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公开(公告)号:US20220102917A1
公开(公告)日:2022-03-31
申请号:US17545947
申请日:2021-12-08
Applicant: Intel Corporation
Inventor: Xiang LI , George VERGIS , James A. McCALL
IPC: H01R13/6471 , H05K5/02
Abstract: Examples described herein relate to a system that includes: a first device comprising a motherboard; a second device comprising a dual in-line memory module (DIMM); and an arrangement of a signal pin and ground pin pair coupled to the motherboard and DIMM wherein portions of the signal pin and ground pin pair are proximate each other.
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12.
公开(公告)号:US20210141692A1
公开(公告)日:2021-05-13
申请号:US17156399
申请日:2021-01-22
Applicant: Intel Corporation
Inventor: Rajat AGARWAL , Wei P. CHEN , Bill NALE , James A. McCALL
IPC: G06F11/10
Abstract: A memory subsystem includes multiple memory resources connected in parallel, including a first memory resource and a second memory resource. The memory subsystem can split a portion of data into multiple sub-portions. Split into smaller portions, the system needs fewer ECC (error checking and correction) bits to provide the same level of ECC protection. The portion of data can include N ECC bits for error correction, and the sub-portions can each include a sub-portion of (N−M) ECC bits for error correction. The system can then use M bits of data for non-ECC purposes, such as metadata.
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13.
公开(公告)号:US20200081852A1
公开(公告)日:2020-03-12
申请号:US16546210
申请日:2019-08-20
Applicant: Intel Corporation
Inventor: Christopher P. MOZAK , James A. McCALL , Bryan K. CASPER
Abstract: Dynamic bus inversion (DBI) for programmable levels of a ratio of ones and zeros. A transmitting device identifies a number and/or ratio of ones and zeros in a noninverted version of a signal to be transmitted (“noninverted signal”) and a number and/or ratio of ones and zeros in an inverted version of the signal (“inverted signal”). The transmitting device can calculate whether a difference of ones and zeros in the noninverted signal or a difference of ones and zeros in the inverted signal provides a calculated average ratio of ones to zeros closer to a target ratio. The transmitting device sends the signal that achieves provides the calculated average ratio closer to the target ratio.
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14.
公开(公告)号:US20190213148A1
公开(公告)日:2019-07-11
申请号:US16208224
申请日:2018-12-03
Applicant: Intel Corporation
Inventor: Bill NALE , Christopher E. COX , Kuljit S. BAINS , George VERGIS , James A. McCALL , Chong J. ZHAO , Suneeta SAH , Pete D. VOGT , John R. GOLES
IPC: G06F13/16 , G06F13/40 , G11C14/00 , G11C11/4096
CPC classification number: G06F13/1673 , G06F13/4068 , G11C5/04 , G11C7/10 , G11C7/1045 , G11C11/4096 , G11C14/0009 , Y02D10/14 , Y02D10/151
Abstract: Examples include techniques to access or operate a dual in-line memory module (DIMM) via one or multiple data channels. In some examples, memory devices at or on the DIMM may be accessed via one or more data channels. The one or more data channels arranged such that the DIMM is configured to operate in a dual channel mode that includes two data channels or to operate in a single channel mode that includes a single data channel.
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公开(公告)号:US20190004919A1
公开(公告)日:2019-01-03
申请号:US15993245
申请日:2018-05-30
Applicant: Intel Corporation
Inventor: James A. McCALL , Kuljit S. BAINS
Abstract: A memory subsystem manages memory I/O impedance compensation by the memory device monitoring a need for impedance compensation. Instead of a memory controller regularly sending a signal to have the memory device update the impedance compensation when a change is not needed, the memory device can indicate when it is ready to perform an impedance compensation change. The memory controller can send an impedance compensation signal to the memory device in response to a compensation flag set by the memory or in response to determining that a sensor value has changed in excess of a threshold.
