公开(公告)号：US20230245949A1

公开(公告)日：2023-08-03

申请号：US17898410

申请日：2022-08-29

Applicant: InnoLux Corporation

Inventor： Chin-Lung TING ,  Chung-Kuang WEI ,  Cheng-Chi WANG ,  Yeong-E CHEN ,  Yi-Hung LIN

IPC: H01L23/44 ,  H05K1/02 ,  H01L25/065 ,  H01L23/498 ,  H01L25/075 ,  H01L23/00

CPC classification number: H01L23/44 ,  H05K1/0209 ,  H01L25/0655 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/0753 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/12041 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K2201/064

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

公开(公告)号：US20220087028A1

公开(公告)日：2022-03-17

申请号：US17486935

申请日：2021-09-28

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan CHOU ,  Yi-Hung LIN

IPC: H05K3/00 ,  H01L21/48 ,  H05K3/06

Abstract: A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

公开(公告)号：US20210399412A1

公开(公告)日：2021-12-23

申请号：US17462516

申请日：2021-08-31

Applicant: InnoLux Corporation

Inventor： I-Yin LI ,  Yi-Hung LIN ,  Chin-Lung TING ,  Tang-Chin HUNG ,  Jeng-Nan LIN

IPC: H01Q1/36 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q3/44 ,  H01Q21/00

Abstract: An antenna device is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. At least one working element disposed between the first substrate and the second substrate, wherein the at least one working element is filled with a modulation material. At least one buffer element is connected with the at least one working element for adjusting the amount of the modulation material in the at least one working element.

公开(公告)号：US20190013277A1

公开(公告)日：2019-01-10

申请号：US16000312

申请日：2018-06-05

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Chin-Lung TING ,  Chia-Chi HO ,  I-Yin LI

IPC: H01L23/532 ,  H01L29/43 ,  H04B1/08 ,  H04B1/03

Abstract: A radiation device includes a transistor substrate. A first transistor, a second transistor, a first electrode pad, a second electrode pad, a first conductive line, and a second conductive line are disposed on the transistor substrate. The first electrode pad is disposed adjacent to the first transistor, the second electrode pad is disposed adjacent to the second transistor, the first transistor is electrically connected to the first electrode pad through the first conductive line, and the second transistor is electrically connected to the second electrode pad through the second conductive line. The distance between the first transistor and the first electrode pad is shorter than the distance between the second transistor and the second electrode pad. The ratio of the total area of the first conductive line and the total area of the second conductive line is between 0.8 and 1.2.

公开(公告)号：US20180375202A1

公开(公告)日：2018-12-27

申请号：US15906126

申请日：2018-02-27

Applicant: InnoLux Corporation

Inventor： I-Yin LI ,  Yi-Hung LIN ,  Chia-Chi HO ,  Li-Wei SUNG ,  Ming-Yen WENG ,  Hung-I TSENG ,  Kuo-Chun LO ,  Charlene SU ,  Ker-Yih KAO

IPC: H01Q1/40 ,  H01Q1/38 ,  H01Q3/44

CPC classification number: H01Q1/40 ,  G02F1/1313 ,  H01Q1/2266 ,  H01Q1/2275 ,  H01Q1/2283 ,  H01Q1/24 ,  H01Q1/241 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q3/44 ,  H01Q9/0407 ,  H01Q9/0457 ,  H01Q13/10

Abstract: A microwave modulation device includes a first radiator, a second radiator and a modulation structure. The first radiator includes a substrate; a metal layer disposed on the substrate; a protective layer disposed on at least a portion of the metal layer and including a through hole overlapping with at least a portion of the metal layer; and an etch stop layer disposed between the metal layer and the protective layer. The second radiator disposed corresponding to the first radiator. The modulation structure is disposed between the first radiator and the second radiator.

公开(公告)号：US20180206334A1

公开(公告)日：2018-07-19

申请号：US15853517

申请日：2017-12-22

Applicant: InnoLux Corporation

Inventor： I-Yin LI ,  Chia-Chi HO ,  Yi-Hung LIN ,  Chen-Shuo HSIEH ,  Ker-Yih KAO

IPC: H05K1/02 ,  H05K3/00 ,  H01Q1/38

CPC classification number: H05K1/0243 ,  H01P3/082 ,  H01P11/003 ,  H01Q1/38 ,  H05K1/0271 ,  H05K3/0058

Abstract: A metal-laminated structure is provided. The metal-laminated structure includes a substrate, a compressive stress layer disposed on the substrate, and at least one metal layer disposed on the compressive stress layer, wherein the thickness ratio of the metal layer to the compressive stress layer is in a range from 1 to 30. A high-frequency device including the metal-laminated structure is also provided.

公开(公告)号：US20240387985A1

公开(公告)日：2024-11-21

申请号：US18787343

申请日：2024-07-29

Applicant: InnoLux Corporation

Inventor： I-Yin LI ,  Yi-Hung LIN ,  Chin-Lung TING ,  Tang-Chin HUNG ,  Jeng-Nan LIN

IPC: H01Q1/36 ,  G02F1/1339 ,  H01Q3/44 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q21/00

Abstract: An antenna device with an active area and a buffer element connected with the active area is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. A plurality of electrodes are disposed on the first substrate and in the active area. A modulation material is filled in the active area. A conductive layer is disposed on the second substrate and in the active area and the buffer element, and comprises a plurality of slits in the active area. A plurality of spacers are disposed between the first substrate and the second substrate, wherein at least one of the plurality of spacers is located in the buffer element, and wherein the buffer element is configured to provide a space for adjusting the amount of the modulation material in the active area.

公开(公告)号：US20230038309A1

公开(公告)日：2023-02-09

申请号：US17736112

申请日：2022-05-04

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Chun-Hung LAI ,  Yeong-E CHEN ,  Chuan-Ming YEH ,  Ching-Wei CHEN

IPC: H05K1/02

Abstract: A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and the first isolation layer.

公开(公告)号：US20220165628A1

公开(公告)日：2022-05-26

申请号：US17315389

申请日：2021-05-10

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Kuang-Chiang HUANG ,  Yu-Ting LIU ,  Yi-Hung LIN ,  Cheng-En CHENG

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/48

Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.

公开(公告)号：US20210399411A1

公开(公告)日：2021-12-23

申请号：US17462461

申请日：2021-08-31

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Tang-Chin HUNG ,  Chia-Chi HO ,  I-Yin LI

IPC: H01Q1/36 ,  H01Q9/04

Abstract: An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.