Apparatus and method for performing end point detection on a linear planarization tool
    11.
    发明授权
    Apparatus and method for performing end point detection on a linear planarization tool 失效
    在线性平面化工具上进行端点检测的装置和方法

    公开(公告)号:US06186865B1

    公开(公告)日:2001-02-13

    申请号:US09182532

    申请日:1998-10-29

    IPC分类号: B24B722

    摘要: A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next.

    摘要翻译: 一种利用传感器来监测来自位于抛光垫下方的流体轴承的流体压力以检测抛光终点的技术。 传感器位于线性抛光机的流体轴承的前缘,用于在半导体晶片上执行化学机械抛光。 传感器监测流体压力以检测抛光期间流体压力的变化,该变化对应于当抛光从一个材料层转移到下一个材料层时的剪切力的变化。

    Method and apparatus for cleaning of semiconductor substrates using
hydrofluoric acid (HF)
    12.
    发明授权
    Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF) 失效
    使用氢氟酸(HF)清洗半导体衬底的方法和设备

    公开(公告)号:US6145148A

    公开(公告)日:2000-11-14

    申请号:US227499

    申请日:1999-01-07

    摘要: A cleaning method and apparatus using very dilute hydrofluoric acid (BF) for cleaning silicon wafers and semiconductor substrates. The HF is delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate and reduces the volumes of chemical solutions used in a scrubbing process. The process of the present invention uses very dilute HF and allows a thin oxide to be etched but not completely removed so as to maintain a hydrophilic surface state. Thus, this invention presents a chemical mechanical cleaning process with in-situ etching with the use of PVA brushes on a brush scrubber. Very accurate control of etch rate is obtained and, therefore, makes this process suitable to multiple cleaning applications of silicon wafers and semiconductor substrates.

    摘要翻译: 一种使用非常稀的氢氟酸(BF)清洗硅晶片和半导体衬底的清洗方法和设备。 将HF输送到刷子的芯部,其中溶液被刷子吸收,然后通过刷子施加到基底上。 该递送系统将化学溶液均匀地施加到半导体衬底并减少在洗涤过程中使用的化学溶液的体积。 本发明的方法使用非常稀的HF,并允许蚀刻薄氧化物但不能完全去除以保持亲水表面状态。 因此,本发明提出了一种利用在刷洗涤器上使用PVA刷的原位蚀刻的化学机械清洁方法。 获得非常精确的蚀刻速度控制,因此使该工艺适合于硅片和半导体衬底的多次清洁应用。

    Drip chemical delivery apparatus
    13.
    发明授权
    Drip chemical delivery apparatus 失效
    滴剂输送装置

    公开(公告)号:US5853522A

    公开(公告)日:1998-12-29

    申请号:US688257

    申请日:1996-07-29

    IPC分类号: B08B7/00 H01L21/00

    摘要: A drip chemical delivery system used in semiconductor substrate cleaning processes. A drip chemical delivery system which uses small openings in a pipe (holes) and a low air pressure to saturate the brushes in a double sided brush system. This drip delivery system reduces the volumes of chemical solutions used in a scrubbing process and helps to maintain control of the pH profile of a substrate. This system is described and illustrated in the manner it is used in conjunction with a double sided scrubber.

    摘要翻译: 用于半导体衬底清洗工艺的滴注化学物质输送系统。 滴水化学品输送系统,其在管道(孔)中使用小开口并且具有低空气压力以使双面刷系统中的刷子饱和。 这种滴注递送系统减少了在洗涤过程中使用的化学溶液的体积,并有助于保持对底物pH分布的控制。 该系统以与双面洗涤器结合使用的方式进行描述和说明。

    Method and apparatus for cleaning of semiconductor substrates using
hydrofluoric acid (HF)
    16.
    发明授权
    Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF) 失效
    使用氢氟酸(HF)清洗半导体衬底的方法和设备

    公开(公告)号:US5868863A

    公开(公告)日:1999-02-09

    申请号:US791688

    申请日:1997-01-30

    摘要: A cleaning method and apparatus using very dilute hydrofluoric acid (HF) for cleaning silicon wafers and semiconductor substrates. The HF is delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate and reduces the volumes of chemical solutions used in a scrubbing process. The process of the present invention uses very dilute HF and allows a thin oxide to be etched but not completely removed so as to maintain a hydrophilic surface state. Thus, this invention presents a chemical mechanical cleaning process with in-situ etching with the use of PVA brushes on a brush scrubber. Very accurate control of etch rate is obtained and, therefore, makes this process suitable to multiple cleaning applications of silicon wafers and semiconductor substrates.

