Abstract:
A method for controlling a power-shift transmission comprising controlling a vehicle travel speed by simultaneously slipping two or more clutch packs associated with opposing directions of vehicle travel and adjusting an engine speed, according to a programmed response associated with a change in one or more of the engine speed, a torque converter slip, a selected direction of vehicle travel, and an accelerator position.
Abstract:
A dual mode control system for a hydraulic circuit (200) having a variable displacement pump (216) includes at least two actuators, each controlled by a respective valve. The valves are connected in series with a pressure sensor (250) measuring a pressure of fluid between the first valve (224) and the second valve (234) and relaying a signal to the electronic controller (202). The electronic controller (202) operates in a first mode, varying the displacement of the pump (216) based on a command signal operating at least one of the valves, and operates in a standby mode, varying the displacement of the pump (216) based on the signal from the sensor, when both valves are in their respective neutral positions.
Abstract:
A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.
Abstract:
A method for controlling a power-shift transmission comprising controlling a vehicle travel speed by simultaneously slipping two or more clutch packs associated with opposing directions of vehicle travel and adjusting an engine speed, according to a programmed response associated with a change in one or more of the engine speed, a torque converter slip, a selected direction of vehicle travel, and an accelerator position.
Abstract:
A skid steer vehicle has a chassis with four drive wheels suspended from the chassis that are damped by four damping cylinders. An electronic controller varies the damping of the cylinders in an automatic mode, based on certain operational parameters of the vehicle, and in a manual mode in response to operator selection of a desired degree of suspension damping.
Abstract:
A skid steer vehicle has a sprung suspension system including four wheels mounted on four swing arms that are pivotally coupled to the chassis of the vehicle. An electronic controller is connected both to position sensors coupled to the swing arms to sense the position of the swing arms and wheels with respect to the chassis and also to hydraulic cylinders that control the position of the swing arms and wheels. The electronic controller determines the average position of each suspension and controls the flow of fluid to the cylinders to keep the swing arms and wheels at their proper target height when vehicle load changes.
Abstract:
A skid steer vehicle with sprung suspensions is configured to lock the suspensions whenever the operator manipulates a manual control that generates a signal to move the loader arms or the bucket of the vehicle. The operator control, such as a joystick, sends a signal to an electronic controller indicating that the operator has moved the control and is thereby requesting the loader arms or bucket to move. The electronic controller responds to this signal by moving the loader arms or bucket and simultaneously locking the suspensions.
Abstract:
The invention relates to leadframe semiconductor packages mounted on a heat-sink and fabrication thereof. A system in package (SiP) comprises a leadframe having extension leads, configured with divisional heat sinks serving as power and ground nets. A set of semiconductor dies is attached by adhesive on the central region of the lead frame. Pluralities of wire bonds electrically connect the set of semiconductor dies to the leadframe and to the divisional heat sinks respectively. An encapsulation encloses the leadframe, but leaves the extension leads and the divisional heat sink uncovered, exposing a heat dissipating surface.
Abstract:
A semiconductor chip package is disclosed. The semiconductor chip package comprises a lead frame having a chip carrier, wherein the chip carrier has a first surface and an opposite second surface. A semiconductor chip is mounted on the first surface, having a plurality of bonding pads thereon, wherein the semiconductor chip has an area larger than that of the chip carrier. A package substrate comprises a central region attached to the second surface, having an area larger than that of the semiconductor chip, wherein some of the bonding pads of the semiconductor chip are electrically connected to a marginal region of the package substrate.
Abstract:
A machine control system for use with a machine having a power source and a transmission is disclosed. The machine control system may have a clutch configured to connect an output of the power source with an input of the transmission. The machine control system may also have a sensor configured to generate a signal indicative of a speed of the power source, and a controller in communication with the clutch and the sensor. The controller may be configured to vary an actuating force of the clutch based on the signal.