公开(公告)号：US20230402337A1

公开(公告)日：2023-12-14

申请号：US18035343

申请日：2021-11-09

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Daniel Wayne Levesque, Jr. ,  Aize Li ,  Heather Nicole Vanselous

IPC: H01L23/15 ,  H01L23/13 ,  H01L21/48 ,  B32B17/06 ,  B32B3/26 ,  C03C15/00

CPC classification number: H01L23/15 ,  H01L23/13 ,  H01L21/481 ,  B32B17/06 ,  B32B3/266 ,  C03C15/00 ,  B32B2250/40

Abstract: In some embodiments, a method comprises forming a pilot hole or damage track through a laminate glass structure using a laser. The laminate glass structure comprising a first layer and a second layer adjacent to the first layer. The first layer is formed from a first glass composition. The second layer is formed from a second glass composition different from the first glass composition. After forming the pilot hole, the laminate glass structure is exposed to etching conditions that etch the first glass composition at a first etching rate and the second glass composition at a second etching rate, wherein the first etch rate is different from the second etch rate, to form an etched hole.

公开(公告)号：US11697617B2

公开(公告)日：2023-07-11

申请号：US17632086

申请日：2020-07-31

Applicant: CORNING INCORPORATED

Inventor： Douglas Clippinger Allan ,  Vladislav Yuryevich Golyatin ,  Petr Gorelchenko ,  Jason Thomas Harris ,  Jin Su Kim ,  Peter Joseph Lezzi ,  Rostislav Vatchev Roussev ,  Natesan Venkataraman

IPC: C03C27/06 ,  C03C21/00 ,  B32B17/06

CPC classification number: C03C27/06 ,  B32B17/06 ,  C03C21/002 ,  B32B2307/558

Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.

公开(公告)号：US20220278005A1

公开(公告)日：2022-09-01

申请号：US17743643

申请日：2022-05-13

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Paul Bennett Dohn ,  Jin Su Kim ,  Aize Li ,  Hugh Michael McMahon ,  Jun-Ro Yoon

IPC: H01L23/13 ,  B32B17/06 ,  B81B1/00 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C15/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

公开(公告)号：US11367665B2

公开(公告)日：2022-06-21

申请号：US16633368

申请日：2018-07-24

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Paul Bennett Dohn ,  Jin Su Kim ,  Aize Li ,  Hugh Michael McMahon ,  Jun Ro Yoon

IPC: H01L23/495 ,  H01L23/13 ,  B32B17/06 ,  B81B1/00 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C15/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  C03C23/00

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

公开(公告)号：US11302563B2

公开(公告)日：2022-04-12

申请号：US16905477

申请日：2020-06-18

Applicant: Corning Incorporated

Inventor： Hoon Kim ,  Jin Su Kim ,  Varun Singh

IPC: H01L21/683 ,  C03C15/00 ,  H01L21/78 ,  H01L21/304

Abstract: A carrier assembly is configured to support a wafer, including during back end of line (BEOL) processing. The carrier assembly includes dual carriers. A first carrier includes a stepped structure so as to situate the wafer. A side of the wafer is bonded to the first carrier without adhesive. The first carrier is positioned atop the second carrier, so as to be mechanically supported by the second carrier. Each carrier is made by wet etching of laminated glass, without mechanical polishing.

公开(公告)号：US20210028077A1

公开(公告)日：2021-01-28

申请号：US17043561

申请日：2018-04-03

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Jin Su Kim

IPC: H01L23/04 ,  C03C15/00 ,  B32B17/06 ,  B32B3/30 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/48 ,  B81B7/00 ,  B81C1/00 ,  H01L23/26 ,  H01L21/52

Abstract: Wafer level encapsulated packages includes a wafer, a glass substrate hermetically sealed to the wafer, and an electronic component. The glass substrate includes a glass cladding layer fused to a glass core layer and a cavity formed in the glass substrate. The electronic component is encapsulated within the cavity. In various embodiments, the floor of the cavity is planar and substantially parallel to a plane defined by a top surface of the glass cladding layer. The glass cladding layer has a higher etch rate in an etchant than the glass core layer. In various embodiments, the wafer level encapsulated package is substantially optically transparent. Methods for forming the wafer level encapsulated package and electronic devices formed from the wafer level encapsulated package are also described.

