公开(公告)号：US6050884A

公开(公告)日：2000-04-18

申请号：US807810

申请日：1997-02-26

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

IPC分类号： B08B3/02 ,  B24B37/34 ,  B24B41/00 ,  H01L21/00 ,  B24B7/22

CPC分类号： B24B37/345 ,  B08B3/02 ,  B24B41/005 ,  H01L21/67051

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转台上的抛光表面上。 推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。 当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

公开(公告)号：US20080166949A1

公开(公告)日：2008-07-10

申请号：US11980667

申请日：2007-10-31

申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： B24B1/00 ,  B24B27/00

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

摘要翻译： 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US06905400B2

公开(公告)日：2005-06-14

申请号：US10060366

申请日：2002-02-01

申请人： Norio Kimura ,  You Ishii ,  Toyomi Nishi ,  Takayoshi Kawamoto ,  Takeshi Sakurai

发明人： Norio Kimura ,  You Ishii ,  Toyomi Nishi ,  Takayoshi Kawamoto ,  Takeshi Sakurai

IPC分类号： B24B49/00 ,  B24B53/00 ,  B24B1/00

CPC分类号： B24B53/017 ,  B24B37/005 ,  B24B49/00

摘要： A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

摘要翻译： 通过使修整器与抛光布接触来修整安装在转台上的抛光布，以恢复抛光布的抛光能力。 通过在抛光布的径向位置处测量抛光布的表面的高度来确定修整器相对于转盘的转速基于测量的高度的转速来进行修整， 并且通过按下梳妆台来修整抛光布正在旋转。 修整器具有环形金刚石颗粒层或环形SiC层。

公开(公告)号：US06413357B1

公开(公告)日：2002-07-02

申请号：US09666855

申请日：2000-09-21

申请人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

IPC分类号： C23F102

CPC分类号： B24B53/017 ,  B24B55/045

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

摘要翻译： 抛光装置用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平整镜面。 抛光装置包括：具有安装在其上表面上的抛光布的转台，用于支撑待抛光工件的顶环，并将工件压靠在抛光布上;以及修整工具，用于将抛光布修整在转台上。 抛光装置还包括覆盖转盘上表面以防止转台上的液体散落的盖，以及形成在盖的上壁中的插孔，用于插入顶环和修整工具。

公开(公告)号：US5885134A

公开(公告)日：1999-03-23

申请号：US843593

申请日：1997-04-16

申请人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

发明人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

IPC分类号： B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  B24B57/02 ,  H01L21/302 ,  B24B7/24

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  H01L21/302 ,  Y10T137/5762

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

公开(公告)号：US5679064A

公开(公告)日：1997-10-21

申请号：US561024

申请日：1995-11-21

申请人： Toyomi Nishi ,  Tamami Takahashi ,  Tetsuji Togawa

发明人： Toyomi Nishi ,  Tamami Takahashi ,  Tetsuji Togawa

IPC分类号： B24B37/20 ,  B24B37/22 ,  B24B7/04 ,  B24B29/02

CPC分类号： B24B37/14 ,  B24B37/015

摘要： A polishing apparatus includes a light weight and easily interchangeable cloth cartridge of high deformation resistance. The cloth cartridge is made by bonding a polishing cloth to a cartridge base member which includes a honeycomb structure member which can be sandwiched between top and bottom aluminum thin plates. Honeycomb structure member of various cell sizes and materials available in the marketplace can be used for this purpose quite effectively. The honeycomb structure members made of an aluminum material provides a stiff and thermally resistant cartridge base member. Cell spaces in the honeycomb structure member can be cooled or heated, depending on a nature of the polishing slurry used, by passing an appropriate fluid through the base member. This is made possible by providing flow holes in the cell walls separating the honeycomb cells. This approach is effective in producing optimum polishing performance by the cloth cartridge. Thermal control can be exercised generally or locally, depending on where heat is needed or should be removed.

