Avalanche photo-detector with high saturation power and high gain-bandwidth product
    12.
    发明授权
    Avalanche photo-detector with high saturation power and high gain-bandwidth product 失效
    具有高饱和功率和高增益带宽产品的雪崩光电检测器

    公开(公告)号:US06963089B2

    公开(公告)日:2005-11-08

    申请号:US10720117

    申请日:2003-11-25

    CPC classification number: B82Y10/00 H01L31/107

    Abstract: An avalanche photo-detector (APD) is disclosed, which can reduce device capacitance, operating voltage, carrier transport time and dark current as well as increasing response speed and output power. Thus, an avalanche photo-detector (APD) with high saturation power, high gain-bandwidth product, low noise, fast response, low dark current is achieved. The APD includes an absorption layer with graded doping for converting an incident light into carriers, an undoped multiplication layer for multiplying current by means of receiving carriers, a doped field buffer layer sandwiched between the absorption layer and the multiplication layer for concentrating an electric field in the multiplication layer when a bias voltage is applied, and an undoped drift layer sandwiched between the absorption layer and the field buffer layer for capacitance reduction.

    Abstract translation: 公开了一种雪崩光电检测器(APD),可以降低器件电容,工作电压,载流子传输时间和暗电流以及响应速度和输出功率。 因此,实现了具有高饱和功率,高增益带宽乘积,低噪声,快速响应,低暗电流的雪崩光电检测器(APD)。 APD包括具有用于将入射光转换成载流子的渐变掺杂的吸收层,用于通过接收载流子来乘以电流的未掺杂乘法层,夹在吸收层和乘法层之间的掺杂场缓冲层,用于将电场集中 施加偏置电压时的倍增层和夹在吸收层和场缓冲层之间的未掺杂漂移层用于电容降低。

    Method for fabricating multiple thickness insulator layers
    14.
    发明授权
    Method for fabricating multiple thickness insulator layers 失效
    多层厚度绝缘体层的制造方法

    公开(公告)号:US06916674B2

    公开(公告)日:2005-07-12

    申请号:US10704632

    申请日:2003-11-12

    Abstract: The present invention discloses a method for fabricating multiple-thickness insulator layers via strain field generated by stress. The strain field is used for alternating a develop mechanism of insulator layers on the quantum dots. By forming the multiple-thickness insulator layers at various developing rates, not only leakage current is prevented, but also components are kept isolated in the nano-electronics components. In nano-electronics manufacturing, the method for fabricating multiple-thickness insulator layers results in both better product reliability and the yield rate. It is potential for integral circuit manufacturing.

    Abstract translation: 本发明公开了一种通过应力产生的应变场来制造多层绝缘体层的方法。 应变场用于交替量子点上的绝缘体层的显影机制。 通过以各种显影速率形成多层绝缘体层,不仅可以防止泄漏电流,还可以在纳米电子部件中保持隔离。 在纳米电子制造中,制造多层绝缘体层的方法产生更好的产品可靠性和产率。 它是集成电路制造的潜力。

    Method with mechanically strained silicon for enhancing speed of integrated circuits of devices
    19.
    发明申请
    Method with mechanically strained silicon for enhancing speed of integrated circuits of devices 有权
    具有机械应变硅的方法,用于提高器件集成电路的速度

    公开(公告)号:US20060099772A1

    公开(公告)日:2006-05-11

    申请号:US10982375

    申请日:2004-11-05

    CPC classification number: H01L21/7624 H01L21/823807 H01L29/7842 H01L29/786

    Abstract: A method with a mechanically strained silicon for enhancing the speeds of integrated circuits or devices is disclosed. The method with a mechanically strained silicon for enhancing the speeds of integrated circuits or devices includes the following steps: (a) providing a substrate, (b) fixing the substrate, (c) applying a stress upon the substrate, and (d) inducing a strain in one of a device and a circuit by stressing the substrate.

    Abstract translation: 公开了一种具有用于增强集成电路或装置的速度的机械应变硅的方法。 具有用于增强集成电路或器件的速度的机械应变硅的方法包括以下步骤:(a)提供衬底,(b)固定衬底,(c)在衬底上施加应力,以及(d)诱导 通过施加基板在器件和电路之一中的应变。

    Semiconductor phototransistor
    20.
    发明授权
    Semiconductor phototransistor 失效
    半导体光电晶体管

    公开(公告)号:US06759694B1

    公开(公告)日:2004-07-06

    申请号:US10718621

    申请日:2003-11-24

    CPC classification number: H01L31/1105 H01L31/0352

    Abstract: A phototransistor structure is disclosed. A sidewall is grown on the collector side and under the base. The surface of the sidewall is formed with a sidewall contact. When the contact is connected to an external voltage, the holes accumulated at the junction of the base and emitter can be quickly removed. This solves the problem in the prior art that using a bias between the base and the emitter to remove holes usually results in a large dark current (bias current), power consumption, and diminishing optoelectronic conversion gain.

    Abstract translation: 公开了一种光电晶体管结构。 侧壁在集电器侧和底部下生长。 侧壁的表面形成有侧壁接触。 当触点连接到外部电压时,可以快速去除在基极和发射极的结点处积累的空穴。 这解决了现有技术中使用基极和发射极之间的偏置来去除空穴的问题通常导致大的暗电流(偏置电流),功耗和光电转换增益的减小。

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