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公开(公告)号：US11768122B2
公开(公告)日：2023-09-26
申请号：US17964501
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
CPC classification number: G01L19/0654 , G01L9/0041 , G01L19/0092 , G01N25/56 , G01N27/048 , G01N27/223
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
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公开(公告)号：US11326972B2
公开(公告)日：2022-05-10
申请号：US16875918
申请日：2020-05-15
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Yu-Tao Lee , Chung-Hsien Lin
Abstract: A sensor includes a substrate, an oxide layer, a membrane, an electrode, and a trench. The oxide layer is disposed on the substrate. The membrane is positioned on the oxide layer. The membrane with the oxide layer and the substrate forms an enclosed cavity therein. The membrane comprises a rigid portion and a deformable portion wherein the deformable portion of the membrane deforms responsive to stimuli. The oxide layer forms side walls of the cavity. The electrode is positioned on the substrate and within the cavity. The trench is formed in the oxide layer, and wherein the trench is covered with barrier material.
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公开(公告)号：US11225409B2
公开(公告)日：2022-01-18
申请号：US16574037
申请日：2019-09-17
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US20230035487A1
公开(公告)日：2023-02-02
申请号：US17964501
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
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公开(公告)号：US11027967B2
公开(公告)日：2021-06-08
申请号：US16108858
申请日：2018-08-22
Applicant: InvenSense, Inc.
Inventor： Chung-Hsien Lin , Joseph Seeger , Calin Miclaus , Tsung Lin Tang , Pei-Wen Yen
Abstract: A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch.
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Patent Agency Ranking
公开(公告)号：US10816422B2
公开(公告)日：2020-10-27
申请号：US15442468
申请日：2017-02-24
Applicant: InvenSense, Inc.
Inventor： Chung-Hsien Lin , Rene Hummel , Ulrich Bartsch , Marion Hermersdorf , Tsung Lin Tang , Wang Shen Su , Chia Min Lin
Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
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公开(公告)号：US20180202882A1
公开(公告)日：2018-07-19
申请号：US15921504
申请日：2018-03-14
Applicant: InvenSense, Inc.
Inventor： Johannes Schumm , Andreas Reinhard , Thomas Kraehenbuehl , Stefan Thiele , Rene Hummel , Chung-Hsien Lin , Wang Shen Su , Tsung Lin Tang , Chia Min Lin
CPC classification number: G01L9/0042 , B81B3/0089 , B81B2201/0264 , B81B2203/0315 , B81C1/00285 , G01L9/0045 , G01L9/0073 , H01L29/84
Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
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公开(公告)号：US09581512B2
公开(公告)日：2017-02-28
申请号：US14522014
申请日：2014-10-23
Applicant: InvenSense, Inc.
Inventor： Chung-Hsien Lin , Rene Hummel , Ulrich Bartsch , Marion Hermersdorf , Tsung Lin Tang , Wang Shen Su , Chia Min Lin
CPC classification number: G01L9/0073 , B23P19/04 , B81B7/0051 , B81B7/0054 , B81B2201/0264 , B81B2207/012 , B81B2207/095 , B81C2203/0792 , G01L9/12 , G01L19/0084 , G01L19/145 , G01L19/146 , Y10T29/49165 , Y10T29/49904
Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
Abstract translation: 压力传感器包括第一基板和附接到第一基板的盖。 盖包括处理电路，空腔和分离空腔的可变形膜和通向压力传感器外部的端口。 提供感测装置，用于将可变形膜的响应转换成端口处的压力，使其成为能够被处理电路处理的信号。 盖子附接到第一基板，使得可变形膜面向第一基板，并且使得在可变形膜和第一基板之间提供间隙，该间隙有助于端口。 第一基板包括盖附接的支撑部分，用于将压力传感器电连接到外部装置的接触部分以及用于将支撑部分从接触部分悬挂的一个或多个悬挂元件。
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公开(公告)号：US20230296461A1
公开(公告)日：2023-09-21
申请号：US18113541
申请日：2023-02-23
Applicant: InvenSense, Inc.
Inventor： Yoshitaka Sasaki , Jotaro Akiyama , Sal Akram , Yaoching Wang , Weng Shen Su , Tsung Lin Tang , Ting-Yuan Liu , Yuki Shibano , Chung-Hsien Lin
CPC classification number: G01L9/12 , B81C1/00198 , B81C2201/0132
Abstract: A pressure sensor includes a first electrode, a plurality of cavities, and a second electrode. The second electrode is disposed opposite the first electrode through the plurality of cavities. The second electrode includes a flat structure spanning two adjacent cavities of the plurality of cavities.
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公开(公告)号：US20230089813A1
公开(公告)日：2023-03-23
申请号：US17950007
申请日：2022-09-21
Applicant: InvenSense, Inc.
Inventor： Weng Shen Su , Chung-Hsien Lin , Yaoching Wang , Tsung Lin Tang , Ting-Yuan Liu , Calin Miclaus
Abstract: A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.
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