HEAT-DISSIPATING RESIN COMPOSITION, SUBSTRATE FOR LED MOUNTING, REFLECTOR, AND SUBSTRATE FOR LED MOUNTING HAVING REFLECTOR PORTION
    20.
    发明申请
    HEAT-DISSIPATING RESIN COMPOSITION, SUBSTRATE FOR LED MOUNTING, REFLECTOR, AND SUBSTRATE FOR LED MOUNTING HAVING REFLECTOR PORTION 审中-公开
    散热树脂组合物,用于具有反射器部分的LED安装的LED安装用基板,反射器和基板

    公开(公告)号:US20100072416A1

    公开(公告)日:2010-03-25

    申请号:US12447486

    申请日:2007-10-23

    IPC分类号: C09K5/00

    摘要: The objective of the present invention is to provide a heat-dissipating resin composition that is used for forming a substrate for LED mounting or a reflector provided on the substrate for LED mounting and is excellent in heat dissipation, electrical insulation, heat resistance and light resistance while an LED element emits light, a substrate for LED mounting and a reflector comprising the composition. The present composition comprises a thermoplastic resin such as modified PBT and a thermally conductive filler consisting of scaly boron nitride or the like, and has thermal deformation temperature of 120° C. or higher, a thermal conductivity of 2.0 W/(m·K) or higher, and a thermal emissivity of 0.7 or higher.

    摘要翻译: 本发明的目的是提供一种用于形成用于LED安装的基板或设置在用于LED安装的基板上的反射器的散热树脂组合物,并且散热性,电绝缘性,耐热性和耐光性优异 而LED元件发光,用于LED安装的基板和包括该组合物的反射器。 本发明的组合物包括热塑性树脂如改性PBT和由鳞状氮化硼等组成的导热填料,其热变形温度为120℃以上,导热率为2.0W /(m·K) 以上,热发射率为0.7以上。