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公开(公告)号：US20220102957A1
公开(公告)日：2022-03-31
申请号：US17381496
申请日：2021-07-21
Applicant: CYTEC INDUSTRIES INC.
Inventor： Junjie Jeffrey SANG , Fiorenzo LENZI , Jonathan Edward MEEGAN , Leonard MACADAMS , Yiqiang ZHAO , Dalip Kumar KOHLI
IPC: H02G13/00 , B32B15/14 , B64D45/02 , B32B3/14 , B32B27/08 , B32B5/02 , B32B5/26 , B32B27/18 , B32B15/08 , B32B3/26 , B32B27/28 , B32B27/26 , B32B27/38 , B32B15/092 , B32B15/20 , C08G59/18
Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.
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公开(公告)号：US20210253270A1
公开(公告)日：2021-08-19
申请号：US17306581
申请日：2021-05-03
Applicant: CYTEC INDUSTRIES INC.
Inventor： Junjie Jeffrey SANG , Dalip Kumar KOHLI , Kevin R. MULLERY
IPC: B64D45/02 , B32B5/02 , B32B9/00 , B32B9/04 , B32B15/08 , B32B15/20 , B32B27/10 , B32B27/12 , B32B27/36 , B32B15/09 , B32B7/12 , B32B27/20 , B32B27/28 , B32B21/08 , B32B5/26 , B32B15/088 , B32B27/18 , B32B29/02 , B32B5/24 , B32B3/26 , B32B5/18 , B32B27/34 , B32B27/06 , B32B15/14 , B32B3/12 , B32B21/10 , B32B27/26 , B64C1/12 , B64C3/20
Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.
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公开(公告)号：US20140154496A1
公开(公告)日：2014-06-05
申请号：US14089962
申请日：2013-11-26
Applicant: Cytec Industries Inc.
Inventor： Junjie Jeffrey SANG , Dalip Kumar KOHLI
CPC classification number: H02G13/80 , B32B5/022 , B32B5/12 , B32B5/26 , B32B15/14 , B32B15/20 , B32B37/14 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2264/105 , B32B2264/107 , B32B2264/108 , B32B2305/076 , B32B2307/202 , B32B2307/536 , B32B2605/08 , B32B2605/12 , B32B2605/18 , C08G59/38 , C08J5/24 , C08K7/18 , C08L63/00 , C08L2205/02 , C09D163/00 , H05K9/0084 , Y10T156/1002 , Y10T428/249974 , Y10T428/252
Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.
Abstract translation: 公开了能够为雷击保护（LSP）和/或电磁干扰（EMI）屏蔽提供足够导电性的导电表面材料。 导电表面材料是具有非常薄的导电层（例如固体金属箔）和形成在导电层的至少一个表面上的树脂膜的多层结构。 树脂膜由含有环氧酚醛清漆树脂，三官能或四官能环氧树脂，陶瓷微球，潜胺类固化剂，颗粒状无机填料的固化性树脂组合物形成。 和增韧部件。 任选地，树脂膜还包括导电添加剂以增加表面材料的导电性。 树脂薄膜具有高Tg，耐剥离剂溶液性能高。 此外，导电性表面材料适用于与纤维增强树脂复合基材共固化。
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公开(公告)号：US20180346146A1
公开(公告)日：2018-12-06
申请号：US15778035
申请日：2016-11-29
Applicant: CYTEC INDUSTRIES INC.
