公开(公告)号：US20150284603A1

公开(公告)日：2015-10-08

申请号：US14743619

申请日：2015-06-18

Applicant: FUJIFILM CORPORATION

Inventor： Yu IWAI ,  Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: C09J133/12 ,  H01L21/304 ,  C09J125/14 ,  C09J133/16 ,  C09J183/06 ,  H01L21/683 ,  H01L21/306

CPC classification number: C09J151/003 ,  C09J4/00 ,  C09J5/04 ,  C09J5/06 ,  C09J125/14 ,  C09J133/12 ,  C09J133/16 ,  C09J183/06 ,  H01L21/304 ,  H01L21/306 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.

Abstract translation: 通过用于生产包含（A）含有氟原子或硅原子的自由基聚合性单体或低聚物的半导体器件的临时粘合剂，（B）高分子化合物和（C）自由基聚合引发剂，用于生产 半导体装置，其涂布性优异，即使在待处理构件（例如半导体晶片）进行机械或化学处理时，即使在高温条件下也能够在临时支撑体中产生气体的问题 并且进一步地，其可以容易地释放所加工的构件的临时支撑件，而不会对经处理的高温处理的构件造成损害，并且提供粘合剂支撑件和使用其的半导体装置的制造方法。

公开(公告)号：US20150184032A1

公开(公告)日：2015-07-02

申请号：US14641656

申请日：2015-03-09

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Ichiro KOYAMA

IPC: C09J4/00 ,  H01L21/306 ,  C09J101/14 ,  C09J125/06 ,  C09J101/12 ,  H01L21/304 ,  H01L21/683

CPC classification number: C09J4/00 ,  C09J101/00 ,  C09J101/08 ,  C09J101/10 ,  C09J101/12 ,  C09J101/14 ,  C09J101/26 ,  C09J125/06 ,  C09J201/00 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31133 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/28

Abstract: By a temporary adhesive for production of semiconductor device containing (A) a polymer compound having a thermal decomposition initiation temperature of 250° C. or more, and (B) a radical polymerizable monomer, and an adhesive support and a production method of semiconductor device using the same, a temporary adhesive for production of semiconductor device, which can temporarily support a member to be processed (for example, a semiconductor wafer) with a high adhesive force even under high temperature condition (for example, at 100° C.) when the member to be processed is subjected to a mechanical or chemical processing, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition, and which can easily release the temporary support for the member processed without imparting damage to the member processed, and an adhesive support and a production method of semiconductor device using the same can be provided.

Abstract translation: 通过使用含有（A）热分解开始温度为250℃以上的高分子化合物和（B）自由基聚合性单体的半导体装置的临时粘合剂，以及粘合剂支持体和半导体装置的制造方法 使用它们，即使在高温条件下（例如，在100℃）下也可以以高粘合力临时支撑待处理的部件（例如，半导体晶片）的用于生产半导体器件的临时粘合剂。 当待加工的构件经受机械或化学处理时，即使在高温条件下也能在临时支撑体中减少气体产生的问题，并且能够容易地释放所加工的构件的临时支撑而不损害 可以提供加工构件，并且可以提供使用其的半导体装置的粘合剂支持体和制造方法。

公开(公告)号：US20230120465A1

公开(公告)日：2023-04-20

申请号：US18067368

申请日：2022-12-16

Applicant: FUJIFILM Corporation

Inventor： Kohei AIZU ,  Akira SAKAGUCHI ,  Toshifumi INNO ,  Akinori FUJITA ,  Kazuaki ENOMOTO ,  Ichiro KOYAMA ,  Akira YAMAMOTO

IPC: B41C1/10 ,  B41N1/14 ,  G03F7/029 ,  G03F7/09

Abstract: Provided are an on-press development type lithographic printing plate precursor having a support and an image-recording layer on the support in which the image-recording layer contains a coloring compound capable of having a coloring reaction with a decomposition product generated by exposure of the image-recording layer, and an on-press development type lithographic printing plate precursor having a support and an image-recording layer on the support in which the image-recording layer contains a compound represented by Formula 1C or Formula 2C and an electron-donating polymerization initiator. In Formula 1C and Formula 2C, R1C to R4C each independently represent a monovalent organic group, L1C and L2C each independently represent a divalent organic group, AC represents OH or NR5CR6C, and R5C and R6C each independently represent a monovalent organic group.

公开(公告)号：US20190023921A1

公开(公告)日：2019-01-24

申请号：US16048395

申请日：2018-07-30

Applicant: FUJIFILM CORPORATION

Inventor： Noriaki SATO ,  Ichiro KOYAMA ,  Shota SUZUKI

IPC: C09D11/30 ,  C08J3/03 ,  C08L77/06 ,  C08L71/00 ,  C08L57/00

Abstract: Provided are an aqueous dispersion including a microcapsule that has a shell having a three-dimensional cross-linked structure containing at least one bond selected from a urethane bond or a urea bond, and has a core, in which at least one of the shell or the core has a polymerizable group, including a dispersant that has at least one bond selected from a urethane bond or a urea bond and a hydrophilic group, and including water; a method for manufacturing the aqueous dispersion; and an image forming method using the aqueous dispersion.

