)号：US20230209767A1

公开(公告)日：2023-06-29

申请号：US18178686

申请日：2023-03-06

Applicant: Cisco Technology, Inc.

Inventor： M. Baris Dogruoz ,  Mark Nowell ,  Yi Tang ,  Rakesh Chopra ,  Mandy Hin Lam

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20236 ,  H05K1/0203 ,  H05K1/0272 ,  H05K7/20627 ,  H05K7/2089 ,  H05K2201/064 ,  H05K7/20636

Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

公开(公告)号：US11357132B2

公开(公告)日：2022-06-07

申请号：US16922177

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC: H05K7/20 ,  H05K7/14 ,  G02B6/42 ,  H01R13/518

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

公开(公告)号：US11191185B2

公开(公告)日：2021-11-30

申请号：US16749254

申请日：2020-01-22

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rakesh Chopra ,  Mandy Hin Lam ,  M. Baris Dogruoz ,  Joel Richard Goergen

IPC: H05K7/20

Abstract: In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.

公开(公告)号：US20210231890A1

公开(公告)日：2021-07-29

申请号：US16922383

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC: G02B6/42 ,  H01R13/518

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

公开(公告)号：US10659234B2

公开(公告)日：2020-05-19

申请号：US15386120

申请日：2016-12-21

Applicant: Cisco Technology, Inc.

Inventor： Kannan Varadhan ,  Chirag Shroff ,  Rakesh Chopra

IPC: G06F21/12 ,  G06F21/44 ,  G06F8/61 ,  G06F8/65 ,  H04L9/32 ,  H04L29/06 ,  H04L9/14 ,  H04L9/30

Abstract: In one embodiment, a computing device receives an image that has been signed with a first key, wherein the image includes a first computational value associated with it. A second computational value associated with the image is determined and the image is signed with a second key to produce a signed image that includes both the first and second computational values. Prior to loading the dual-signed image, the computing device attempts to authenticate the dual-signed image using both the first and second computational values, and, if successful, loads and installs the dual-signed image.

公开(公告)号：US09252902B2

公开(公告)日：2016-02-02

申请号：US14672961

申请日：2015-03-30

Applicant: Cisco Technology, Inc.

Inventor： John T. Chapman ,  Rakesh Chopra ,  Laurent Montini ,  Michael Overcash

IPC: H04J3/06 ,  H04J13/16 ,  H04L12/28 ,  H04L7/033 ,  H04L1/00 ,  H04L7/04

CPC classification number: H04J3/0661 ,  H04J3/0667 ,  H04J3/0682 ,  H04J3/0688 ,  H04J13/16 ,  H04L1/004 ,  H04L7/033 ,  H04L7/048 ,  H04L12/2801

Abstract: An accurate non-Data Over Cable Service Interface Specification (non-DOCSIS) clock signal is generated at the downstream output of a DOCSIS network. In one example method, a downstream DOCSIS Timing Protocol (DTP) client in the DOCSIS network is frequency synchronized to an upstream DTP server in the DOCSIS network. DOCSIS timing information, along with one or more timing correction factors received at the DTP client, is used to time synchronize the DTP client to the DTP server. Based on the time and frequency synchronization between the DTP server and the DTP client, the clock signal is generated at the output of the DTP client in accordance with the non-DOCSIS timing protocol.

公开(公告)号：US20150131798A1

公开(公告)日：2015-05-14

申请号：US14594477

申请日：2015-01-12

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Chopra

IPC: H04L9/32 ,  H04L12/46 ,  H04W12/08 ,  H04L12/723

CPC classification number: H04L9/32 ,  H04L12/462 ,  H04L12/4641 ,  H04L12/4645 ,  H04L45/50 ,  H04L63/0428 ,  H04L63/08 ,  H04L63/162 ,  H04L2209/80 ,  H04W12/08

Abstract: Techniques are provided to append packet handling information “in the clear” ahead of security related information in a packet to be routed over a network to optimize wide area network deployments of security-configured equipment. In one form, at a network device that performs connectionless secure communication and network routing of packets, data is received from a source device to be sent through a network to a destination device. Packet handling information is inserted in a packet that is to be used to transport the data. The packet handling information is configured to enable controlled handling of the packet in the network and is inserted in an unprotected portion of the packet. Encrypted payload data is generated from the data received from the source device. The encrypted payload data and security information are inserted in a protected portion of the packet and the packet is sent to the network.

Abstract translation: 提供技术以将数据包处理信息“在清晰的”中提前，以便在要通过网络路由的分组中的安全相关信息之前，以优化安全配置设备的广域网部署。 在一种形式中，在执行无连接安全通信和分组的网络路由的网络设备处，从源设备接收数据以通过网络发送到目的地设备。 分组处理信息被插入到用于传输数据的分组中。 分组处理信息被配置为使得能够对网络中的分组进行受控处理，并且被插入到分组的未受保护的部分中。 从源设备接收的数据生成加密的有效载荷数据。 加密的有效载荷数据和安全信息被插入到分组的受保护部分中，并且分组被发送到网络。

公开(公告)号：US12200906B2

公开(公告)日：2025-01-14

申请号：US17503875

申请日：2021-10-18

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Chopra ,  Mandy Hin Lam ,  M. Baris Dogruoz ,  Joel Richard Goergen

IPC: H05K7/20

Abstract: A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.

公开(公告)号：US11935796B2

公开(公告)日：2024-03-19

申请号：US17301058

申请日：2021-03-23

Applicant: Cisco Technology, Inc.

Inventor： Mark A. Gustlin ,  Rakesh Chopra

IPC: H01L21/66 ,  H01L23/473

CPC classification number: H01L22/12 ,  H01L23/473

Abstract: Techniques for temperature control for multiple dies in an element. A temperature of a first die is measured, in an element comprising the first die and a second die. The second die includes at least a portion of a controller. The temperature of the first die is changed by adjusting activity, from the second die to the first die, based on a target temperature for the first die and the measured temperature for the first die.

公开(公告)号：US11917793B2

公开(公告)日：2024-02-27

申请号：US17145816

申请日：2021-01-11

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mark Nowell ,  M. Baris Dogruoz ,  Mandy Hin Lam ,  Rakesh Chopra

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/44

CPC classification number: H05K7/20236 ,  G06F1/20 ,  H01L23/44

Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.