公开(公告)号：US20190079567A1

公开(公告)日：2019-03-14

申请号：US15768915

申请日：2015-11-16

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Syadwad Jain ,  Zhizhong Tang ,  Wei Hu

IPC: G06F1/20 ,  H01L21/48 ,  H01L23/40 ,  H01L23/373

Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.

公开(公告)号：US10056314B2

公开(公告)日：2018-08-21

申请号：US14736120

申请日：2015-06-10

Applicant: INTEL CORPORATION

Inventor： Randall D. Lowe, Jr. ,  Syadwad Jain ,  James C. Matayabas, Jr.

IPC: H01L23/373 ,  C08L83/04 ,  C09C3/12 ,  H01L23/367 ,  H01L23/42 ,  B32B5/16 ,  C08K3/22 ,  C08K3/08 ,  C08K3/28

CPC classification number: H01L23/3737 ,  B32B5/16 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2003/282 ,  C08L83/04 ,  C09C3/12 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  C08K3/28 ,  C08K3/10

Abstract: A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.

公开(公告)号：US10580717B2

公开(公告)日：2020-03-03

申请号：US15774990

申请日：2016-01-11

Applicant: Intel Corporation

Inventor： Boxi Liu ,  Hemanth K. Dhavaleswarapu ,  Syadwad Jain ,  James C. Matayabas, Jr.

IPC: H01L23/373 ,  H01L23/367 ,  H01L25/065 ,  H01L25/18 ,  H01L23/42 ,  H01L23/00 ,  H01L23/48 ,  H01L21/48 ,  H01L23/498 ,  H01L23/15 ,  H01L23/538

Abstract: A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to the substrate, a second semiconductor die coupled to the substrate, a heat spreader coupled to the die, wherein the first die has a first distance to the heat spreader and the second die has a second distance to the heat spreader, a first filled thermal interface material (TIM) between the first die and the heat spreader to mechanically and thermally couple the heat spreader to the die, and a second filled TIM between the second die and the heat spreader to mechanically and thermally couple the heat spreader to the second die.

公开(公告)号：US20170186628A1

公开(公告)日：2017-06-29

申请号：US14998122

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Thomas John Fitzgerald ,  Kumaran Murugesan Chakravarthy ,  Syadwad Jain ,  Wei Hu ,  Zhizhong Tang

IPC: H01L21/48 ,  H01L23/367 ,  F28F21/08 ,  H01L23/373

CPC classification number: H01L23/3736 ,  H01L21/4878 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/16172 ,  H01L2924/16251

Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.

公开(公告)号：US09070660B2

公开(公告)日：2015-06-30

申请号：US13844243

申请日：2013-03-15

Applicant: INTEL CORPORATION

Inventor： Randall Lowe, Jr. ,  Syadwad Jain ,  James C. Matayabas, Jr.

IPC: H01L23/373 ,  C08L83/04 ,  H01L23/367 ,  H01L23/42 ,  B32B5/16 ,  C08K3/22 ,  C08K3/08 ,  C08K3/28

CPC classification number: H01L23/3737 ,  B32B5/16 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2003/282 ,  C08L83/04 ,  C09C3/12 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  C08K3/28 ,  C08K3/10

Abstract: A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.

Abstract translation: 描述了具有增强的导热性的聚合物热界面材料。 在一个实例中，将乙烯基封端的硅油与硅氧烷扩链剂和包含至少85重量％的材料的导热填料组合，并且包含具有一定形状和尺寸的表面润湿颗粒。 该材料可以用于例如将微电子封装内部的部件粘接。