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公开(公告)号:US20170237431A1
公开(公告)日:2017-08-17
申请号:US15423431
申请日:2017-02-02
Applicant: Intel Corporation
Inventor: James A. McCALL , Kuljit S. BAINS
IPC: H03K19/00 , G11C11/4074 , G11C11/4093
CPC classification number: H03K19/0005 , G11C7/1045 , G11C7/1051 , G11C7/1057 , G11C7/1078 , G11C7/1084 , G11C11/4074 , G11C11/4093
Abstract: Described herein are a method and an apparatus for dynamically switching between one or more finite termination impedance value settings to a memory input-output (I/O) interface of a memory in response to a termination signal level. The method comprises: setting a first termination impedance value setting for a termination unit of an input-output (I/O) interface of a memory; assigning the first termination impedance value setting to the termination unit when the memory is not being accessed; and switching from the first termination impedance value setting to a second termination impedance value setting in response to a termination signal level.
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公开(公告)号:US20240145996A1
公开(公告)日:2024-05-02
申请号:US18395069
申请日:2023-12-22
Applicant: Intel Corporation
Inventor: Xiang LI , George VERGIS , James A. McCALL
IPC: H01R13/6471 , H01R12/73
CPC classification number: H01R13/6471 , H01R12/737
Abstract: A new connector implemented with connector pins to reduce crosstalk significantly improves memory channel electrical performance for next generation DDR (double data rate) technology. To reduce crosstalk the connector pins include pins with three different pin shapes, including two differently shaped signal pins and a ground pin that combines the shapes of the signal pins. The shaped pins enables them to be positioned in a connector so that each signal pin can have its own independent and separate signal return path on a single ground pin. In this manner, crosstalk can be significantly reduced.
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公开(公告)号:US20240028531A1
公开(公告)日:2024-01-25
申请号:US18375472
申请日:2023-09-30
Applicant: Intel Corporation
Inventor: John R. DREW , James A. McCALL , Tongyan ZHAI , Jun LIAO , Min Suet LIM , Shigeki TOMISHIMA
CPC classification number: G06F13/1694 , G06F13/1689 , G06F13/4022
Abstract: A memory subsystem triggers dynamic switching for memory devices to provide access to active memory devices and prevent access to inactive memory devices. Dynamic switching enables a single bus to switch between multiple memory devices whose capacity otherwise exceeds the capacity of the single bus. A switch can be mounted in a memory module or directly on a motherboard alongside the memory devices. A memory controller can toggle a chip select signal as a single control signal to drive the switch. Each switch includes pairs of field effect transistors (FETs), including any of CMOS, NMOS and PMOS FETs. The switch electrically isolates inactive memory devices to prevent access without the need to electrically short the devices.
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公开(公告)号:US20220122929A1
公开(公告)日:2022-04-21
申请号:US17561892
申请日:2021-12-24
Applicant: Intel Corporation
Inventor: Xiang LI , George VERGIS , James A. McCALL
IPC: H01L23/66 , H01L23/552 , H01L23/00
Abstract: An integrated circuit package includes a substrate with traces for high speed communication that are subject to crosstalk. The traces include overlapping pads on different layers of the substrate, which can increase the mutual capacitance of the signal lines, which will offset the mutual inductance. Thus, the overlapping pads can reduce the crosstalk between the signal traces.
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公开(公告)号:US20210279128A1
公开(公告)日:2021-09-09
申请号:US17327432
申请日:2021-05-21
Applicant: Intel Corporation
Inventor: James A. McCALL , Bill NALE , Zibing YANG , Yanjie ZHU
Abstract: A method is described. The method includes a buffer semiconductor chip receiving a plurality of data signals. The method includes the buffer chip calculating first CRC information from the plurality of data signals. The method includes the buffer chip transmitting the plurality of data signals in parallel with the first CRC information if a read burst transfer sequence is being performed, the buffer chip receiving second CRC information in parallel with the plurality of data signals and comparing the first CRC information with the second CRC information if a write burst transfer sequence is being performed.
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