摘要:
A lead frame including a stage and a plurality of terminals is embedded in a mold resin including a base portion for mounting a semiconductor chip (e.g. a microphone chip), a peripheral wall disposed in the periphery of the base portion, and an extension portion extended outside of the peripheral wall, thus forming a package base. A plurality of holes is formed in the peripheral wall so as to expose the internal connection surface of the stage and the internal connection surfaces of the terminals. An extension portion of the stage is exposed on the extension portion of the mold resin in which the surfaces of the terminals are embedded. An extension portion (e.g. a brim) of a cover composed of a conductive material is attached to the extension portion of the mold resin of the package base, thus completely producing a semiconductor device.
摘要:
A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.
摘要:
A semiconductor device is produced using a lead frame whose size is smaller than a prescribed center area of a semiconductor chip surrounded by its bonding pads, which are connected with electrodes supported by electrode supports and interconnected with outer frames and an intermediate frame of the lead frame via bonding wires. A series of projections and hollows are formed on the outer frames, wherein the electrode supports are interconnected with the hollows of the outer frames respectively. The semiconductor chip combined with the lead frame, is integrally enclosed in a resin under the condition where only the electrode surfaces are exposed to the exterior, thus forming a resin package. Then, the electrode supports locating the electrodes are cut out and partially removed, so that the electrodes are made electrically independent from each other.
摘要:
A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in proximity to the outer ends of the physical quantity sensor chips. It is possible to realize the inclination of stages without using molds, wherein absorption devices are used to absorb prescribed portions related to stages, which rotate about axial lines and are thus inclined with respect to a prescribed base. In manufacturing, a thin metal plate having a plurality of lead frames is placed on a base delimited by a clamp; then, intersecting points of intermediate portions formed between the lead frames are subjected to pressing so as to realize the inclination of stages.
摘要:
The present invention provides an EGR cooler that is easy to manufacture and can accelerate heat exchange. Round in section tubes are plastically deformed in one plane crossing centerlines thereof such that corrugated exhaust gas flow paths are formed inside the tubes.
摘要:
A physical quantity sensor is produced using a lead frame having at least one stage for mounting a physical quantity sensor chip and a frame having leads, wherein the physical quantity sensor chip is inclined with respect to the frame. A bonding device performs wire bonding so as to electrically connect the physical quantity sensor chip and leads, which are respectively located perpendicular to a capillary for discharging wires. The bonding device includes a wedge tool having a first planar surface for holding one ends of wires with leads and a second planar surface for holding the other ends of wires with the physical quantity sensor chip. The lead frame includes interconnection leads, having shape memory alloys, for interconnecting the stage and frame together. The physical quantity sensor chip can be mounted on the stage via an inclination member having a wedge shape.
摘要:
A data transmission system includes a first bus; a first bus master coupled to the first bus; a second bus master coupled to the first bus; a bus arbiter coupled to the first and second bus masters to provide an authorization of bus master operation to the first and second bus masters selectively; and a bus request holding circuit, which is coupled between the second bus master and the bus arbiter. The bus request holding circuit holds a bus request signal supplied from the second bus master for an appropriate period of time in response to a signal from the first bus master.
摘要:
An image forming apparatus including a cleaning device for removing toner, paper dust and other impurities left on an image carrier after image transfer with a cleaning member is disclosed. The cleaning member contacts the surface of the image carrier with variable pressure and remains, about the time when the image carrier stops moving after image formation, in contact with the surface with pressure lower than pressure capable of scrapping off the impurities. Before movement for image formation, the image carrier is driven in a reverse direction opposite to a forward direction assigned to image formation, stopped, and again moved in the forward direction and then in the reverse direction at least one time.
摘要:
An image forming apparatus includes an image bearing member, a latent image writing device that emits a plurality of laser beams, two adjacent laser beams of the plurality of laser beams partially overlapping in a sub-scanning direction, respectively, and forming a reference latent image on a surface of the image bearing member by performing repeated scanning of each laser beam on the surface of the image bearing member, a developing device that develops the reference latent image with toner into a reference toner image, and a detecting device that detects the density of the reference toner image. The quantity of light of each laser beam forming a subsequent latent image is adjusted according to the density of the reference toner image detected by the detecting device.
摘要:
A toner recycling device of an electrophotographic image forming apparatus conveys collected used toner to a developing device of the image forming apparatus. The toner recycling device includes a powder conveying pump that is driven to convey the collected used toner to the developing device of the image forming apparatus when an integrated value of predetermined numerical values, each based on a number of picture elements of an image to be formed, is equal to or greater than a constant value, and an adding device that adds a predetermined constant value to the integrated value when driving of an image bearing member of the image forming apparatus is detected.