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    TEMPORARY ADHESIVE FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND ADHESIVE SUPPORT AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
    1.
    发明申请
    TEMPORARY ADHESIVE FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND ADHESIVE SUPPORT AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
    用于制造半导体器件的临时粘合剂，以及使用该半导体器件的半导体器件的粘合支持和生产方法

    公开(公告)号：US20150184032A1

    公开(公告)日：2015-07-02

    申请号：US14641656

    申请日：2015-03-09

    申请人： FUJIFILM Corporation

    发明人： Yu IWAI ,  Ichiro KOYAMA

    IPC分类号： C09J4/00 ,  H01L21/306 ,  C09J101/14 ,  C09J125/06 ,  C09J101/12 ,  H01L21/304 ,  H01L21/683

    CPC分类号： C09J4/00 ,  C09J101/00 ,  C09J101/08 ,  C09J101/10 ,  C09J101/12 ,  C09J101/14 ,  C09J101/26 ,  C09J125/06 ,  C09J201/00 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31133 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/28

    摘要： By a temporary adhesive for production of semiconductor device containing (A) a polymer compound having a thermal decomposition initiation temperature of 250° C. or more, and (B) a radical polymerizable monomer, and an adhesive support and a production method of semiconductor device using the same, a temporary adhesive for production of semiconductor device, which can temporarily support a member to be processed (for example, a semiconductor wafer) with a high adhesive force even under high temperature condition (for example, at 100° C.) when the member to be processed is subjected to a mechanical or chemical processing, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition, and which can easily release the temporary support for the member processed without imparting damage to the member processed, and an adhesive support and a production method of semiconductor device using the same can be provided.

    摘要翻译： 通过使用含有（A）热分解开始温度为250℃以上的高分子化合物和（B）自由基聚合性单体的半导体装置的临时粘合剂，以及粘合剂支持体和半导体装置的制造方法 使用它们，即使在高温条件下（例如，在100℃）下也可以以高粘合力临时支撑待处理的部件（例如，半导体晶片）的用于生产半导体器件的临时粘合剂。 当待加工的构件经受机械或化学处理时，即使在高温条件下也能在临时支撑体中减少气体产生的问题，并且能够容易地释放所加工的构件的临时支撑而不损害 可以提供加工构件，并且可以提供使用其的半导体装置的粘合剂支持体和制造方法。

    Anaerobic adhesive compositions
    9.
    发明授权
    Anaerobic adhesive compositions 失效
    厌氧胶组合物

    公开(公告)号：US4812495A

    公开(公告)日：1989-03-14

    申请号：US110158

    申请日：1987-10-19

    申请人： I. Daniel Sand

    发明人： I. Daniel Sand

    IPC分类号： C08F2/44 ,  C08B3/22 ,  C08F20/10 ,  C08F220/20 ,  C09J4/06 ,  C09J11/04 ,  C09J101/14 ,  C08G81/00 ,  C08G83/00

    CPC分类号： C09J101/14 ,  C08B3/22 ,  C09J4/06

    摘要： Disclosed are anaerobic adhesive compositions which cure under anaerobic conditions, said compositions being comprised of at least one carboxylated cellulose ester such as carboxylated cellulose acetate butyrate or carboxylated cellulose acetate propionate, at least one acrylate monomer, and at least one hydroquinone-based stabilizer. The composition can optionally contain an accelerator.

    摘要翻译： 所公开的是在厌氧条件下固化的厌氧粘合剂组合物，所述组合物由至少一种羧化纤维素酯如羧酸纤维素乙酸丁酸酯或羧化纤维素乙酸酯丙酸酯，至少一种丙烯酸酯单体和至少一种基于对苯二酚的稳定剂组成。 组合物可任选地含有促进剂。