公开(公告)号：US20130330910A1

公开(公告)日：2013-12-12

申请号：US13876199

申请日：2011-09-21

申请人： Shumpei Tanaka ,  Takeshi Matsumura

发明人： Shumpei Tanaka ,  Takeshi Matsumura

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85207 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/24331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a dicing die bond film in which yielding and breaking of the dicing film are prevented and in which the die bond film can be suitably broken with a tensile force. In the dicing die bond film of the present invention, the tensile strength of the contact part in which the outer circumference of the push-up jig contacts the dicing film at 25° C. is 15 N or more and 80 N or less and the yield point elongation is 80% or more, the tensile strength of the wafer bonding part of the dicing film at 25° C. is 10 N or more and 70 N or less and the yield point elongation is 30% or more, [(the tensile strength of the contact part)−(the tensile strength of the wafer bonding part)] is 0 N or more and 60 N or less, and the breaking elongation rate of the die bond film at 25° C. is more than 40% and 500% or less.

摘要翻译： 本发明提供了一种切割芯片接合膜，其中可以防止切割膜的屈服和断裂，并且其中模具接合膜可以用拉力适当地断裂。 在本发明的切割模片接合薄膜中，上推夹具的外周在25℃下与切割薄膜接触的接触部的拉伸强度为15N以上且80N以下， 屈服点伸长率为80％以上时，切割膜的晶片接合部在25℃下的拉伸强度为10N以上且70N以下，屈服点伸长率为30％以上，[（ 接触部的拉伸强度） - （晶片接合部的拉伸强度）]为0N以上且60N以下，并且在25℃下的模片接合膜的断裂伸长率大于40％ 和500％以下。

公开(公告)号：US08441374B2

公开(公告)日：2013-05-14

申请号：US12922343

申请日：2009-03-12

申请人： Akihisa Yokoyama ,  Takeshi Matsumura ,  Mitsuhisa Shida

发明人： Akihisa Yokoyama ,  Takeshi Matsumura ,  Mitsuhisa Shida

IPC分类号： G08G1/096

CPC分类号： G08G1/096 ,  G08G1/096783 ,  G08G1/096791

摘要： A traveling support device includes: a road-vehicle communication portion that receives first current-signal information relating to a signal displayed by a traffic signal at a first clock time, from a road side transmitter installed on a road; an inter-vehicle communication portion that receives second current-signal information relating to a signal displayed by the traffic signal at a second clock time, from another vehicle that receives the second current-signal information from the road side transmitter; and a signal cycle estimating portion that estimates signal cycle information relating to transition of the signal on the traffic signal on the basis of the first current-signal information received by the road-vehicle communication portion and the second current-signal information received by the inter-vehicle communication portion.

摘要翻译： 行驶辅助装置包括：道路车辆通信部，其从安装在道路上的道路侧变送器接收与第一时钟时间的交通信号所显示的信号有关的第一当前信号信息; 车辆间通信部，从接收来自所述道路侧发送机的所述第二电流信号信息的另一车辆接收与所述交通信号在第二时刻所显示的信号有关的第二电流信号信息; 以及信号周期估计部分，其基于由道路车辆通信部分接收的第一当前信号信息和由相互之间接收的第二当前信号信息来估计与交通信号上的信号的转变相关的信号周期信息 车体通信部。

公开(公告)号：US20130023257A1

公开(公告)日：2013-01-24

申请号：US13521161

申请日：2010-01-13

申请人： Shingo Murakami ,  Ayodele Damola ,  Johan Hjelm ,  Ryoji Kato ,  Takeshi Matsumura ,  Toshikane Oda

发明人： Shingo Murakami ,  Ayodele Damola ,  Johan Hjelm ,  Ryoji Kato ,  Takeshi Matsumura ,  Toshikane Oda

IPC分类号： H04W8/18

CPC分类号： H04W8/20 ,  H04W8/24

摘要： A system for providing a user terminal with configurations of a local network is provided. The system includes an obtaining unit configured to obtain the configurations of the local network and a telephone number corresponding to the local network, a storage unit configured to store the obtained configurations and the obtained telephone number such that the obtained configurations and the obtained telephone number are associated with each other, a receiving unit configured to receive a request for the configurations from the user terminal, the request comprising the telephone number corresponding to the local network, a retrieving unit configured to retrieve the configurations associated with the received telephone number from the storage unit, and a response unit configured to respond the retrieved configurations to the user terminal.

