公开(公告)号：US11756856B2

公开(公告)日：2023-09-12

申请号：US16149909

申请日：2018-10-02

Applicant: Intel Corporation

Inventor： Krishna Vasanth Valavala ,  Ravindranath Mahajan ,  Chandra Mohan Jha ,  Kelly Lofgreen ,  Weihua Tang

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/38 ,  H01L29/43 ,  H01L25/18 ,  H10N10/17

CPC classification number: H01L23/373 ,  H01L23/3114 ,  H01L23/38 ,  H01L25/18 ,  H01L29/43 ,  H10N10/17

Abstract: Embodiments include a microelectronic device package structure having a first die on the substrate. One or more additional dice are on the first die, and a thermal electric cooler (TEC) is on the first die adjacent at least one of the one or more additional dice. A dummy die is on the TEC, wherein the dummy die is thermally coupled to the first die.

公开(公告)号：US11676883B2

公开(公告)日：2023-06-13

申请号：US16355596

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Je-Young Chang ,  Kelly Lofgreen ,  Weihua Tang ,  Aastha Uppal

IPC: H01L23/38 ,  H01L35/10 ,  H01L35/30 ,  H01L35/18 ,  H01L35/16

CPC classification number: H01L23/38 ,  H01L35/10 ,  H01L35/16 ,  H01L35/18 ,  H01L35/30

Abstract: An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.

公开(公告)号：US20210398966A1

公开(公告)日：2021-12-23

申请号：US17462794

申请日：2021-08-31

Applicant: Intel Corporation

Inventor： Robert L. Sankman ,  Pooya Tadayon ,  Weihua Tang ,  Chandra M. Jha ,  Zhimin Wan

IPC: H01L25/18 ,  H01L23/48 ,  H01L23/42 ,  H01L23/00

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a plurality of dies, a logic die coupled to the plurality of dies, and a dummy die thereon. In selected examples, the dummy die is located between the logic die and the plurality of silicon dies. In selected examples, the dummy die is attached to the logic die.

公开(公告)号：US20200273772A1

公开(公告)日：2020-08-27

申请号：US16287116

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Aastha Uppal ,  Omkar Karhade ,  Ram Viswanath ,  Je-Young Chang ,  Weihua Tang ,  Nitin Deshpande ,  Mitul Modi ,  Edvin Cetegen ,  Sanka Ganesan ,  Yiqun Bai ,  Jan Krajniak ,  Kumar Singh

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/427 ,  H01L25/18 ,  H01L21/56

Abstract: An apparatus is provided which comprises: a package substrate, an integrated circuit device coupled to a surface of the package substrate, a first material on the surface of the package substrate, the first material contacting one or more lateral sides of the integrated circuit device, the first material extending at least to a surface of the integrated circuit device opposite the package substrate, two or more separate fins over a surface of the integrated circuit device, the two or more fins comprising a second material having a different composition than the first material, and a third material having a different composition than the second material, the third material over the surface of the integrated circuit device and between the two or more fins. Other embodiments are also disclosed and claimed.

公开(公告)号：US20200219790A1

公开(公告)日：2020-07-09

申请号：US16241158

申请日：2019-01-07

Applicant: INTEL CORPORATION

Inventor： Aastha Uppal ,  Je-Young Chang ,  Weihua Tang ,  Minseok Ha

IPC: H01L23/427 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: An integrated circuit assembly may be formed using a phase change material as an electromagnetic shield and as a heat dissipation mechanism for the integrated circuit assembly. In one embodiment, the integrated circuit assembly may comprise an integrated circuit package including a first substrate having a first surface and an opposing second surface, and at least one integrated circuit device having a first surface and an opposing second surface, wherein the at least one integrated circuit device is electrically attached by the first surface thereof to the first surface of the first substrate; and a phase change material formed on the integrated circuit package.

公开(公告)号：US11664294B2

公开(公告)日：2023-05-30

申请号：US16241158

申请日：2019-01-07

Applicant: INTEL CORPORATION

Inventor： Aastha Uppal ,  Je-Young Chang ,  Weihua Tang ,  Minseok Ha

IPC: H01L21/56 ,  H01L23/34 ,  H01L23/427 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/427 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/09 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L2924/14

Abstract: An integrated circuit assembly may be formed using a phase change material as an electromagnetic shield and as a heat dissipation mechanism for the integrated circuit assembly. In one embodiment, the integrated circuit assembly may comprise an integrated circuit package including a first substrate having a first surface and an opposing second surface, and at least one integrated circuit device having a first surface and an opposing second surface, wherein the at least one integrated circuit device is electrically attached by the first surface thereof to the first surface of the first substrate; and a phase change material formed on the integrated circuit package.

公开(公告)号：US20220384306A1

公开(公告)日：2022-12-01

申请号：US17330870

申请日：2021-05-26

Applicant: Intel Corporation

Inventor： Weihua Tang ,  Chandra Mohan Jha ,  Nicholas S. Haehn

IPC: H01L23/433 ,  H01L23/00

Abstract: A thermal interface structure for facilitating heat transfer from an integrated circuit device to a heat dissipation device may be fabricated to include at least one conductive wire structure wherein each conductive wire structure includes a conductive wire having a first end, a first barrier layer adjacent the first end of the conductive wire, and a first solder structure adjacent the first barrier layer. The thermal interface structure may further include an encapsulation material substantially encapsulating each conductive wire structure and a first solder layer abutting the encapsulation material and abutting the first solder structure of each conductive wire structure.

公开(公告)号：US11444003B2

公开(公告)日：2022-09-13

申请号：US16144584

申请日：2018-09-27

Applicant: INTEL CORPORATION

Inventor： Zhimin Wan ,  Chia-Pin Chiu ,  Chandra Mohan Jha ,  Weihua Tang ,  Shankar Devasenathipathy

IPC: H01L23/473 ,  H01L25/18 ,  H01L23/467 ,  H01L23/367 ,  H01L23/373

Abstract: An integrated heat spreader includes channel structures assembled in a frame. Each channel structure is independent of the other, and can be used to dissipate heat from integrated circuitry at a specific location within a package, and without allowing heat from that particular location to propagate to integrated circuitry at other locations within the package. Each channel structure can be implemented with metal having a high thermal conductivity (e.g., copper). The channel structures can be used in conjunction with liquid-based cooling or air-based cooling. The frame can be implemented with low thermal conductivity molding compound or plastic so the heat transfer from one channel structure to another is inhibited. The channel structures can have different configurations (e.g., straight, pillars, and/or pin fins) to provide different rates of flow, mixing, and/or cooling. The flow direction of air or liquid for the channel structures can be the same (parallel) or different (counter).

公开(公告)号：US20210249375A1

公开(公告)日：2021-08-12

申请号：US16785014

申请日：2020-02-07

Applicant: INTEL CORPORATION

Inventor： Feras Eid ,  Joe Walczyk ,  Weihua Tang ,  Akhilesh Rallabandi ,  Marco Aurelio Cartas Ayala

IPC: H01L23/00

Abstract: An integrated circuit (IC) die structure comprises a substrate material comprising silicon. Integrated circuitry is over a first side of the substrate material. A composite layer is in direct contact with a second side of the substrate material. The second side is opposite the first side. The composite layer comprises a first constituent material associated with a first linear coefficient of thermal expansion (CTE), and a first thermal conductivity exceeding that of the substrate. The composite layer also comprises a second constituent material associated with a second CTE that is lower than the first, and a second thermal conductivity exceeding that of the substrate.