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公开(公告)号:US11803086B2
公开(公告)日:2023-10-31
申请号:US17535587
申请日:2021-11-25
申请人: Innolux Corporation
发明人: Chen-Lin Yeh , Chung-Kuang Wei , Jen-Hai Chi , Yan-Zheng Wu
IPC分类号: G02F1/1345 , G02F1/1337 , G02F1/1339
CPC分类号: G02F1/13458 , G02F1/1337 , G02F1/1339
摘要: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.
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公开(公告)号:US20230268296A1
公开(公告)日:2023-08-24
申请号:US18142001
申请日:2023-05-01
申请人: InnoLux Corporation
发明人: Jen-Hai Chi
IPC分类号: H01L23/66 , H01L23/485 , H01L23/31 , H01Q1/38 , H01L23/00
CPC分类号: H01L23/66 , H01L23/485 , H01L23/3142 , H01Q1/38 , H01L24/05 , H01L23/3121 , H01L2224/023 , H01L2223/6677
摘要: An electronic device includes a substrate, a redistribution layer disposed on the substrate, and an electronic component disposed on the redistribution layer and electrically connected to the redistribution layer.
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公开(公告)号:US20230217595A1
公开(公告)日:2023-07-06
申请号:US18079007
申请日:2022-12-12
申请人: Innolux Corporation
发明人: Tsung-Han Tsai , Yu-Chia Huang , Ying-Jen Chen , Jen-Hai Chi
IPC分类号: H05K1/18
CPC分类号: H05K1/181 , H05K2201/10166 , H05K2201/10272
摘要: A communication device including a substrate, a gate drive circuit, and a first tunable unit is provided. The gate drive circuit is disposed on the substrate. The gate drive circuit includes a first thin-film transistor and is configured to output a gate drive signal. The first tunable unit is disposed on the substrate and is electrically connected to the gate drive circuit. The first tunable unit includes a first drive circuit and a first tunable component. The first drive circuit includes a first terminal and a second terminal, and the first terminal of the first drive circuit is configured to receive the gate drive signal. The first tunable component is electrically connected to the second terminal of the first drive circuit.
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公开(公告)号:US20230170265A1
公开(公告)日:2023-06-01
申请号:US17976869
申请日:2022-10-31
申请人: Innolux Corporation
发明人: Tsung-Han Tsai , Chandra Lius , Jen-Hai Chi
IPC分类号: H01L21/66
摘要: A manufacturing method of an electronic device including following steps is provided. A tuning element substrate having a circuit layer disposed on a substrate and a plurality of tuning elements disposed on the circuit layer is provided. A reverse bias voltage or a forward bias voltage is applied to the tuning elements, so as to test a variation of an electrical property or a variation of an optical property of each of the tuning elements. The variation of the electrical property or the variation of the optical property of each of the tuning elements is analyzed. According to the manufacturing method, a reliable testing method of an electronic device may be provided.
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公开(公告)号:US20220367370A1
公开(公告)日:2022-11-17
申请号:US17722412
申请日:2022-04-18
申请人: Innolux Corporation
发明人: Jen-Hai Chi , Yun-Sheng Chen , Chia-Chi Ho
IPC分类号: H01L23/538 , H01L25/16 , H01L23/367 , H01L23/498
摘要: The disclosure provides an electronic device which includes a substrate structure, a driving component, and a conductive pattern. The driving component and the conductive pattern are formed on the substrate structure, and the thickness of the conductive pattern is greater than or equal to 0.5 μm and less than or equal to 15 μm.
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公开(公告)号:US12125829B2
公开(公告)日:2024-10-22
申请号:US18093331
申请日:2023-01-05
申请人: InnoLux Corporation
发明人: Jen-Hai Chi , Chia-Ping Tseng , Chen-Lin Yeh , Yan-Zheng Wu
CPC分类号: H01L25/072 , H01L23/3121 , H01L23/481 , H01L23/49822 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16227
摘要: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 μm. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.
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公开(公告)号:US20240085741A1
公开(公告)日:2024-03-14
申请号:US18512050
申请日:2023-11-17
申请人: InnoLux Corporation
发明人: Jen-Hai Chi , Chean Kee
IPC分类号: G02F1/1337 , G02F1/1333 , G02F1/1339 , G02F1/1343 , G02F1/1347
CPC分类号: G02F1/1337 , G02F1/133302 , G02F1/133368 , G02F1/1339 , G02F1/13439 , G02F1/13475 , G02F2202/04 , G02F2202/043 , G02F2202/28
摘要: An electronic device includes a first substrate, a second substrate on the first substrate, a third substrate between the first substrate and the second substrate, a first optical media layer between the first substrate and the third substrate, and a second optical media layer between the second substrate and the third substrate. A sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion. Another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion.
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公开(公告)号:US20230352474A1
公开(公告)日:2023-11-02
申请号:US18187682
申请日:2023-03-22
申请人: Innolux Corporation
发明人: Jen-Hai Chi , Chih-Yung Hsieh
IPC分类号: H01L27/06 , H03K17/687
CPC分类号: H01L27/0629 , H03K17/6871
摘要: An electronic device and a diode are provided. The electronic device includes a switch circuit and a diode. The switch circuit includes a transistor. The diode has a first pin and a second pin. The first pin is electrically coupled to the transistor. The second pin is an idle contact.
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公开(公告)号:US20230299489A1
公开(公告)日:2023-09-21
申请号:US18172284
申请日:2023-02-21
申请人: Innolux Corporation
发明人: Jen-Hai Chi , Chen-Lin Yeh , Chin-Lung Ting
CPC分类号: H01Q9/0442 , H01F27/28
摘要: An electronic device including a tuning element is provided. The tuning element includes a first capacitor element including a first switch and a first capacitor electrically coupled to the first switch and a second capacitor element including a second capacitor. The first capacitor element is electrically connected in parallel with the second capacitor element.
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公开(公告)号:US20230178534A1
公开(公告)日:2023-06-08
申请号:US17989682
申请日:2022-11-18
申请人: Innolux Corporation
发明人: Jia-Sin Lin , Wen-Chi Fang , Jen-Hai Chi , Zhi-Fu Huang , Pei-Chi Chen , Wan-Chun Tsai
IPC分类号: H01L25/18 , H01L29/786 , H01L29/93 , H01L25/00
CPC分类号: H01L25/18 , H01L29/78678 , H01L29/78669 , H01L29/7869 , H01L29/93 , H01L25/50
摘要: This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.
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