Inventor： Junjie Jeffrey SANG , Dalip Kumar KOHLI , Kevin R. MULLERY
IPC: B64D45/02 , B32B15/08 , B32B27/10 , B32B27/12 , B32B5/02 , B32B9/00 , B32B9/04 , B64C1/12 , B64C3/20
CPC classification number: B32B3/12 , B32B3/266 , B32B5/022 , B32B5/024 , B32B5/18 , B32B5/245 , B32B5/26 , B32B7/12 , B32B9/007 , B32B9/045 , B32B9/047 , B32B15/08 , B32B15/088 , B32B15/09 , B32B15/14 , B32B15/20 , B32B21/08 , B32B21/10 , B32B27/065 , B32B27/10 , B32B27/12 , B32B27/18 , B32B27/20 , B32B27/26 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/288 , B32B27/34 , B32B27/36 , B32B29/02 , B32B2255/02 , B32B2255/205 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/0261 , B32B2262/0276 , B32B2262/101 , B32B2262/106 , B32B2264/10 , B32B2264/102 , B32B2264/107 , B32B2264/108 , B32B2307/202 , B32B2307/4026 , B32B2307/54 , B32B2307/718 , B32B2307/7265 , B32B2307/732 , B32B2571/00 , B32B2605/18
Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.
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Patent Agency Ranking
公开(公告)号：US20180186124A1
公开(公告)日：2018-07-05
申请号：US15856997
申请日：2017-12-28
Applicant: Cytec Industries Inc.
Inventor： Yiqiang ZHAO , Dalip Kumar KOHLI
IPC: B32B15/092 , B32B27/38 , C08K3/04 , C09D163/00
Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, at least one curing agent, a silane compound, a low amount of a carbon-based material in particulate form, and optional additives. The carbon-based material is selected from graphene, graphene oxide (GO), graphite, carbon with various structures in micron-scale or nanoscale size, and combination thereof.
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公开(公告)号：US20210122088A1
公开(公告)日：2021-04-29
申请号：US17135135
申请日：2020-12-28
Applicant: CYTEC INDUSTRIES INC.
Inventor： Junjie Jeffrey SANG , Dalip Kumar KOHLI
IPC: B29C33/56 , B32B5/02 , B32B5/26 , B32B15/02 , B32B15/092 , B32B15/20 , B32B27/20 , B32B27/26 , B32B27/28 , B32B27/30 , B32B27/34 , B32B27/38 , B32B27/18 , B32B15/08 , B32B5/22 , B32B5/24
Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.
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公开(公告)号：US20190027913A1
公开(公告)日：2019-01-24
申请号：US16067407
申请日：2016-12-29
Applicant: CYTEC INDUSTRIES INC.
Inventor： Junjie Jeffrey SANG , Fiorenzo LENZI , Jonathan Edward MEEGAN , Leonard MACADAMS , Yiqiang ZHAO , Dalip Kumar KOHLI
Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.
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公开(公告)号：US20180370083A1
公开(公告)日：2018-12-27
申请号：US16065160
申请日：2016-12-21
Applicant: CYTEC INDUSTRIES INC.
Inventor： Junjie Jeffrey SANG , Dalip Kumar KOHLI
IPC: B29C33/56 , B32B5/02 , B32B15/02 , B32B15/092 , B32B15/20 , B32B27/20 , B32B27/26 , B32B27/28 , B32B27/30 , B32B27/34 , B32B27/38 , B32B5/26
Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively elimiate the need for mold release agents and mold surface preparation.
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公开(公告)号：US20170179706A1
公开(公告)日：2017-06-22
申请号：US15446243
申请日：2017-03-01
Applicant: CYTEC INDUSTRIES INC.
Inventor： Junjie Jeffrey SANG , Dalip Kumar KOHLI
CPC classification number: H02G13/80 , B32B5/022 , B32B5/12 , B32B5/26 , B32B15/14 , B32B15/20 , B32B37/14 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2264/105 , B32B2264/107 , B32B2264/108 , B32B2305/076 , B32B2307/202 , B32B2307/536 , B32B2605/08 , B32B2605/12 , B32B2605/18 , C08G59/38 , C08J5/24 , C08K7/18 , C08L63/00 , C08L2205/02 , C09D163/00 , H05K9/0084 , Y10T156/1002 , Y10T428/249974 , Y10T428/252
Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.
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