公开(公告)号：US20150155402A1

公开(公告)日：2015-06-04

申请号：US14497655

申请日：2014-09-26

Applicant: Hitachi Metals, Ltd.

Inventor： Hideyuki SAGAWA ,  Keisuke FUJITO ,  Takayuki TSUJI ,  Hiromitsu KURODA

IPC: H01L31/0224 ,  B23K35/26 ,  B23K35/30 ,  C23C30/00 ,  C22C9/00 ,  C22C13/00 ,  C23C28/02 ,  B23K35/02 ,  B23K35/36

CPC classification number: H01L31/022425 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3602 ,  C22C9/00 ,  C22C13/00 ,  C23C10/28 ,  C23C28/021 ,  Y02B10/12 ,  Y02E10/50 ,  Y10T428/1266

Abstract: A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.

Abstract translation: 焊接材料包括主要包括铜的铜基金属材料，设置在铜基金属材料上的表面处理层，并且包括包含氧和具有比铜更高的氧亲和力的金属的非晶层， 以及设置在表面处理层上的Sn系焊锡镀层。

公开(公告)号：US20150151385A1

公开(公告)日：2015-06-04

申请号：US14495977

申请日：2014-09-25

Applicant: Hitachi Metals, Ltd.

Inventor： Yuichi ODA ,  Hideyuki SAGAWA ,  Kazuma KUROKI ,  Hiromitsu KURODA ,  Kotaro TANAKA ,  Hiroaki NUMATA

IPC: B23K35/00 ,  B23K1/20

CPC classification number: B23K35/002 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K35/00 ,  B23K35/007 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0238 ,  B23K35/28 ,  B23K35/282 ,  B23K35/286 ,  B23K35/30 ,  B23K35/302 ,  B23K2101/42 ,  B32B15/017 ,  B32B2307/702 ,  C25D5/50 ,  C25D7/0607 ,  C25D7/0614 ,  Y10T428/1266

Abstract: A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.

Abstract translation: 焊接材料包括主要包含Zn的Zn基金属材料，主要包含Al的Al基金属材料并且设置在Zn基金属材料上，主要由Cu构成的Cu基金属材料设置在 Al基金属材料和设置在Cu基金属材料上的表面处理层，并且包括包含氧和具有比铜更高的氧亲和力的金属的非晶层。

公开(公告)号：US20200243226A1

公开(公告)日：2020-07-30

申请号：US16738731

申请日：2020-01-09

Applicant: Hitachi Metals, Ltd.

Inventor： Kazufumi SUENAGA ,  Hideyuki SAGAWA ,  Takahiro SUGIYAMA

IPC: H01B13/14 ,  H01B11/00 ,  H01B13/22 ,  C23C28/02 ,  C23C18/18 ,  C25D5/34

Abstract: A linear shape member is composed of a linear shape electrical insulating body comprising irregularities on a surface, and a plating layer coating the surface of the electrical insulating body. An average irregularities spacing Sm of the irregularities is not more than 20.0 μm.

公开(公告)号：US20200234847A1

公开(公告)日：2020-07-23

申请号：US16740102

申请日：2020-01-10

Applicant: Hitachi Metals, Ltd.

Inventor： Kazufumi SUENAGA ,  Hideyuki SAGAWA ,  Takahiro SUGIYAMA

IPC: H01B7/02 ,  H01B3/44 ,  H01B13/14 ,  H05K9/00 ,  H01B13/00

Abstract: A linear shape member is composed of a linear shape electrical insulating body made of a fluoropolymer resin and including a plurality of crack shape grooves on a surface thereof, and a plating layer coating the surface of the electrical insulating body. The surface of the electrical insulating body meets at least either one of two conditions: that the surface of the electrical insulating body is not lower than 40 nm in arithmetic mean roughness Ra; and that the surface of the electrical insulating body is not lower than 80 nm in root mean square roughness Rms.

公开(公告)号：US20140283506A1

公开(公告)日：2014-09-25

申请号：US14163481

申请日：2014-01-24

Applicant: Hitachi Metals, Ltd.

Inventor： Kazuma KUROKI ,  Hideyuki SAGAWA ,  Hiromitsu KURODA ,  Yukio SUZUKI

IPC: F28D15/02 ,  B32B15/01 ,  F01N5/02

CPC classification number: B32B15/015 ,  B23K35/302 ,  F01N5/02 ,  F28D15/0233 ,  F28D15/0275 ,  F28F19/06 ,  F28F21/083 ,  Y10T428/1291

Abstract: A heat pipe includes a metal cylindrical body including a sealed storage space for storing water, a heat absorbing portion at one end portion of the cylindrical body to absorb heat by means of evaporation of the water, and a heat radiating portion at another end portion of the cylindrical body to radiate heat by means of condensation of steam generated by the evaporation. The cylindrical body includes a base material mainly including a stainless steel, a first metal layer mainly including a nickel and a second metal layer mainly including a copper, the first metal layer being formed on an inner surface of the base material and the second metal layer being formed on an inner surface of the first metal layer. The second metal layer is exposed to the storage space.

Abstract translation: 热管包括金属圆柱体，该金属圆柱体包括用于储存水的密封储存空间，在圆筒体的一个端部处的吸热部分，以通过水的蒸发吸收热量;以及在另一端部处的热辐射部分 圆柱体通过蒸发产生的蒸汽的冷凝来散热。 圆柱体包括主要包括不锈钢的基材，主要包括镍的第一金属层和主要包括铜的第二金属层，第一金属层形成在基材的内表面上，第二金属层 形成在第一金属层的内表面上。 第二金属层暴露于存储空间。

公开(公告)号：US20140209349A1

公开(公告)日：2014-07-31

申请号：US14091674

申请日：2013-11-27

Applicant: HITACHI METALS, LTD.

Inventor： Hideyuki SAGAWA ,  Seigi AOYAMA ,  Toru SUMI ,  Keisuke FUJITO ,  Detian HUANG

IPC: H01B11/18 ,  H01B13/016

CPC classification number: H01B1/026

Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.

Abstract translation: 高速传输电缆导体包括主要包括铜的芯材和在芯材表面周围形成的表面处理层。 表面处理层包括非晶层，其包括对铜的氧的亲和性高于铜的金属元素和氧。