公开(公告)号：US10469130B2

公开(公告)日：2019-11-05

申请号：US14581656

申请日：2014-12-23

Applicant: Intel Corporation

Inventor： Anand Konanur ,  Steven Gaskill ,  Ayeshwarya B. Mahajan ,  Ulun Karacaoglu ,  Sukanya Sundaresan

IPC: H04B5/00 ,  H04W4/80

Abstract: Techniques related to wireless communication of an input device are described herein. An apparatus may include a display at the input device, a wireless transmission architecture, and a wireless receiver. The wireless transmission architecture is to broadcast a signal to the display, and wireless receiver to receive the broadcast signal at the display. The broadcast signal is configured to provide a power signal to initiate operations of the display, a data signal to provide content to be displayed at the display, or any combination thereof.

公开(公告)号：US09787366B1

公开(公告)日：2017-10-10

申请号：US15197184

申请日：2016-06-29

Applicant: Intel Corporation

Inventor： Hooman Shirani-Mehr ,  Ahmad Farbod Khoshnevis ,  Anand Konanur ,  Steven Gaskill

IPC: H04B7/00 ,  H04B5/00 ,  H04M3/42 ,  H04W8/00 ,  H02J7/02 ,  H02J50/90

CPC classification number: H04B5/0037 ,  H02J7/025 ,  H02J50/12 ,  H02J50/90 ,  H04W8/005

Abstract: This disclosure describes systems, methods, and apparatus related to near field communication (NFC) detection. A device may determine a first device in proximity to a charging area of the device. The device may detect a presence of a first NFC device in proximity to the charging area of the device. The device may determine the first NFC device is associated with the first device. The device may determine to transition the device to one or more operating modes based at least in part on the presence of the first NFC device.

公开(公告)号：US09773241B2

公开(公告)日：2017-09-26

申请号：US13795981

申请日：2013-03-12

Applicant: Intel Corporation

Inventor： Songnan Yang ,  Farid Adrangi ,  Ulun Karacaoglu ,  Anand Konanur ,  Denny Iriawan ,  Thomas J Stepek

IPC: G06Q20/32 ,  G06K7/10 ,  H03G3/30

CPC classification number: G06Q20/3278 ,  G06K7/10158 ,  G06K7/10237 ,  H03G3/3042

Abstract: Described herein are architectures, platforms and methods for dynamic amplification/boosting of near field communications (NFC) antenna transmission power in a device during NFC related functions that require increase in an NFC antenna transmission power such as a payment transaction. For example, to comply with Europay MasterCard and Visa (EMVco) standards with regard to higher NFC antenna transmission power during the EMVco transactions, the NFC antenna transmission power may be dynamically controlled to maximize efficiency of a battery/power supply of the device.

公开(公告)号：US09685792B2

公开(公告)日：2017-06-20

申请号：US14197598

申请日：2014-03-05

Applicant: INTEL CORPORATION

Inventor： Songnan Yang ,  Janardhan Koratikere Narayan ,  Anand Konanur ,  Jonathan Rosenfeld ,  Sreenivas Kasturi ,  Kwan Ho Lee ,  Ulun Karacaoglu

IPC: H01F27/42 ,  H02J5/00 ,  H01F27/28 ,  H01F38/14 ,  H02J7/02 ,  H02J17/00

CPC classification number: H01F27/28 ,  H01F38/14 ,  H02J5/005 ,  H02J7/025 ,  H02J17/00 ,  H02J50/10 ,  H02J50/12 ,  H02J50/40 ,  Y10T29/4902

Abstract: Techniques of magnetic field distribution are described herein. The techniques may include forming a wireless charging component including a driving coil to receive a driven current generating a magnetic field. An outer turn of a parasitic coil may be formed, wherein the outer turn is adjacent to the driving coil. An inner turn of the parasitic coil may be formed, wherein an inductive coupling between the driving coil and the parasitic coil generates a redistribution of a portion of the magnetic field at the inner turn.

公开(公告)号：US09673511B2

公开(公告)日：2017-06-06

申请号：US14492921

申请日：2014-09-22

Applicant: Intel Corporation

Inventor： Kwan Ho Lee ,  Songnan Yang ,  Anand Konanur ,  Ulun Karacaoglu

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/44 ,  H01Q13/10 ,  H01Q21/30 ,  H01Q5/307 ,  H01Q1/22 ,  H01Q25/00

CPC classification number: H01Q1/243 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q1/44 ,  H01Q5/307 ,  H01Q13/10 ,  H01Q13/106 ,  H01Q21/30 ,  H01Q25/00

Abstract: An antenna element forms a ring slot antenna comprising a first slot and second slot. The antenna element is located on a first surface of a conductive chassis that encases a body or a volume for wireless communication signals to be received or transmitted. A coupling component is located on an opposite side of the conductive chassis and behind the antenna element. The coupling component facilitates a coupling between a communication component and the antenna element as a function of the orientation and geometric shape of the coupling component to facilitate different resonant frequencies via the first and second slots of the antenna element.

公开(公告)号：US09601823B2

公开(公告)日：2017-03-21

申请号：US15092886

申请日：2016-04-07

Applicant: INTEL CORPORATION

Inventor： Anand Konanur ,  Ulun Karacaoglu ,  Songnan Yang ,  Shawn McEuen

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/40 ,  H01Q21/28

CPC classification number: H01Q1/243 ,  H01Q1/2266 ,  H01Q1/40 ,  H01Q21/28

Abstract: Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.

公开(公告)号：US20160087328A1

公开(公告)日：2016-03-24

申请号：US14492921

申请日：2014-09-22

Applicant: Intel Corporation

Inventor： Kwan Ho Lee ,  Songnan Yang ,  Anand Konanur ,  Ulun Karacaoglu

IPC: H01Q1/24 ,  H01Q5/307 ,  H01Q13/10

CPC classification number: H01Q1/243 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q1/44 ,  H01Q5/307 ,  H01Q13/10 ,  H01Q13/106 ,  H01Q21/30 ,  H01Q25/00

Abstract: An antenna element forms a ring slot antenna comprising a first slot and second slot. The antenna element is located on a first surface of a conductive chassis that encases a body or a volume for wireless communication signals to be received or transmitted. A coupling component is located on an opposite side of the conductive chassis and behind the antenna element. The coupling component facilitates a coupling between a communication component and the antenna element as a function of the orientation and geometric shape of the coupling component to facilitate different resonant frequencies via the first and second slots of the antenna element.

Abstract translation: 天线元件形成包括第一槽和第二槽的环形槽天线。 天线元件位于导电底盘的第一表面上，该第一表面包围要接收或发送的无线通信信号的主体或音量。 耦合部件位于导电底盘的相对侧并且位于天线元件之后。 耦合部件促进通信部件和天线元件之间的耦合作为耦合部件的取向和几何形状的函数，以促进经由天线元件的第一和第二狭槽的不同谐振频率。

公开(公告)号：US09160061B2

公开(公告)日：2015-10-13

申请号：US14280796

申请日：2014-05-19

Applicant: Intel Corporation

Inventor： Anand Konanur ,  Ulun Karacaoglu ,  Songnan Yang ,  Shawn McEuen

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/40 ,  H01Q21/28

CPC classification number: H01Q1/243 ,  H01Q1/2266 ,  H01Q1/40 ,  H01Q21/28

Abstract: Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.

Abstract translation: 本文通常描述用于提供模内层压天线的系统和方法的实施例。 可以描述和要求保护其他实施例。