公开(公告)号：US20190023920A1

公开(公告)日：2019-01-24

申请号：US16048394

申请日：2018-07-30

Applicant: FUJIFILM CORPORATION

Inventor： Ichiro KOYAMA ,  Noriaki SATO ,  Shota SUZUKI

IPC: C09D11/30 ,  C08J3/03 ,  C08L75/02 ,  C08L75/04 ,  C08L57/00 ,  C08F2/46

Abstract: Provided are an aqueous dispersion including a microcapsule, and water, the microcapsule including: a shell having a three-dimensional cross-linked structure containing at least one neutralized acid group and at least one bond selected from a urethane bond or a urea bond, in which a degree of neutralization of the acid group contained in the three-dimensional cross-linked structure is from 50% to 100%; and a core, at least one of the shell or the core has a polymerizable group; a method for manufacturing the same; and an image forming method using the aqueous dispersion.

公开(公告)号：US20170101521A1

公开(公告)日：2017-04-13

申请号：US15389729

申请日：2016-12-23

Applicant: FUJIFILM Corporation

Inventor： Ichiro KOYAMA

IPC: C08K5/19 ,  H01L21/768 ,  B05D3/00 ,  C09D179/08 ,  C08K5/18 ,  C08K5/3462 ,  H01L23/532

CPC classification number: C08K5/19 ,  B05D3/007 ,  C08K5/17 ,  C08K5/18 ,  C08K5/3462 ,  C08L101/00 ,  C09D179/08 ,  C09D179/085 ,  C09K3/00 ,  G03F7/004 ,  H01L21/76834 ,  H01L23/5329 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/15174

Abstract: Provided are a thermal base generator which is capable of performing cyclization of a. thermosetting resin at a low temperature and with which a thermosetting resin composition having excellent stability can be prepared, a thermosetting resin composition, a cured film, a cured film manufacturing method, and a semiconductor device.The thermal base generator includes at least one selected from an acidic compound which generates a base in a case of being heated to 40° C. or higher, and an ammonium salt containing an anion having a pKa1 of 0 to 4 and an ammonium cation. The acidic compound is preferably an ammonium salt and/or a compound represented by the following General Formula (1), in which A1 represents a p-valent organic group, R1 represents a monovalent organic group, L1 represents an (m+1)-valent organic group, m represents an integer of 1 or more, and p represents an integer of 1 or more.

公开(公告)号：US20160168422A1

公开(公告)日：2016-06-16

申请号：US15047945

申请日：2016-02-19

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Ichiro KOYAMA ,  Yoshitaka KAMOCHI

IPC: C09J4/06 ,  C09D169/00 ,  H01L21/683 ,  C09D145/00 ,  C09J4/00 ,  C09D181/06 ,  C09D125/06

CPC classification number: C09J4/06 ,  B32B3/08 ,  B32B7/12 ,  B32B27/06 ,  B32B27/281 ,  B32B27/288 ,  B32B27/36 ,  B32B2457/00 ,  B32B2457/14 ,  C08F222/1006 ,  C08F2222/1013 ,  C08F2222/1026 ,  C08F2222/104 ,  C08F2222/108 ,  C09D125/06 ,  C09D145/00 ,  C09D169/00 ,  C09D181/06 ,  C09J4/00 ,  C09J201/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/81 ,  H01L2224/95

Abstract: Provided are a laminate capable of providing a temporary support for a member to be treated by a strongly adhesive force when the member to be treated is subjected to a mechanical or chemical treatment, and of easily releasing the temporary support for the treated member while not damaging the treated member, in which the TTV of the treated member is excellent; a composition for forming a protective layer; a composition for forming an adhesive layer; and a kit.The laminate has, on a support (A), an adhesive layer having a softening point of 250° C. or higher (B), a protective layer (C), and a device wafer (D) in this order, in which the adhesive layer (B) is a cured product of an adhesive layer precursor and the adhesive layer precursor has a polymerizable compound (b-1).

Abstract translation: 本发明提供一种层叠体，当待处理构件进行机械或化学处理时，能够通过强粘合力提供待处理构件的临时支撑，并且容易地释放处理构件的临时支撑件而不损坏 被处理部件的TTV优良的被处理部件; 用于形成保护层的组合物; 用于形成粘合剂层的组合物; 和一个工具包。 层压体在支撑体（A）上具有软化点为250℃以上的粘合剂层（B），保护层（C）和装置晶片（D），其中， 粘合剂层（B）是粘合剂层前体的固化物，粘合剂层前体具有聚合性化合物（b-1​​）。

