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公开(公告)号:US20110186901A1
公开(公告)日:2011-08-04
申请号:US12875566
申请日:2010-09-03
申请人: Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
发明人: Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
IPC分类号: H01L33/48
CPC分类号: H01L33/48 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要: According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.
摘要翻译: 根据一个实施例,LED封装包括第一引线框架,第二引线框架,LED芯片,线材和树脂体。 第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。 线将第一端子连接到第一引线框架。 树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面,底表面的一部分和边缘表面的一部分。 每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。 由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向 从第一引线框架提取。
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公开(公告)号:US08378347B2
公开(公告)日:2013-02-19
申请号:US13289587
申请日:2011-11-04
申请人: Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
发明人: Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
IPC分类号: H01L25/075 , H01L33/62 , H01L21/329 , H01L21/56 , H01L21/58 , H01L21/60 , H01L33/50
CPC分类号: H01L33/62 , H01L24/73 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L2224/26175 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554
摘要: According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.
摘要翻译: 根据一个实施例,LED封装包括彼此间隔开的第一和第二引线框架和LED芯片。 第一引线框架和第二引线框架中的每一个包括基部和从基部延伸的多个延伸部。 基部的下表面的一部分,基部的侧表面,延伸部的下表面和延伸部的侧表面被树脂覆盖。 基部的下表面的剩余部分和延伸部分的末端表面不被树脂覆盖。 基部的下表面的一部分包括第一引线框架的第一边缘和第二引线框架的第二边缘。 第一边缘和第二边缘彼此相对。
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公开(公告)号:US20120080674A1
公开(公告)日:2012-04-05
申请号:US13289587
申请日:2011-11-04
申请人: Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
发明人: Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
CPC分类号: H01L33/62 , H01L24/73 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L2224/26175 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554
摘要: According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.
摘要翻译: 根据一个实施例,LED封装包括彼此间隔开的第一和第二引线框架和LED芯片。 第一引线框架和第二引线框架中的每一个包括基部和从基部延伸的多个延伸部。 基部的下表面的一部分,基部的侧表面,延伸部的下表面和延伸部的侧表面被树脂覆盖。 基部的下表面的剩余部分和延伸部分的末端表面不被树脂覆盖。 基部的下表面的一部分包括第一引线框的第一边缘和第二引线框的第二边缘。 第一边缘和第二边缘彼此相对。
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公开(公告)号:US20120138967A1
公开(公告)日:2012-06-07
申请号:US13189654
申请日:2011-07-25
IPC分类号: H01L33/08
CPC分类号: H01L25/167 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/4809 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48471 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/4554
摘要: An LED package includes: 2n lead frames (n is a natural number); n LED chips provided above the 2n lead frames, one terminal of each of the n LED chips being connected to each of the n lead frames, another terminal of each of the n LED chips being connected to each of other n lead frames; a wire connected between the terminal and one of the lead frames; and a resin body covering the n LED chips, the wire, and a part of each of the 2n lead frames. The each of the 2n lead frames includes; a base having an upper surface and side surfaces, the upper surface and the side surfaces being covered with the resin body; and a plurality of extending portions extending from the base, one of the extending portions having tip surface which is exposed at one side surface of the resin body, another of the extending portions having tip surface which is exposed at another side surface of the resin body, the one side surface and the another side surface being perpendicular to each other, and. An outer shape of the resin body forms an outer shape of the LED package.
摘要翻译: LED封装包括:2n引线框(n为自然数); n个LED芯片设置在2n引线框架之上,n个LED芯片中的每一个的一个端子连接到n个引线框架中的每一个,n个LED芯片中的每一个的另一个端子连接到每个其他n个引线框架; 连接在所述端子和所述引线框架中的一个之间的导线; 以及覆盖n个LED芯片,导线以及2n个引线框架中的每一个的一部分的树脂体。 2n引线框架中的每一个包括: 具有上表面和侧面的基部,上表面和侧表面被树脂体覆盖; 以及从所述基部延伸的多个延伸部,所述延伸部中的一个具有在所述树脂体的一个侧面露出的末端面,另一个所述延伸部具有在所述树脂体的另一侧面露出的前端面 ,一侧表面和另一侧表面彼此垂直,并且。 树脂体的外形形成LED封装的外形。
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公开(公告)号:USD649942S1
公开(公告)日:2011-12-06
申请号:US29381737
申请日:2010-12-22
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公开(公告)号:USD656469S1
公开(公告)日:2012-03-27
申请号:US29396497
申请日:2011-06-30
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公开(公告)号:USD656110S1
公开(公告)日:2012-03-20
申请号:US29396487
申请日:2011-06-30
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公开(公告)号:USD629767S1
公开(公告)日:2010-12-28
申请号:US29366434
申请日:2010-07-26
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公开(公告)号:USD644191S1
公开(公告)日:2011-08-30
申请号:US29381723
申请日:2010-12-22
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公开(公告)号:USD658606S1
公开(公告)日:2012-05-01
申请号:US29381335
申请日:2010-12-17
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