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    Silver Based Conductive Layer for Flexible Electronics
    13.
    发明申请
    Silver Based Conductive Layer for Flexible Electronics 有权
    银导电层柔性电子学

    公开(公告)号：US20150327366A1

    公开(公告)日：2015-11-12

    申请号：US14807336

    申请日：2015-07-23

    Applicant: Intermolecular Inc.

    Inventor： Mohd Fadzli Anwar Hassan ,  Guowen Ding ,  Minh Huu Le ,  Minh Anh Anh Nguyen ,  Zhi-Wen Wen Sun ,  Guizhen Zhang

    IPC: H05K1/09 ,  H05K1/02

    CPC classification number: H05K1/092 ,  C23C28/42 ,  C23C30/00 ,  H01L51/0097 ,  H01L51/5234 ,  H05K1/0274 ,  Y10T428/265

    Abstract: Methods for making conducting stacks includes forming a doped or alloyed silver layer sandwiched between two layers of transparent conductive oxide such as indium tin oxide (ITO). The doped silver or silver alloy layer can be thin, such as between 1.5 to 20 nm and thus can be transparent. The doped silver or silver alloy can provide improved ductility property, allowing the conductive stack to be bendable. The transparent conductive oxide layers can also be thin, allowing the conductive stack can have improved ductility property.

    Abstract translation: 制造导电叠层的方法包括形成夹在两层透明导电氧化物（例如氧化铟锡（ITO））之间的掺杂或合金化的银层。 掺杂的银或银合金层可以是薄的，例如在1.5至20nm之间，因此可以是透明的。 掺杂的银或银合金可以提供改善的延展性，允许导电叠层可弯曲。 透明导电氧化物层也可以是薄的，使得导电叠层可以具有改善的延展性。

    SYSTEMS, METHODS, AND APPARATUS FOR PRODUCTION COATINGS OF LOW-EMISSIVITY GLASS
    14.
    发明申请
    SYSTEMS, METHODS, AND APPARATUS FOR PRODUCTION COATINGS OF LOW-EMISSIVITY GLASS 有权
    低功率玻璃生产涂料的系统，方法和装置

    公开(公告)号：US20140308528A1

    公开(公告)日：2014-10-16

    申请号：US14144828

    申请日：2013-12-31

    Applicant: Intermolecular Inc.

    Inventor： Guowen Ding ,  Brent Boyce ,  Jeremy Cheng ,  Jose Ferreira ,  Muhammad Imran ,  Minh Huu Le ,  Daniel Schweigert ,  Yu Wang ,  Yongli Xu ,  Guizhen Zhang

    IPC: C23C14/10 ,  C03C17/34 ,  C23C14/34

    CPC classification number: C03C17/366 ,  C03C17/3435 ,  C03C17/36 ,  C03C17/3613 ,  C03C17/3618 ,  C03C17/3626 ,  C03C17/3639 ,  C03C17/3644 ,  C03C17/3681 ,  C03C25/226 ,  C03C2218/155 ,  C23C14/0036 ,  C23C14/0652 ,  C23C14/0688 ,  C23C14/083 ,  C23C14/086

    Abstract: Disclosed herein are systems, methods, and apparatus for forming a low emissivity panel. In various embodiments, a partially fabricated panel may be provided. The partially fabricated panel may include a substrate, a reflective layer formed over the substrate, and a top dielectric layer formed over the reflective layer such that the reflective layer is formed between the substrate and the top dielectric layer. The top dielectric layer may include tin having an oxidation state of +4. An interface layer may be formed over the top dielectric layer. A top diffusion layer may be formed over the interface layer. The top diffusion layer may be formed in a nitrogen plasma environment. The interface layer may substantially prevent nitrogen from the nitrogen plasma environment from reaching the top dielectric layer and changing the oxidation state of tin included in the top dielectric layer.

    Abstract translation: 本文公开了用于形成低发射率面板的系统，方法和装置。 在各种实施例中，可以提供部分制造的面板。 部分制造的面板可以包括衬底，在衬底上形成的反射层，以及形成在反射层上的顶部电介质层，使得反射层形成在衬底和顶部电介质层之间。 顶部电介质层可以包括具有+4的氧化态的锡。 界面层可以形成在顶部介电层上。 可以在界面层上形成顶部扩散层。 顶部扩散层可以在氮等离子体环境中形成。 界面层可以基本上防止来自氮等离子体环境的氮到达顶部电介质层并改变顶部电介质层中包含的锡的氧化态。

    Barrier Layers for Silver Reflective Coatings and HPC Workflows for Rapid Screening of Materials for Such Barrier Layers
    15.
    发明申请
    Barrier Layers for Silver Reflective Coatings and HPC Workflows for Rapid Screening of Materials for Such Barrier Layers 有权
    银色反射涂层屏障层和HPC工作流程，用于快速筛选这种阻挡层的材料

    公开(公告)号：US20140272454A1

    公开(公告)日：2014-09-18

    申请号：US13801635

    申请日：2013-03-13

    Applicant: INTERMOLECULAR INC.