公开(公告)号：US20160167337A1

公开(公告)日：2016-06-16

申请号：US15052122

申请日：2016-02-24

Applicant: FUJIFILM Corporation

Inventor： Ichiro KOYAMA ,  Yu IWAI ,  Yoshitaka KAMOCHI

IPC: B32B7/06 ,  H01L21/683

CPC classification number: B32B7/06 ,  B32B7/12 ,  B32B9/00 ,  B32B15/08 ,  B32B25/20 ,  B32B27/08 ,  B32B27/22 ,  B32B27/283 ,  B32B27/302 ,  B32B27/304 ,  B32B27/365 ,  B32B2250/02 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/51 ,  B32B2307/748 ,  B32B2457/00 ,  B32B2457/14 ,  H01L21/02057 ,  H01L21/31133 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Provided are a temporary bonding layer laminate for producing a semiconductor device, which can reliably and easily provide a temporary support for the device wafer when the device wafer is subjected to a mechanical or chemical treatment and can easily provide a release from the temporary support for the device wafer while not damaging the device wafer even after undergoing a process at a high temperature; and a composition for forming a protective layer, a composition for forming a release layer, and a kit, each of which is used for the production of the laminate.The laminate has a device wafer, a protective layer, a release layer, and a support substrate in this order, in which the protective layer is in contact only with the device wafer and the release layer, the release layer is in contact only with the protective layer and the support substrate, and the release layer contains a fluorine atom and/or a silicon atom.

Abstract translation: 提供一种用于制造半导体器件的临时接合层层压体，当器件晶片经受机械或化学处理时，其可以可靠且容易地为器件晶片提供临时支撑，并且可以容易地从临时支撑件释放 即使在高温下进行处理也不会损坏器件晶片; 和用于形成保护层的组合物，用于形成剥离层的组合物和试剂盒，其用于制备层压体。 该层压体依次具有器件晶片，保护层，剥离层和支撑基板，其中保护层仅与器件晶片和释放层接触，释放层仅与 保护层和支撑基板，剥离层含有氟原子和/或硅原子。

公开(公告)号：US20160035612A1

公开(公告)日：2016-02-04

申请号：US14865961

申请日：2015-09-25

Applicant: FUJIFILM Corporation

Inventor： Ichiro KOYAMA ,  Yu IWAI ,  Masafumi YOSHIDA

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  C09J7/40 ,  C09J2201/622 ,  C09J2203/326 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

Abstract: Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes (A) a release layer and (B) an adhesive layer, wherein the release layer (A) comprises (a1) a first release layer having a softening point of 200° C. or more and adjoining the adhesive layer (B), and (a2) a second release layer adjoining the first release layer (a1); the second release layer (a2) contains a resin; and the resin after curing has a capable of being dissolved at 5% by mass or more, at 25° C., in at least one kind of solvents selected from hexane and the like.

Abstract translation: 提供了用于制造半导体器件的临时粘合层压体，通过该半导体器件可以在待加工构件的机械或化学过程中可靠且容易地暂时支撑待加工构件（半导体晶片等），然后 即使在高温处理之后，处理过的构件也可以容易地从临时支撑体释放而不损坏处理的构件，以及用于制造半导体器件的工艺。 临时粘合层压体包括（A）剥离层和（B）粘合剂层，其中剥离层（A）包含（a1）软化点为200℃以上的第一剥离层，并且与粘合剂层相邻 （B），和（a2）与第一剥离层（a1）相邻的第二剥离层。 第二剥离层（a2）含有树脂; 固化后的树脂在25℃，5质量％以上溶解于选自己烷等的至少一种溶剂中。

公开(公告)号：US20140377705A1

公开(公告)日：2014-12-25

申请号：US14467613

申请日：2014-08-25

Applicant: FUJIFILM Corporation

Inventor： Ichiro KOYAMA ,  Junya ABE

IPC: G03F7/038 ,  G03F7/20

CPC classification number: G03F7/0388 ,  B41C1/1008 ,  B41C1/1016 ,  B41C2201/02 ,  B41C2210/04 ,  B41C2210/06 ,  B41C2210/10 ,  B41C2210/24 ,  C08F265/06 ,  C08F290/12 ,  C08F299/06 ,  G03F7/027 ,  G03F7/033 ,  G03F7/3035 ,  G03F7/322 ,  G03F7/38 ,  C08F222/10

Abstract: Disclosed is a lithographic printing plate allowing for high running performance of the developer, wide water window and high printing durability. The lithographic printing plate precursor comprises a photosensitive layer on a support, wherein the photosensitive layer comprises (A) a polymerizable compound, (B) a polymerization initiator, (C) a polyvinyl acetal binder containing at least one kind of repeat units represented by general formula (I-c), general formula (I-b) and general formula (I-a), and (D) an acrylic resin binder.

Abstract translation: 公开了一种允许显影剂的高运行性能，宽水窗和高印刷耐久性的平版印刷版。 平版印刷版原版在载体上包含感光层，其中感光层包含（A）可聚合化合物，（B）聚合引发剂，（C）含有至少一种重复单元的聚乙烯醇缩乙醛粘合剂， 式（Ic），通式（Ib）和通式（Ia），和（D）丙烯酸树脂粘合剂。