公开(公告)号：US20080266018A1

公开(公告)日：2008-10-30

申请号：US12007122

申请日：2008-01-07

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

IPC分类号： H01P1/20

CPC分类号： H01Q15/008 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括金属层; 以及包括金属板和通孔的多个蘑菇型结构。 这里，多个蘑菇型结构体可以以叠层结构形成在金属层上。 通过本发明，小型电磁带隙结构可以具有较低的带隙频率。

公开(公告)号：US20100132996A1

公开(公告)日：2010-06-03

申请号：US12466677

申请日：2009-05-15

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Kang-Wook Bong

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Kang-Wook Bong

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： In accordance with an embodiment of the present invention, an electromagnetic bandgap structure includes a plurality of conductive plates, and a multi-via connection part, which electrically connects any two of the plurality of conductive plates with each other. Here, the multi-via connection part includes: a first multi-via, including a first via, having one end part connected to one of the two conductive plates, and at least one other via connected in serial to the first via through a conductive trace; a second multi-via, including a second via, having one end part connected to the other of the two conductive plates, and at least one other via connected in serial to the second via through a conductive trace; and a conductive connection pattern, connecting any one of the vias included in the first multi-via and any one of the vias included in the second multi-via with each other.

摘要翻译： 根据本发明的实施例，电磁带隙结构包括多个导电板，以及多通孔连接部，其将多个导电板中的任何两个彼此电连接。 这里，多通孔连接部件包括：包括第一通孔的第一多通孔，其具有连接到两个导电板中的一个的一个端部，以及至少一个其它通孔，其连接到第一通孔，通过导电 跟踪; 包括连接到所述两个导电板中的另一个的一个端部的第二多通孔，以及至少一个通过导电迹线串联连接到所述第二通孔的另一通孔; 以及导电连接图案，其将包括在第一多通孔中的任何一个通孔和包括在第二多通孔中的任何一个通孔彼此连接。

公开(公告)号：US20090236141A1

公开(公告)日：2009-09-24

申请号：US12285133

申请日：2008-09-29

申请人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

IPC分类号： H05K1/02

CPC分类号： H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.

摘要翻译： 根据本发明的实施例，电磁带隙结构可以包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板。 在本发明的电磁带隙结构中，第一缝合通孔可以通过允许第一缝合通孔的一部分通过一个导电板上的平面连接而将一个导电板电连接到另一个导电板， 缝合通孔可以通过允许第二缝合通孔的一部分通过一个导电板下面的平坦表面连接而将一个导电板电连接到另一个导电板。

公开(公告)号：US08164006B2

公开(公告)日：2012-04-24

申请号：US12285133

申请日：2008-09-29

申请人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invention, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.

摘要翻译： 根据本发明的实施例，电磁带隙结构可以包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板。 在本发明的电磁带隙结构中，第一缝合孔可以通过允许第一缝合通孔的一部分通过一个导电板上的平面连接而将一个导电板电连接到另一导电板， 缝合通孔可以通过允许第二缝合通孔的一部分通过一个导电板下面的平坦表面连接而将一个导电板电连接到另一个导电板。

公开(公告)号：US08598468B2

公开(公告)日：2013-12-03

申请号：US13437254

申请日：2012-04-02

申请人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates.

摘要翻译： 一种电磁带隙结构，包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板，其中所述第一缝合通孔将所述第一缝合通孔的一部分通过平面 表面在一个导电板的上方或下方，并且第二缝合通孔通过允许第二缝合通孔的一部分通过不同于平面的平面表面连接一个导电板到另一个导电板，通过该平面 第一缝合通孔的部分被连接，两个平面被放置在相同的方向上，基于导电板。

公开(公告)号：US20110069470A1

公开(公告)日：2011-03-24

申请号：US12654371

申请日：2009-12-17

申请人： Kang-Wook Bong ,  Han Kim ,  Mi-Ja Han

发明人： Kang-Wook Bong ,  Han Kim ,  Mi-Ja Han

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627

摘要： An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes a first area having a ground layer and a power layer, a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes a plurality of first conductive plates placed along the side portion of the first area, a plurality of second conductive plates placed on a planar surface that is different from the first conductive plates so as to overlap with the first conductive plates, and a via configured to connect the first conductive plate and the second conductive plate.

摘要翻译： 公开了一种EMI降噪板。 具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括具有接地层和功率层的第一区域，放置在其中具有电磁带隙结构的第一区域的侧部中的第二区域。 电磁带隙结构包括沿着第一区域的侧面部分放置的多个第一导电板，多个第二导电板，放置在与第一导电板不同的平面上，以与第一导电板重叠， 以及经配置以连接第一导电板和第二导电板的通孔。

公开(公告)号：US08853560B2

公开(公告)日：2014-10-07

申请号：US13411005

申请日：2012-03-02

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US20090145646A1

公开(公告)日：2009-06-11

申请号：US12230871

申请日：2008-09-05

申请人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

发明人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

IPC分类号： H01G4/228 ,  H05K1/18

CPC分类号： H01P1/20327 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

摘要： According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.

摘要翻译： 根据本发明，电路板可以包括电介质层; 多个导电板; 以及缝合通孔，以将两个导电板彼此电连接。 这里，缝合通孔可以分别包括通过电介质层的第一通孔和第二通孔，并且具有一个端部与两个导电板中的每一个放置在同一平面上; 连接图案，其每个端部分别连接到第一通孔和第二通孔的另一端部; 和第一延伸图案，其放置在与导电板之一相同的平面上，并且具有一个端部连接到第一通孔的一个端部，并且端部连接到导电板之一。

公开(公告)号：US08422248B2

公开(公告)日：2013-04-16

申请号：US13137504

申请日：2011-08-22

申请人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

摘要： An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.

摘要翻译： 一种电磁带隙结构，包括：第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，其具有连接到所述第一金属层的一个端部; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 以及第二金属层，层叠在第二电介质层中，而通孔的另一端部连接到放置在形成在金属板中的孔中的通孔焊盘，并且通路焊盘通过 金属线。

公开(公告)号：US08420949B2

公开(公告)日：2013-04-16

申请号：US12230871

申请日：2008-09-05

申请人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

发明人： Mi-Ja Han ,  Dae-Hyun Park ,  Han Kim

IPC分类号： H05K1/16 ,  H01G4/228

CPC分类号： H01P1/20327 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

摘要： According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.