公开(公告)号：US07728507B2

公开(公告)日：2010-06-01

申请号：US11518401

申请日：2006-09-08

申请人： Matthias Winter ,  Harald Jäger

发明人： Matthias Winter ,  Harald Jäger

IPC分类号： H01L23/495

CPC分类号： B22F3/225 ,  B22F7/062 ,  B22F2998/00 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01068 ,  H01L2924/12044 ,  B22F3/1021 ,  H01L2924/00014 ,  H01L2924/00

摘要： A process is specified for producing a radiation-emitting component comprising a housing body and a carrier for a radiation-emitting semiconductor body, in which the carrier is produced in an injection molding process from a molding compound containing a metal.

摘要翻译： 规定了一种用于制造辐射发射部件的方法，该辐射发射部件包括用于辐射发射半导体主体的外壳主体和载体，其中载体由注射成型工艺从含有金属的模塑料制成。

公开(公告)号：US20090212316A1

公开(公告)日：2009-08-27

申请号：US11991230

申请日：2006-08-24

申请人： Bert Braune ,  Herbert Brunner ,  Thomas Höfer ,  Harald Jäger ,  Raimund Schwarz

发明人： Bert Braune ,  Herbert Brunner ,  Thomas Höfer ,  Harald Jäger ,  Raimund Schwarz

IPC分类号： H01L33/00 ,  H01L31/0203 ,  H01L21/56

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/8592 ,  H01L2924/01055 ,  H01L2924/01065 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A surface-mounted component, comprising an optoelectronic semiconductor chip, a molded body integrally molded onto the semiconductor chip, a mounting area formed at least in places by a surface of the molded body, at least one connection location and side areas of the component which are produced by means of singulation.

摘要翻译： 一种表面安装部件，包括光电子半导体芯片，一体地模制在半导体芯片上的模制体，至少在模制体的表面的至少一部分形成的安装区域，该部件的至少一个连接位置和侧面区域 是通过分割生成的。

公开(公告)号：US07030491B2

公开(公告)日：2006-04-18

申请号：US10897719

申请日：2004-07-23

申请人： Yvonne Manz ,  Jürgen Steger ,  Harald Jäger ,  Herbert Rüger ,  Jürgen Matthes

发明人： Yvonne Manz ,  Jürgen Steger ,  Harald Jäger ,  Herbert Rüger ,  Jürgen Matthes

IPC分类号： H01L23/34

CPC分类号： H01L23/3735 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H05K1/0271 ,  H05K1/0306 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module, having a metal base plate for mounting on a heat sink. The module comprises a framelike housing, a cover, terminal elements, leading to the outside of the housing, for load contacts and auxiliary contacts, and having at least one electrically insulating substrate, disposed inside the housing. The substrate includes an insulating body and a plurality of metal connecting tracks, electrically insulated from one another. Power semiconductor components are located on the connecting tracks and connected to these connecting tracks via appropriate circuitry. The base plate has a stiffening structure, which extends near and along a side of the base plate, and in the longitudinal direction of the base plate. The stiffening structure is formed of the base plate material itself by deformation and protrudes out of the upper surface of the base plate.

摘要翻译： 一种功率半导体模块，具有用于安装在散热器上的金属基板。 模块包括框架式壳体，盖子，通向壳体外部的端子元件，用于负载触点和辅助触点，并且具有设置在壳体内部的至少一个电绝缘基板。 基板包括彼此电绝缘的绝缘体和多个金属连接轨道。 功率半导体元件位于连接轨道上，并通过适当的电路连接到这些连接轨道。 基板具有沿基板的一侧和沿着基板的纵向方向延伸的加强结构。 加强结构由基板材料本身通过变形形成并突出到基板的上表面之外。

公开(公告)号：US08735928B2

公开(公告)日：2014-05-27

申请号：US13807342

申请日：2011-06-27

申请人： Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

发明人： Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

摘要： A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places, the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary carrier; and producing individual surface-mountable semiconductor components by severing the molding.

摘要翻译： 一种制造可表面安装的半导体部件的方法，包括提供由塑料材料制成的辅助载体; 将至少一个插入件和至少一个光电子部件施加到辅助载体的安装表面; 将光电子部件和插入件封装在共同的模制件中，其中模制件至少在一些地方覆盖光电子部件和插入件，光电子部件和插入件彼此不直接接触，并且光电子部件和 插入件通过模制机械连接在一起; 移除辅助载体; 并通过切割模制件来生产单个的可表面安装的半导体部件。

公开(公告)号：US07223620B2

公开(公告)日：2007-05-29

申请号：US10735507

申请日：2003-12-11

申请人： Harald Jäger ,  Herbert Brunner

发明人： Harald Jäger ,  Herbert Brunner

IPC分类号： H01L21/027

CPC分类号： B29C45/14639 ,  B29L2011/00 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/00014

摘要： A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.

摘要翻译： 同时产生同一种类的多个发光二极管光源。 每个光源包括发光二极管芯片和发光转换元件，其转换由发光二极管芯片发射的电磁辐射的至少一部分的波长。 在第一种方法中，提供了一种施加到载体衬底的发光二极管层序列的层复合物。 晶片设置有沟槽，然后插入模具的空腔中。 包含发光转换材料的模塑料被驱入，使得沟槽至少部分地被模塑料填充。 然后去除模具，并且发光二极管光源与层复合物分离。 在第二过程中，提供以规则排列施加到公共载体的多个发光二极管芯片代替层复合物。