METHOD OF ENCAPSULATING AN ORGANIC LIGHT EMITTING DEVICE
    15.
    发明申请
    METHOD OF ENCAPSULATING AN ORGANIC LIGHT EMITTING DEVICE 失效
    封装有机发光器件的方法

    公开(公告)号:US20080038986A2

    公开(公告)日:2008-02-14

    申请号:US11239988

    申请日:2005-09-30

    CPC classification number: H01L51/5253

    Abstract: A method of forming an organic light emitting device on a substrate is provided, wherein the method includes forming an active device structure on the substrate, adhering a mask to the substrate, wherein the mask covers an electrical contact portion of the substrate while exposing the active device structure, forming an encapsulant layer over the active device structure and the mask, forming a separation between a portion of the encapsulant layer that covers the active device structure and a portion of the encapsulant layer that covers the mask, and removing the mask from the substrate.

    Abstract translation: 提供一种在衬底上形成有机发光器件的方法,其中该方法包括在衬底上形成有源器件结构,将掩模粘贴到衬底上,其中掩模覆盖衬底的电接触部分,同时暴露活性物质 在活性器件结构和掩模上形成密封剂层,在覆盖有源器件结构的封装剂层的一部分和覆盖掩模的封装剂层的一部分之间形成间隔, 基质。

    Vapor Phase Deposition System and Method
    16.
    发明申请
    Vapor Phase Deposition System and Method 审中-公开
    气相沉积系统及方法

    公开(公告)号:US20060275547A1

    公开(公告)日:2006-12-07

    申请号:US11421385

    申请日:2006-05-31

    Abstract: A system for depositing a vapor phase organic compound onto a substrate, comprising a vacuum chamber comprising a wall, a wall heater in thermal communication with the wall of the vacuum chamber, at least one of an evaporative source and a transport polymerization source configured to introduce the vapor phase organic compound into the chamber, and a substrate holder disposed within the vacuum chamber, wherein the substrate holder comprises a cooled chuck, a heat transfer gas source for introducing a heat transfer gas to a space between the cooled chuck and the substrate, and a substrate clamping mechanism comprising at least one of an electrostatic, mechanical and magnetic clamping mechanism.

    Abstract translation: 一种用于将气相有机化合物沉积到基底上的系统,包括真空室,包括壁,与真空室的壁热连通的壁加热器,蒸发源和运输聚合源中的至少一个,其配置成引入 所述气相有机化合物进入所述室,以及衬底保持器,其设置在所述真空室内,其中所述衬底保持器包括冷却的卡盘,用于将传热气体引入所述冷却的卡盘和所述衬底之间的空间的传热气体源, 以及包括静电,机械和磁性夹紧机构中的至少一个的衬底夹持机构。

    Substrate Holder
    17.
    发明申请
    Substrate Holder 审中-公开
    基板支架

    公开(公告)号:US20060274474A1

    公开(公告)日:2006-12-07

    申请号:US11421389

    申请日:2006-05-31

    Abstract: A substrate holder for holding and cooling a substrate during a film deposition process is disclosed, wherein the substrate holder comprises a cooled chuck, and a clamping member movably associated with the cooled chuck, wherein the clamping member is movable between an unclamped position in which a substrate is removable from the substrate holder and a clamped position in which a substrate is clamped to the substrate holder substantially adjacent the cooled chuck.

    Abstract translation: 公开了一种用于在膜沉积工艺期间保持和冷却衬底的衬底保持器,其中衬底保持器包括冷却的卡盘以及与冷却卡盘可移动地相关联的夹紧构件,其中夹紧构件可在松开位置之间移动, 衬底可从衬底保持器和夹持位置移除,其中衬底被夹持到衬底保持器基本上邻近冷却的卡盘。

    System for forming composite polymer dielectric film
    19.
    发明申请
    System for forming composite polymer dielectric film 有权
    用于形成复合聚合物电介质膜的系统

    公开(公告)号:US20050223989A1

    公开(公告)日:2005-10-13

    申请号:US10816179

    申请日:2004-03-31

    Abstract: A system for depositing a composite polymer dielectric film on a substrate is disclosed, wherein the composite polymer dielectric film includes a low dielectric constant polymer layer disposed between a first silane-containing layer and a second silane-containing layer. The system includes a process module having a processing chamber and a monomer delivery system configured to admit a gas-phase monomer into the processing chamber for deposition of the low dielectric constant polymer layer, a post-treatment module for annealing the composite polymer dielectric film, and a silane delivery system configured to admit a vapor flow containing a silane precursor into at least one of the process module and the post-treatment module for the formation of the first silane-containing layer and the silane-containing layer.

    Abstract translation: 公开了一种用于在基板上沉积复合聚合物电介质膜的系统,其中复合聚合物电介质膜包括设置在第一含硅烷层和第二含硅烷层之间的低介电常数聚合物层。 该系统包括具有处理室和单体输送系统的处理模块,该单体输送系统构造成将气相单体进入处理室以沉积低介电常数聚合物层,用于退火复合聚合物电介质膜的后处理模块, 以及硅烷输送系统,其被构造成允许含有硅烷前体的蒸汽流进入至少一个工艺模块和后处理模块中,用于形成第一含硅烷层和含硅烷层。

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