摘要翻译： 提供了一种用于向用户终端提供本地网络的配置的系统。 该系统包括：获取单元，被配置为获得本地网络的配置和对应于本地网络的电话号码;存储单元，被配置为存储所获得的配置和所获得的电话号码，使得所获得的配置和获得的电话号码是 相关联的接收单元，被配置为从所述用户终端接收对所述配置的请求的所述请求，所述请求包括与所述本地网络相对应的所述电话号码;检索单元，被配置为从所述存储器检索与所接收的电话号码相关联的配置 单元，以及响应单元，被配置为将所检索的配置响应到用户终端。

公开(公告)号：US20130020724A1

公开(公告)日：2013-01-24

申请号：US13615221

申请日：2012-09-13

申请人： Sadahito Misumi ,  Takeshi Matsumura ,  Kazuhito Hosokawa ,  Hiroyuki Kondo

发明人： Sadahito Misumi ,  Takeshi Matsumura ,  Kazuhito Hosokawa ,  Hiroyuki Kondo

IPC分类号： C09J163/00 ,  H01L21/56 ,  H01L23/28 ,  C09J133/00

CPC分类号： H01L25/0657 ,  H01L23/293 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10T428/1462 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175-C is 2000 Pa or more.

摘要翻译： 本发明包括临时固定步骤，将半导体元件临时固定在粘合片之间的粘附片上，将导线接合到半导体元件的引线键合步骤以及用密封树脂密封半导体元件的步骤，以及 其中175℃下的粘合片的损耗弹性模量为2000Pa以上。

公开(公告)号：US08277382B2

公开(公告)日：2012-10-02

申请号：US12224600

申请日：2007-03-02

申请人： Takeshi Matsumura ,  Tsuyoshi Mitake ,  Tomoyuki Miyazawa

发明人： Takeshi Matsumura ,  Tsuyoshi Mitake ,  Tomoyuki Miyazawa

IPC分类号： A61B8/14

CPC分类号： A61B8/08 ,  A61B5/0053 ,  A61B8/4209 ,  A61B8/4281 ,  A61B8/485

摘要： An automated pressing device (3) for an ultrasonic diagnosis apparatus according to the present invention is constituted by being provided with a probe holding member (21) including an attaching portion (31) to which a probe (2) is detachably attached and a griping portion (32) to which the attaching portion is slidably attached together with the probe attached thereto so as to permit advancing and retreating of an ultrasonic transmission and reception plane (27) of the probe, a motive power transmission wire (23) including a flexible cylindrical body (41) of which one end is secured to the griping portion in the probe holding member and an inner wire (42) that is inserted in the cylindrical body and of which one end is coupled to the attaching portion and a pressing motive power means (24) to which the other end of the cylindrical body in the motive power transmission wire is secured and that couples with the other end of the inner wire to advance and retreat the same. Thereby, a user friendly automated pressing device is realized that permits to eliminate influences of electromagnetic noises as well as permits to apply a stable pressing to a body surface of a subject via such as a motor and a spring.

摘要翻译： 根据本发明的超声波诊断装置的自动加压装置（3）由具有可拆卸地安装有探针（2）的安装部（31）的探针保持部件（21）构成， 所述安装部可滑动地安装在所述探头附近的所述探头的部分（32），以便允许所述探针的超声波发射和接收平面（27）前进和后退;动力传递线（23），包括柔性 圆柱体（41）的一端固定在探针保持构件的抓握部分上，以及内线（42），其插入到圆筒体中，并且一端联接到安装部分，并且按压动力 装置（24），其中动力传递线中的圆柱体的另一端固定到其上，并且与内线的另一端耦合以推进和缩回。 因此，实现了一种用户友好的自动加压装置，其允许消除电磁噪声的影响，以及允许通过诸如电动机和弹簧对被检者的身体表面施加稳定的按压。

公开(公告)号：US20120208009A1

公开(公告)日：2012-08-16

申请号：US13396532

申请日：2012-02-14

申请人： Takashi Oda ,  Naohide Takamoto ,  Takeshi Matsumura

发明人： Takashi Oda ,  Naohide Takamoto ,  Takeshi Matsumura

IPC分类号： B32B3/00 ,  B32B27/38

CPC分类号： C09D171/08 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/562 ,  H01L2924/0002 ,  Y10T428/265 ,  Y10T428/31511 ,  H01L2924/00

摘要： The present invention aims to provide a film for forming a protective layer that is capable of preventing cracks in a low dielectric material layer of a semiconductor wafer while suppressing an increase in the number of steps in the manufacture of a semiconductor device. This object is achieved by a film for forming a protective layer on a bumped wafer in which a low dielectric material layer is formed, including a support base, an adhesive layer, and a thermosetting resin layer, laminated in this order, wherein the melt viscosity of the thermosetting resin layer is 1×102 Pa·S or more and 2×104 Pa·S or less, and the shear modulus of the adhesive layer is 1×103 Pa or more and 2×106 Pa or less, when the thermosetting resin layer has a temperature in a range of 50 to 120° C.