    摘要翻译: 一种使用非常稀的氢氟酸(HF)清洗硅晶片和半导体衬底的清洁方法和设备。 将HF输送到刷子的芯部,其中溶液被刷子吸收,然后通过刷子施加到基底上。 该递送系统将化学溶液均匀地施加到半导体衬底并减少在洗涤过程中使用的化学溶液的体积。 本发明的方法使用非常稀的HF,并允许蚀刻薄氧化物但不能完全去除以保持亲水表面状态。 因此,本发明提出了一种利用在刷洗涤器上使用PVA刷的原位蚀刻的化学机械清洁方法。 获得非常精确的蚀刻速度控制,因此使该工艺适合于硅片和半导体衬底的多次清洁应用。

    Method to remove metals in a scrubber
    18.
    发明授权
    Method to remove metals in a scrubber 失效
    去除洗涤器中金属的方法

    公开(公告)号:US06274059B1

    公开(公告)日:2001-08-14

    申请号:US08615520

    申请日:1996-03-11

    IPC分类号: B44C122

    摘要: A method to remove metal contaminants in a substrate cleaning process. The present invention may replace or be used in conjunction with other substrate cleaning systems. This method comprises adding a citric acid solution to the liquid medium of a semiconductor substrate cleaning system. This method is described in the manner it is used in conjunction with a scrubber wherein both sides of a wafer are scrubbed.

    摘要翻译: 在基板清洗过程中去除金属污染物的方法。 本发明可以替代或与其它基材清洁系统结合使用。 该方法包括向半导体衬底清洗系统的液体介质中加入柠檬酸溶液。 以与洗涤器结合使用的方式描述该方法,其中洗涤两个晶片。

    Hesitation free roller
    19.
    发明授权
    Hesitation free roller 失效
    犹豫不决的滚筒

    公开(公告)号:US6003185A

    公开(公告)日:1999-12-21

    申请号:US691450

    申请日:1996-08-01

    摘要: A method and apparatus for rotating wafers in a scrubber, wherein both sides of a wafer are scrubbed without slipping or hesitating. A rotating roller imparts rotary motion to a semiconductor wafer during a cleaning process wherein both sides of a wafer are scrubbed. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove. The wafer edge is pinched inside the groove to create enough friction that when cleaning solutions are applied the wafer does not slip and continues to rotate. Also, the groove allows the roller to pinch the wafer just enough so that when the roller reaches the flat of the wafer, the roller may regain the radius of the wafer without hesitating.

    摘要翻译: 一种用于在洗涤器中旋转晶片的方法和装置,其中晶片的两侧被擦洗而没有滑动或犹豫。 在清洁工艺期间,旋转辊将旋转运动提供给半导体晶片,其中清洗晶片的两侧。 在其外边缘处的旋转辊和晶片接触以及它们的外边缘之间的摩擦导致晶片旋转。 辊具有带有凹槽的外边缘。 晶片边缘被夹在凹槽内以产生足够的摩擦力,当施加清洁溶液时,晶片不会滑动并继续旋转。 此外,凹槽允许辊足够地夹紧晶片,使得当辊到达晶片的平面时,辊可以重新获得晶片的半径而不会犹豫。

    Megasonic bath
    20.
    发明授权
    Megasonic bath 失效
    超声波浴

    公开(公告)号:US5762084A

    公开(公告)日:1998-06-09

    申请号:US770913

    申请日:1996-12-20

    IPC分类号: B08B3/12 H01L21/00 B08B3/10

    摘要: A megasonic bath with horizontal wafer orientation that may be conveniently interfaced with brush scrub systems. The megasonic transducer creates a sonic energy flow in the direction of the wafers. The sonic energy causes cavitation which loosens and displaces particles from the surface of the wafers. Water jets produce a horizontal flow across the wafer surfaces. The horizontal flow created by the water jets keeps the wafer surfaces wet, exposes the surfaces to fresh chemicals, and removes the particles which have been displaced or loosened by the sonic energy.

    摘要翻译: 具有水平晶片取向的兆声波浴,其可以方便地与刷洗系统接口。 兆声传感器在晶片方向上产生声能量流。 声能引起空化,从晶片表面松动并排出颗粒。 水射流在晶片表面产生横向流动。 由水射流产生的水平流动使晶片表面变湿,将表面暴露于新鲜的化学物质中,并且通过声能除去已被移位或松动的颗粒。