公开(公告)号：US10449375B2

公开(公告)日：2019-10-22

申请号：US15844683

申请日：2017-12-18

Applicant: Greatbatch Ltd.

Inventor： Dominick J. Frustaci ,  Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods

IPC: A61N1/375 ,  H01G4/35 ,  H01R13/7195 ,  H01G2/22 ,  H01G2/10 ,  A61N1/08 ,  H01G4/40 ,  A61N1/05 ,  H05K1/02

Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.

公开(公告)号：US10272252B2

公开(公告)日：2019-04-30

申请号：US15603521

申请日：2017-05-24

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel ,  Marc Gregory Martino

IPC: A61N1/00 ,  A61N1/375 ,  H01G4/012 ,  H01G4/018 ,  H01G4/224 ,  H01G4/236 ,  H01G4/35 ,  H05K1/18

Abstract: An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.

公开(公告)号：US09687662B2

公开(公告)日：2017-06-27

申请号：US14797123

申请日：2015-07-11

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: B01J20/34 ,  A61N1/375 ,  A61N1/05 ,  H01G4/35 ,  H01G2/10 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

公开(公告)号：US20160263384A1

公开(公告)日：2016-09-15

申请号：US15164945

申请日：2016-05-26

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz

IPC: A61N1/375 ,  H01G4/35 ,  H01G4/40 ,  A61N1/05 ,  H05K1/09 ,  H05K5/06 ,  H05K1/03 ,  H05K3/40 ,  H01G4/12 ,  H05K1/11

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/0551 ,  A61N1/0563 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  C22C29/12 ,  C22C32/0015 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/095 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/4061 ,  H05K5/066 ,  Y10T156/1052

Abstract: A hermetically sealed feedthrough filter assembly is attachable to an active implantable medical device and includes an insulator substrate assembly and a feedthrough filter capacitor disposed on a device side. A conductive leadwire has a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD. The distal leadwire end is disposed at least partially through a first passageway of the feedthrough filter capacitor and is in contact with, adjacent to or near a device side conductive fill. A first electrically conductive material makes a three-way electrically connection that electrically connects the device side conductive fill to an internal metallization of the feedthrough filter capacitor and to the distal leadwire end. A second electrically conductive material electrically connects an external metallization of the feedthrough filter capacitor to a ferrule or an AIMD housing.

Abstract translation: 密封的馈通过滤器组件可附接到有源可植入医疗装置，并且包括设置在装置侧的绝缘体基底组件和馈通滤波电容器。 导电引线具有延伸到远端引线端的近端引线端，其中近端引线端可连接到AIMD内部的电子装置。 远端引线端部至少部分地设置穿过馈通滤波电容器的第一通道，并与器件侧导电填充物接触，邻近或附近。 第一导电材料形成电气连接器件侧导电填充物与馈通滤波电容器的内部金属化以及远端导线端的三路电连接。 第二导电材料将馈通滤波电容器的外部金属化电连接到套圈或AIMD壳体。

公开(公告)号：US20240115867A1

公开(公告)日：2024-04-11

申请号：US18377030

申请日：2023-10-05

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Thomas Marzano ,  Jason Woods

IPC: A61N1/375

CPC classification number: A61N1/3754

Abstract: The high-voltage and/or high-frequency pulse dielectric breakdown strength (DBS) of an implantable medical device is increased by strategically positioning insulation materials on or adjacent to the external surfaces of a filter capacitor. Dielectric breakdown strength is further increased by adding polymeric or ceramic nanoscale metal oxide insulative powders to the insulation materials.

公开(公告)号：US11527795B2

公开(公告)日：2022-12-13

申请号：US16788679

申请日：2020-02-12

Applicant: Greatbatch Ltd.

Inventor： Robert S. Rubino ,  Keith W. Seitz ,  Xiaohong Tang ,  Todd C. Sutay ,  Brian P. Hohl ,  Holly Noelle Moschiano ,  Biswa P. Das ,  Afsar Ali ,  Sourabh Biswas ,  Gary Freitag ,  David Dianetti ,  Ho-Chul Yun ,  Thomas Marzano

IPC: H01M50/10 ,  H01M50/116 ,  H01M50/147 ,  H01M50/155 ,  H01M50/169 ,  H01M50/186 ,  H01M50/191 ,  H01M50/543 ,  H01M4/131 ,  H01M10/0525

Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both of ceramic casing halves. A thin film metallization, such as of titanium, contacts an edge periphery of each ceramic casing half. The first ceramic casing half is moved into registry with the second ceramic casing half so that the first and second ring-shaped metallizations contact each other. Then, a laser welds through one of the casing halves being a substantially transparent ceramic, for example sapphire, to braze the first and second ring-shaped metallizations to each other to thereby join the first and second casing halves together to form a casing housing the electrode assembly. A solid electrolyte (LixPOyNz) activates the electrode assembly.

公开(公告)号：US11344734B2

公开(公告)日：2022-05-31

申请号：US16589752

申请日：2019-10-01

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Thomas Marzano ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/40 ,  H01G4/005 ,  A61N1/08 ,  H01R43/00 ,  C22C29/12 ,  H02G3/22 ,  H01G4/30 ,  B23K35/30 ,  H01G2/10 ,  H01G4/35 ,  H01R13/52 ,  H01G4/236 ,  B23K35/32 ,  H01R4/02 ,  H01R13/719 ,  B23K35/02 ,  A61N1/05 ,  H01G4/12 ,  A61N1/372 ,  B22F7/08 ,  B22F1/10

Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.

公开(公告)号：US10857368B2

公开(公告)日：2020-12-08

申请号：US15936495

申请日：2018-03-27

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Xiaohong Tang ,  William C. Thiebolt ,  Jonathan Calamel ,  Thomas Shi ,  Thomas Marzano

IPC: A61N1/375 ,  H05K5/00 ,  H05K1/03 ,  H05K3/00 ,  H01L23/15 ,  C03C8/14 ,  H01L23/00 ,  H01L23/10

Abstract: Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

公开(公告)号：US10420949B2

公开(公告)日：2019-09-24

申请号：US16101639

申请日：2018-08-13

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl

IPC: A61N1/375 ,  A61N1/05 ,  H01G4/40 ,  B23K35/30 ,  A61N1/08 ,  H01R43/00 ,  H01G4/35 ,  C22C29/12 ,  H01G4/12 ,  H01G2/10 ,  H01G4/005 ,  H02G3/22 ,  H01G4/30 ,  A61N1/372

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.

公开(公告)号：US20190244729A1

公开(公告)日：2019-08-08

申请号：US16362862

申请日：2019-03-25

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: H01B17/30 ,  B23K1/00 ,  H01B19/02 ,  B23K1/008 ,  B23K1/19 ,  B23K26/32 ,  A61N1/375 ,  C04B41/00 ,  C04B41/51 ,  C04B41/88 ,  C04B41/45 ,  B23K26/21

CPC classification number: H01B17/30 ,  A61N1/3754 ,  B22F7/04 ,  B22F7/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K26/21 ,  B23K26/32 ,  B23K2101/36 ,  B23K2103/14 ,  C04B41/0072 ,  C04B41/4578 ,  C04B41/5122 ,  C04B41/5177 ,  C04B41/5194 ,  C04B41/88 ,  H01B19/02

Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.