公开(公告)号：US20240424778A1

公开(公告)日：2024-12-26

申请号：US18821813

申请日：2024-08-30

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey SANG ,  Dalip K. KOHLI

IPC: B32B27/38 ,  B29C37/00 ,  B29C70/00 ,  B29C70/30 ,  B29K63/00 ,  B29K101/12 ,  B29K509/02 ,  B32B9/00 ,  B32B15/092 ,  B32B27/20

Abstract: A surfacing material that is capable of ultraviolet (UV) protection and self-releasing from a mold surface. The surfacing material is a multilayer structure composed of a curable resin layer laminated to a self-releasing layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. After co-curing, the composite part surfaced with the surfacing material is releasable from the mold surface with ease. The self-releasing layer functions as a UV blocking layer until the cured composite substrate is ready for painting. When the self-releasing layer removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.

公开(公告)号：US20210008855A1

公开(公告)日：2021-01-14

申请号：US16485303

申请日：2018-12-20

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey SANG ,  Dalip K. KOHLI

IPC: B32B27/12 ,  B32B5/02 ,  B32B7/06 ,  B32B15/02 ,  B32B15/092 ,  B32B27/38 ,  B32B27/18 ,  B32B38/18 ,  B32B5/26

Abstract: A surfacing material that is capable of ultraviolet (UV) protection. The surfacing material is a multilayer structure composed of a woven peel ply fabric interposed between a first curable resin layer and a second curable resin layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. Upon curing, the peel ply fabric combined with the outer thermoset layer function as a UV protective layer. When the peel ply fabric and the outer thermoset layer are removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.

公开(公告)号：US20200307162A1

公开(公告)日：2020-10-01

申请号：US16832313

申请日：2020-03-27

Applicant: Cytec Industries Inc.

Inventor： Bérénice REMY ,  Junjie Jeffrey SANG ,  Samuel J. HILL ,  Carmelo Luca RESTUCCIA

IPC: B32B15/14 ,  B32B5/02 ,  B32B3/10 ,  B32B15/02 ,  B32B7/14 ,  B32B5/26 ,  B32B27/12 ,  B32B27/38

Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.

公开(公告)号：US20180346146A1

公开(公告)日：2018-12-06

申请号：US15778035

申请日：2016-11-29

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey SANG ,  Dalip Kumar KOHLI ,  Kevin R. MULLERY

IPC: B64D45/02 ,  B32B15/08 ,  B32B27/10 ,  B32B27/12 ,  B32B5/02 ,  B32B9/00 ,  B32B9/04 ,  B64C1/12 ,  B64C3/20

CPC classification number: B32B3/12 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/18 ,  B32B5/245 ,  B32B5/26 ,  B32B7/12 ,  B32B9/007 ,  B32B9/045 ,  B32B9/047 ,  B32B15/08 ,  B32B15/088 ,  B32B15/09 ,  B32B15/14 ,  B32B15/20 ,  B32B21/08 ,  B32B21/10 ,  B32B27/065 ,  B32B27/10 ,  B32B27/12 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/34 ,  B32B27/36 ,  B32B29/02 ,  B32B2255/02 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/107 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/4026 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2307/7265 ,  B32B2307/732 ,  B32B2571/00 ,  B32B2605/18

Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.