摘要翻译： 抛光装置包括具有高变形阻力的重量轻且易于互换的布料盒。 布料筒通过将抛光布粘结到包括蜂窝状结构件的盒基部件上而制成，所述蜂窝结构件可夹在顶部和底部铝薄板之间。 市场上可用的各种电池尺寸和材料的蜂窝结构件可以非常有效地用于此目的。 由铝材料制成的蜂窝结构构件提供了坚硬和耐热的筒基座构件。 根据所使用的研磨浆料的性质，通过使适当的流体通过基底部件，蜂窝结构体中的细胞空间可被冷却或加热。 这可以通过在分离蜂窝单元的单元壁中提供流动孔来实现。 这种方法在通过布料盒产生最佳抛光性能方面是有效的。 通常或局部地可以进行热控制，这取决于需要或应该去除热量的地方。

公开(公告)号：US5645473A

公开(公告)日：1997-07-08

申请号：US621790

申请日：1996-03-28

申请人： Tetsuji Togawa ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Toyomi Nishi

IPC分类号： B24B37/00 ,  B24B37/10 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B37/107

摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a reduced height compared with conventional polishing apparatuses. The height reduction is achieved by disposing a drive motor for rotating a top ring below a turntable, and by making a swing shaft for loading/unloading of the workpiece hollow to accommodate a rotating shaft for transmitting rotation from the motor to the top ring.

摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置与常规抛光装置相比具有降低的高度。 降低高度是通过设置用于将顶环旋转到转盘下方的驱动马达，并且通过制造用于装载/卸载工件中空的摆动轴来容纳用于将旋转从马达传递到顶部环的旋转轴来实现的。

公开(公告)号：US06997782B2

公开(公告)日：2006-02-14

申请号：US10255793

申请日：2002-09-27

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

公开(公告)号：US06139677A

公开(公告)日：2000-10-31

申请号：US787916

申请日：1997-01-23

申请人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B55/04 ,  C23F1/02

CPC分类号： B24B53/017 ,  B24B55/045

摘要： A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

摘要翻译： 抛光装置70用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括：转台73，其上表面安装有抛光74布;顶环75，用于支撑待抛光的工件并将工件压靠在抛光布上;以及修整工具79，用于将抛光布修整在 转盘。 抛光装置还包括覆盖转台上表面以防止转台上的液体散落的盖10，以及形成在盖的上壁中的插入孔17和21，用于将顶环和修整工具穿过其中 。

公开(公告)号：US5931723A

公开(公告)日：1999-08-03

申请号：US864905

申请日：1997-05-29

申请人： Seiji Katsuoka ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Seiji Katsuoka ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： H01L21/302 ,  B08B15/02 ,  B24B55/12 ,  H01L21/02 ,  H01L21/304 ,  H01L21/3065 ,  B24B1/00

CPC分类号： B24B37/105 ,  B08B15/02 ,  B24B55/12

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has an exhaust device for exhausting air in the polishing apparatus. The polishing apparatus includes a housing, a polishing section housed in the housing for polishing a workpiece, a cleaning section housed in the housing for cleaning the workpiece which has been polished, and a base comprising a plurality of structural members for supporting at least one device in at least one of the cleaning section and the polishing section. At least one of the structural members has a fluid passage therein and intake openings to serve as an exhaust duct. The polishing apparatus further comprises a main exhaust duct communicating with the exhaust duct and extending to an exterior of the housing for exhausting air introduced in the exhaust duct.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置具有用于在抛光装置中排出空气的排气装置。 抛光装置包括壳体，容纳在用于抛光工件的壳体中的抛光部分，容纳在壳体中用于清洁已经被抛光的工件的清洁部分，以及包括多个结构部件的基部，用于支撑至少一个装置 在清洁部分和抛光部分中的至少一个中。 结构构件中的至少一个具有其中的流体通道和用作排气管的进气口。 抛光装置还包括与排气管道连通并延伸到壳体的外部的主排气管道，用于排出引入排气管道中的空气。