公开(公告)号：US20190186192A1

公开(公告)日：2019-06-20

申请号：US16283973

申请日：2019-02-25

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Aize Li ,  Timothy James Orsley

IPC: E06B3/673 ,  E06B3/677 ,  E06B3/663 ,  E06B3/66

CPC classification number: E06B3/673 ,  B44C1/227 ,  C03C15/00 ,  C03C27/10 ,  C03C2218/34 ,  E06B3/6612 ,  E06B3/66304 ,  E06B3/66309 ,  E06B3/677 ,  E06B3/6775

Abstract: A vacuum insulated glass unit includes a first and a second glass pane and a pane bonding layer. The first and second glass panes each include a vacuum chamber side opposite an outer side. The vacuum chamber side of the first glass pane includes an etched interior surface, a glass pane periphery having a periphery surface, and a plurality of glass spacers each having an end surface. The pane bonding layer is positioned between and engaged with the periphery surface of the glass pane periphery of the first glass pane and the second glass pane and couples the first glass pane to the second glass pane. Each end surface of the plurality of glass spacers and the periphery surface of the glass pane periphery are offset from the etched interior surface such that a vacuum chamber is disposed between the first and the second glass panes.

公开(公告)号：US20170327419A1

公开(公告)日：2017-11-16

申请号：US15522198

申请日：2015-10-29

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Leonard Charles Dabich, II ,  David Alan Deneka ,  Jin Su Kim ,  Shari Elizabeth Koval ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: C03C23/00 ,  C03C3/14 ,  C03C3/16 ,  C03C27/10 ,  C01G19/02 ,  C03C3/247 ,  C03C3/23 ,  C03C15/00 ,  C03C27/04 ,  H01L51/52 ,  C03C17/06 ,  C03C17/23

CPC classification number: C03C23/0025 ,  C01G19/02 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C15/00 ,  C03C17/02 ,  C03C17/06 ,  C03C17/23 ,  C03C27/044 ,  C03C27/06 ,  C03C27/10 ,  H01L51/5246

Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σtensile stress location)/(σinterface laser weld)) 10 MPa or >1 MPa where σtensile stress location is the stress present in the first substrate and σinterface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

公开(公告)号：US12252437B2

公开(公告)日：2025-03-18

申请号：US17924142

申请日：2021-05-05

Applicant: CORNING INCORPORATED

Inventor： Venkatesh Botu ,  Attila Lang de Falussy ,  Jin Su Kim ,  Karl William Koch, III ,  Aize Li ,  James Patrick Trice

IPC: B32B15/04 ,  B32B3/30 ,  B32B7/027 ,  B32B17/06 ,  C03C3/091 ,  C03C11/00 ,  C03C15/00 ,  C03C17/02 ,  C03C23/00

Abstract: A method of forming a glass laminate includes providing a substrate having a core layer and at least one cladding layer; heat treating the substrate at a temperature such that the at least one cladding layer is phase-separated after the heat treating; and etch treating the substrate for at least 10 sec. A phase-separated glass laminate includes a substrate having a core layer and at least one phase-separated cladding layer, such that the glass laminate has a % transmission of at least 96%, and the at least one cladding layer comprises a grain size in a range of 10 nm to 1 μm, or a graded glass index of greater than 5 nm.

公开(公告)号：US20240351312A1

公开(公告)日：2024-10-24

申请号：US18761977

申请日：2024-07-02

Applicant: CORNING INCORPORATED

Inventor： Jason Thomas Harris ,  Jin Su Kim ,  Peter Joseph Lezzi ,  Natesan Venkataraman

IPC: B32B17/06 ,  B32B7/027 ,  C03B17/06 ,  C03B27/04 ,  C03B27/052 ,  C03C21/00 ,  C03C23/00

CPC classification number: B32B17/06 ,  C03B17/064 ,  C03B27/0413 ,  C03B27/0526 ,  C03C21/002 ,  C03C23/007 ,  B32B7/027 ,  B32B2307/50 ,  C03C2203/50

Abstract: A laminated glass article comprises a core layer comprising a core glass composition having an average core coefficient of thermal expansion (CTEcore) and a clad layer directly adjacent to the core layer and comprising a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore such that the clad layer is in compression and the core layer is in tension. A compressive stress of the clad layer increases with increasing distance from the outer surface of the clad layer, transitions to a minimum tensile stress as a step-change at an interface region between the core layer and the clad layer, and a magnitude of the tensile stress increases continuously to a maximum tensile stress in the core layer. Other stress profiles, and methods of preparing laminated glass articles are also disclosed.