    Inventor： Guizhen Zhang ,  Jeremy Cheng ,  Guowen Ding ,  Minh Huu Le ,  Daniel Schweigert ,  Yu Wang

    IPC: C03C17/36 ,  C23C14/14

    CPC classification number: C23C14/22 ,  C03C17/36 ,  C03C17/3605 ,  C03C17/3618 ,  C03C17/3644 ,  C03C17/3652 ,  C03C17/366 ,  C03C17/3681 ,  C23C14/0036 ,  C23C14/042 ,  C23C14/14 ,  C23C14/34 ,  G02B1/12 ,  G02B1/14 ,  Y10T428/12542 ,  Y10T428/12549 ,  Y10T428/12611 ,  Y10T428/12778 ,  Y10T428/31678

    Abstract: Provided is High Productivity Combinatorial (HPC) testing methodology of semiconductor substrates, each including multiple site isolated regions. The site isolated regions are used for testing different compositions and/or structures of barrier layers disposed over silver reflectors. The tested barrier layers may include all or at least two of nickel, chromium, titanium, and aluminum. In some embodiments, the barrier layers include oxygen. This combination allows using relative thin barrier layers (e.g., 5-30 Angstroms thick) that have high transparency yet provide sufficient protection to the silver reflector. The amount of nickel in a barrier layer may be 5-10% by weight, chromium—25-30%, titanium and aluminum—30%-35% each. The barrier layer may be co-sputtered in a reactive or inert-environment using one or more targets that include all four metals. An article may include multiple silver reflectors, each having its own barrier layer.

    Abstract translation: 提供了半导体衬底的高生产率组合（HPC）测试方法，每个包括多个现场隔离区域。 位置隔离区域用于测试布置在银反射器上的阻挡层的不同组成和/或结构。 经测试的阻挡层可以包括镍，铬，钛和铝中的全部或至少两种。 在一些实施例中，阻挡层包括氧。 该组合允许使用具有高透明度的相对薄的阻挡层（例如5-30埃厚），同时为银反射器提供足够的保护。 阻挡层中的镍的量可以是5-10重量％，铬25-30％，钛和铝30％-35％。 阻挡层可以在反应性或惰性环境中使用包括所有四种金属的一种或多种目标共溅射。 物品可以包括多个银反射器，每个具有其自己的阻挡层。

    Barrier Layers for Silver Reflective Coatings and HPC Workflows for Rapid Screening of Materials for Such Barrier Layers
    16.
    发明申请
    Barrier Layers for Silver Reflective Coatings and HPC Workflows for Rapid Screening of Materials for Such Barrier Layers 审中-公开
    银色反射涂层屏障层和HPC工作流程，用于快速筛选这种阻挡层的材料

    公开(公告)号：US20140178578A1

    公开(公告)日：2014-06-26

    申请号：US13727115

    申请日：2012-12-26

    Applicant: INTERMOLECULAR, INC.

    Inventor： Guizhen Zhang ,  Jeremy Cheng ,  Guowen Ding ,  Minh Huu Le ,  Daniel Schweigert ,  Yu Wang

    IPC: B05D5/06

    CPC classification number: C23C14/352 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00443 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/0075 ,  C03C17/36 ,  C03C17/3644 ,  C03C17/3652 ,  C03C17/366 ,  C23C14/165 ,  C23C14/3492

    Abstract: Provided is High Productivity Combinatorial (HPC) testing methodology of semiconductor substrates, each including multiple site isolated regions. The site isolated regions are used for testing different compositions and/or structures of barrier layers disposed over silver reflectors. The tested barrier layers may include all or at least two of nickel, chromium, titanium, and aluminum. In some embodiments, the barrier layers include oxygen. This combination allows using relative thin barrier layers (e.g., 5-30 Angstroms thick) that have high transparency yet provide sufficient protection to the silver reflector. The amount of nickel in a barrier layer may be 5-10% by weight, chromium −25-30%, titanium and aluminum −30%-35% each. The barrier layer may be co-sputtered in a reactive or inert-environment using one or more targets that include all four metals. An article may include multiple silver reflectors, each having its own barrier layer.

    Abstract translation: 提供了半导体衬底的高生产率组合（HPC）测试方法，每个包括多个现场隔离区域。 位置隔离区域用于测试布置在银反射器上的阻挡层的不同组成和/或结构。 经测试的阻挡层可以包括镍，铬，钛和铝中的全部或至少两种。 在一些实施例中，阻挡层包括氧。 该组合允许使用具有高透明度的相对薄的阻挡层（例如5-30埃厚），同时为银反射器提供足够的保护。 阻挡层中的镍的量可以为5-10重量％，铬-25-30％，钛和铝各自为-30％-35％。 阻挡层可以在反应性或惰性环境中使用包括所有四种金属的一种或多种目标共溅射。 物品可以包括多个银反射器，每个具有其自己的阻挡层。

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