摘要翻译： 本发明的目的在于提供一种形成保护层的膜，其能够防止半导体晶片的低电介质材料层中的裂纹，同时抑制半导体器件的制造中的步骤数量的增加。 该目的通过在其上形成低介电材料层的凸起晶片上形成保护层的膜来实现，该薄膜包括依次层叠的支撑基底，粘合层和热固性树脂层，其中熔体粘度 的热固性树脂层的摩尔比为1×102Pa·S以上且2×104Pa·S以下，粘合剂层的剪切模量为1×10 3 Pa以上2×10 6 Pa以下时， 树脂层的温度为50〜120℃。

公开(公告)号：US08237294B2

公开(公告)日：2012-08-07

申请号：US12696135

申请日：2010-01-29

申请人： Naohide Takamoto ,  Takeshi Matsumura

发明人： Naohide Takamoto ,  Takeshi Matsumura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/6836 ,  H01L23/544 ,  H01L23/562 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2223/5448 ,  H01L2224/16 ,  H01L2224/27436 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12042 ,  Y10T428/1467 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

摘要翻译： 本发明提供一种切片带集成晶片背面保护膜，其包括：切割带，其包括基材和形成在基材上的压敏粘合剂层; 以及形成在切割带的压敏粘合剂层上的晶片背面保护膜，其中晶片背面保护膜着色。 彩色晶片背面保护膜最好具有激光打标能力。 切割带集成的晶片背面保护膜可以适用于倒装芯片安装的半导体器件。

公开(公告)号：US08178420B2

公开(公告)日：2012-05-15

申请号：US12636869

申请日：2009-12-14

申请人： Takeshi Matsumura ,  Masaki Mizutani

发明人： Takeshi Matsumura ,  Masaki Mizutani

IPC分类号： H01L21/00

CPC分类号： H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/218 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/3512

摘要： A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

摘要翻译： 一种在支撑基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割/芯片接合膜，其中， 粘合剂层（2）与芯片粘合层（3）之间的界面在与芯片粘合层（3）中的工件附着区域（3a）相对应的界面（A）之间是不同的， 以及对应于另一区域（3b）的一部分或全部的界面（B），并且界面（A）的释放性高于界面（B）的剥离性。 切割/芯片接合膜在切割工件的保持性和脱模性之间的平衡优异，并且与芯片粘合层一起释放切割的切片工作。

公开(公告)号：US20120117192A1

公开(公告)日：2012-05-10

申请号：US13380260

申请日：2009-06-30

申请人： Martin Gerdes ,  Takeshi Matsumura ,  Toshikane Oda ,  Kenta Yasukawa

发明人： Martin Gerdes ,  Takeshi Matsumura ,  Toshikane Oda ,  Kenta Yasukawa

IPC分类号： G06F15/16

CPC分类号： H04L61/2528 ,  G06F9/54 ,  H04L65/1016 ,  H04L67/2895

摘要： An information processing system for offering a remote access from a device to a virtual service provided in a local network is provided. The virtual service invokes native services provisioned by a service provider. The system comprising: a management unit managing service information specifying a shortcut component of the service: an obtaining unit obtaining a request for the virtual service from the device; a receiving unit receiving the service information from the management unit; a specification unit specifying a shortcut component for the requested virtual service based on the received service information; an invoking unit executing the specified shortcut component by invoking native services to the service provider, and transferring the other component of the requested virtual service to the local network; a combination unit combining results; and a response unit responding the combined result to the device.

摘要翻译： 提供一种用于提供从设备到本地网络中提供的虚拟服务的远程访问的信息处理系统。 虚拟服务调用由服务提供商提供的本机服务。 所述系统包括：管理单元，管理指定所述虚拟服务的快捷部件的服务信息;获取单元，从所述设备获取对所述虚拟服务的请求; 接收单元，从所述管理单元接收所述服务信息; 指定单元，基于所接收的服务信息指定所请求的虚拟服务的快捷组件; 调用单元通过向服务提供者调用本地服务来执行指定的快捷方式组件，并将所请求的虚拟服务的其他组件传送到本地网络; 结合组合单位; 以及响应单元将组合的结果响应到设备。

公开(公告)号：US20120115776A1

公开(公告)日：2012-05-10

申请号：US13146575

申请日：2010-01-18

申请人： Takeshi Matsumura ,  Rie Yasuno ,  Chihiro Sugimoto ,  Noriko Tabayashi ,  Uiko Kagaya ,  Hiroko Miyashiro

发明人： Takeshi Matsumura ,  Rie Yasuno ,  Chihiro Sugimoto ,  Noriko Tabayashi ,  Uiko Kagaya ,  Hiroko Miyashiro

IPC分类号： A61K38/22 ,  A61P3/00 ,  C07K14/575

CPC分类号： C12N15/8257 ,  A23L33/17 ,  A23L33/18 ,  A61K38/22 ,  C07K14/5759

摘要： Disclosed is a technique that facilitates the oral ingestion of adiponectin in a large quantity and enables the expansion of the range of use applications of adiponectin. Specifically disclosed is an appetite control agent for oral administration, which comprises adiponectin as an active ingredient. Particularly, the appetite control agent comprises a transformant capable of expressing adiponectin. Also specifically disclosed is a food composition for controlling appetite, which comprises the appetite control agent.

摘要翻译： 公开了一种能够大量口服摄取脂联素的技术，能够扩大脂连蛋白的使用范围。 具体公开了口服给药的食欲调节剂，其包含脂联素作为活性成分。 特别地，食欲控制剂包括能够表达脂联素的转化体。 还具体公开了用于控制食欲的食物组合物，其包含食欲控制剂。