公开(公告)号：US20170368664A1

公开(公告)日：2017-12-28

申请号：US15626936

申请日：2017-06-19

申请人： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

发明人： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC分类号： B24B57/02 ,  B24B37/10 ,  H01L21/67

CPC分类号： B24B57/02 ,  B24B37/10 ,  H01L21/67075 ,  H01L21/6708

摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.

公开(公告)号：US20170368663A1

公开(公告)日：2017-12-28

申请号：US15626857

申请日：2017-06-19

申请人： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

发明人： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC分类号： B24B57/02 ,  B24B37/10 ,  H01L21/67

CPC分类号： B24B57/02 ,  B24B37/10 ,  H01L21/67075 ,  H01L21/6708

摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.

公开(公告)号：US20130122788A1

公开(公告)日：2013-05-16

申请号：US13459079

申请日：2012-04-28

申请人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rohdum

发明人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rohdum

IPC分类号： B24B49/10 ,  B24B1/00 ,  B24B41/02

CPC分类号： B24B37/013 ,  B24B49/16

摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

公开(公告)号：US09862070B2

公开(公告)日：2018-01-09

申请号：US13459071

申请日：2012-04-27

申请人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

发明人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

IPC分类号： B24B49/00 ,  B24B37/013 ,  B24B49/16

CPC分类号： B24B37/013 ,  B24B49/16

摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

公开(公告)号：US07678245B2

公开(公告)日：2010-03-16

申请号：US10880752

申请日：2004-06-30

申请人： Yan Wang ,  Siew Neo ,  Feng Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Alain Duboust ,  Antoine Manens ,  Ralph M. Wadensweiler ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Donald J. K. Olgado ,  Paul D. Butterfield ,  Ming-Kuei Tseng ,  Shou-Sung Chang ,  Lizhong Sun

发明人： Yan Wang ,  Siew Neo ,  Feng Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Alain Duboust ,  Antoine Manens ,  Ralph M. Wadensweiler ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Donald J. K. Olgado ,  Paul D. Butterfield ,  Ming-Kuei Tseng ,  Shou-Sung Chang ,  Lizhong Sun

IPC分类号： C25B9/00

CPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/16 ,  B24B49/16 ,  B24B53/017 ,  H01L21/32125

摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.

摘要翻译： 本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。 在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。 多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。 多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。 在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。 残余处理单元包括偏置的导电平面化表面。 在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

公开(公告)号：US09061394B2

公开(公告)日：2015-06-23

申请号：US13459079

申请日：2012-04-28

申请人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

发明人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

IPC分类号： B24B1/00 ,  B24B37/013 ,  B24B49/16

CPC分类号： B24B37/013 ,  B24B49/16

摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。

公开(公告)号：US20130122782A1

公开(公告)日：2013-05-16

申请号：US13459071

申请日：2012-04-27

申请人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

发明人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

IPC分类号： B24B49/16

CPC分类号： B24B37/013 ,  B24B49/16

摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。

公开(公告)号：US20110318997A1

公开(公告)日：2011-12-29

申请号：US13164733

申请日：2011-06-20

申请人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J. K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

发明人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J. K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

IPC分类号： B24B1/00

CPC分类号： B24B53/017 ,  B24B53/005 ,  B24B53/12

摘要： Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to tilt while transmitting rotary motion from the drive mechanism to the conditioning disk. Numerous other aspects are disclosed.

摘要翻译： 用于调理抛光垫的装置和方法包括适于支撑调节盘的臂; 联接到所述臂的驱动机构; 以及驱动机构和调节盘之间的柔性联接件，其适于允许调节盘在将驱动机构的旋转运动传递到调节盘的同时倾斜。 公开了许多其他方面。

公开(公告)号：US20100035518A1

公开(公告)日：2010-02-11

申请号：US12187675

申请日：2008-08-07

申请人： Shou-Sung Chang ,  Hung Chih Chen ,  Stan D. Tsai ,  Yuchun Wang

发明人： Shou-Sung Chang ,  Hung Chih Chen ,  Stan D. Tsai ,  Yuchun Wang

IPC分类号： B24B49/12 ,  B24B1/00 ,  B24B7/00

CPC分类号： B24B37/042 ,  B24B49/02 ,  B24B53/017

摘要： A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polishing apparatus includes a controller that adjusts the rate of material removal of a conditioning disk when areas of the polishing surface are detected that are higher or lower than the adjacent areas of the polishing pad.

摘要翻译： 化学机械抛光装置包括测量系统，其在半导体晶片被处理时检测抛光垫的厚度，并且抛光垫的厚度减小。 化学机械抛光装置包括控制器，当检测到比抛光垫的相邻区域更高或更低的区域时，调节调节盘的材料去除速率。

公开(公告)号：US20090036035A1

公开(公告)日：2009-02-05

申请号：US12245758

申请日：2008-10-05

申请人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J.K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

发明人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J.K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

IPC分类号： B24B1/00 ,  B24B7/00

CPC分类号： B24B53/017 ,  B24B53/005 ,  B24B53/12

摘要： Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the polishing pad with a linearly variable amount of force. A first force is produced with the actuator. The first force is scaled by a linearly variable amount to a second force that is applied to the polishing pad by a conditioning disk. Numerous other aspects are disclosed.

摘要翻译： 用于调理抛光垫的装置和方法包括基座，枢转地联接到基座并适于支撑调节盘的臂以及联接到基座和臂的致动器。 致动器适于使臂以线性可变量的力将调节盘压靠抛光垫。 用致动器产生第一力。 第一力通过线性可变量被缩放到通过调节盘施加到抛光垫的第二力。 公开了许多其他方面。