摘要:
Three dimensional memory array architectures and methods of forming the same are provided. An example memory array can include a stack comprising a plurality of first conductive lines at a number of levels separated from one another by at least an insulation material, and at least one conductive extension arranged to extend substantially perpendicular to the plurality of first conductive lines. Storage element material is formed around the at least one conductive extension. Cell select material is formed around the at least one conductive extension. The at least one conductive extension, storage element material, and cell select material are located between co-planar pairs of the plurality of first conductive lines.
摘要:
In a semiconductor memory device, a method for obtaining at least one reference cell adapted to be exploited as a generator of a reference signal, the reference signal depending on a value of an electrical characteristic of the at least one reference cell. The method includes providing a population of auxiliary cells, operating on said population of auxiliary cells for varying a value of the electrical characteristic thereof, in such a way that the varied values are statistically distributed in a range including a value of the electrical characteristic corresponding to the reference signal, and choosing the at least one reference cell, wherein choosing includes choosing at least one auxiliary cell in the population of auxiliary cells having the value of the electrical characteristic close to the value corresponding to the reference signal with a pre-defined tolerance.
摘要:
A method for operating a flash memory device. The memory device includes a matrix of memory cells each one having a programmable threshold voltage defining a value stored in the memory cell. The method includes the steps of erasing a block of memory cells, and compacting the threshold voltages of the memory cells of the block within a predefined compacting range, wherein the step of compacting includes: selecting at least one first memory cell of the block for writing a target value; restoring the threshold voltage of a subset of the memory cells of the block to the compacting range, the subset including the at least one first memory cell and/or at least one second memory cell of the block being adjacent to the at least one first memory cell; and at least partially writing the target value into the at least one first memory cell.
摘要:
A manufacturing process providing a zener diode formed in an N-type well housing a first N-type conductive region and having a doping level higher than the well, and a second P-type conductive region arranged contiguous to the first conductive region. The first conductive region is connected, through a third N-type conductive region having the same doping level as the first conductive region, to a conductive material layer overlying the gate oxide layer to be protected. The third conductive region, the well, and the substrate form an N+/N/P diode that protects the gate oxide layer during manufacture of the integrated device from the deposition of the polycrystalline silicon layer that forms the gate regions of the MOS elements.
摘要翻译:一种制造工艺,其形成在容纳第一N型导电区域且具有高于阱的掺杂水平的N型阱中形成的齐纳二极管,以及与第一导电区域邻接布置的第二P型导电区域。 第一导电区域通过具有与第一导电区域相同的掺杂水平的第三N型导电区域连接到覆盖待保护的栅极氧化物层的导电材料层。 第三导电区域,阱和衬底形成N + / N / P二极管,其在从形成MOS元件的栅极区域的多晶硅层的沉积期间保护集成器件制造期间的栅极氧化物层。
摘要:
An EEPROM memory cell integrated in a semiconductor substrate comprises a floating gate MOS transistor having a source region, a drain region, and a gate region projecting from the substrate and is isolated from the substrate by an oxide layer including a thinner tunnel portion and heavily doped regions formed under said tunnel portion and extending to beneath the drain region, and a selection transistor having a source region, a drain region and a gate region, wherein said source region is heavily doped and formed simultaneously with said heavily doped regions.
摘要:
A nonvolatile semiconductor memory device structure having a matrix of memory cells in a semiconductor material layer. The memory cells are located at intersections of rows and columns of the matrix. Each memory cell includes a control gate electrode connected to one of the rows, a first electrode connected to one of the columns and a second electrode. The rows comprise polysilicon strips extending parallel to each other in a first direction, and the columns are formed by metal strips extending parallel to each other in a second direction orthogonal to the first direction. Short-circuit metal strips are coupled for short-circuiting the second electrodes of the memory cells. The columns and the short-circuit strips arc respectively formed in a first metal level and a second metal level superimposed on each other and electrically insulated by a dielectric layer.
摘要:
A manufacturing process providing a zener diode formed in an N-type well housing a first N-type conductive region and having a doping level higher than the well, and a second P-type conductive region arranged contiguous to the first conductive region. The first conductive region is connected, through a third N-type conductive region having the same doping level as the first conductive region, to a conductive material layer overlying the gate oxide layer to be protected. The third conductive region, the well, and the substrate form an N+/N/P diode that protects the gate oxide layer during manufacture of the integrated device from the deposition of the polycrystalline silicon layer that forms the gate regions of the MOS elements.
摘要:
A test structure is formed by an array of memory cells connected in parallel and including each a memory transistor and a select transistor connected in series. The gate terminals of the select transistors of all memory cells are biased to a value next to the threshold voltage of the select transistors. Therefore, in each memory cell, the drain current is limited by the memory transistor for control gate voltages below the threshold voltage of the memory transistor, and by the select transistor at higher voltages; for high control gate voltages, the drain current is clamped to a constant maximum value. Since the clamping effect of the select transistors acts on each memory cell, the total maximum current of the test structure may be held below a value causing a limitation in the current generated by the entire array because of the resistance in series to the output of the test structure. Thus also the right side of the threshold distribution may be evaluated and the presence of defective cells causing injection of electrons in the floating gate of the memory transistors may be detected.
摘要:
A non-volatile memory cell and a manufacturing process therefor are discussed. The cell is integrated in a semiconductor substrate and includes a floating gate transistor having a first source region, first drain region, and gate region projecting over the substrate between the first source and drain regions. The cell also includes a selection transistor having a second source region, second drain region, and respective gate region, projecting over the substrate between the second source and drain regions. The first and second regions are lightly doped and the cell comprises mask elements.
摘要:
A system, apparatus, and method to read a memory cell of a memory device is described. The method includes biasing a drain select line (DSL), a source select line (SSL), and unaddressed wordlines of a memory block to a pass voltage to set the DSL, SSL, and unselected word lines into a conducting status; applying a source reading voltage to a source node of the source line; biasing a wordline coupled to the memory cell to a reading voltage; and evaluating the voltage of the bit line.The logical status of the addressed memory cell is based on sensing the bit line voltage during a charging phase of the bit line.