中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

22 records (took 0.014 seconds)

    ELECTRONIC DEVICE
    11.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20220216302A1

    公开(公告)日：2022-07-07

    申请号：US17561716

    申请日：2021-12-24

    Applicant: Innolux Corporation

    Inventor： Chen-Lin Yeh ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Jen-Hai Chi ,  Yi-Hung Lin ,  Yan-Zheng Wu

    IPC: H01L29/08 ,  H05K1/11 ,  H05K3/34

    Abstract: Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

    ELECTRONIC DEVICE
    16.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20220165726A1

    公开(公告)日：2022-05-26

    申请号：US17513865

    申请日：2021-10-28

    Applicant: Innolux Corporation

    Inventor： Chin-Lung Ting ,  Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Chung-Kuang Wei ,  Cheng-Hsu Chou

    IPC: H01L27/06 ,  H01L29/778 ,  H01L29/93

    Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

    METHOD OF TRANSFERRING TARGET OBJECT TO TARGET SUBSTRATE
    17.
    发明申请
    METHOD OF TRANSFERRING TARGET OBJECT TO TARGET SUBSTRATE 有权

    公开(公告)号：US20250125178A1

    公开(公告)日：2025-04-17

    申请号：US18830572

    申请日：2024-09-10

    Applicant: Innolux Corporation

    Inventor： Chen-Lin Yeh ,  Yan-Zheng Wu

    IPC: H01L21/68 ,  H01L21/67 ,  H01L21/687

    Abstract: Disclosed is a method of transferring a target object to a target substrate including the following steps; first, defining a plurality of units recurring on the target substrate, wherein one of the plurality of units is made up of a plurality of target locations on the target substrate; next, disposing the plurality of target objects on a unit transfer stamp, wherein the plurality of target objects on the unit transfer stamp correspond to the plurality of target locations; afterwards, transferring the plurality of target objects to the target substrate using the unit transfer stamp; then, transferring at least one target object to the remaining target locations on the target substrate.

    RECONFIGURABLE SURFACE AND MANUFACTURING METHOD THEREOF
    18.
    发明公开
    RECONFIGURABLE SURFACE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240356234A1

    公开(公告)日：2024-10-24

    申请号：US18602036

    申请日：2024-03-12

    Applicant: Innolux Corporation

    Inventor： Yan-Zheng Wu ,  Yung-Wei Chen ,  Chen-Lin Yeh

    IPC: H01Q15/00 ,  H01Q3/44

    CPC classification number: H01Q15/002 ,  H01Q3/44

    Abstract: Disclosed is a reconfigurable surface configured to modulate a phase of an electromagnetic wave. The reconfigurable surface includes a first substrate, a plurality of modulating units, and a ground signal layer. The plurality of modulating units are disposed on the first substrate. One of the plurality of modulating units includes a first electrode, a second electrode, and a modulating medium. The first electrode is disposed on the first substrate. The second electrode is disposed adjacent to the first electrode. The modulating medium is located between the first electrode and the second electrode. The ground signal layer is disposed under the first substrate. A manufacturing method of a reconfigurable surface is also provided.

Patent Agency Ranking