公开(公告)号：US20110065240A1

公开(公告)日：2011-03-17

申请号：US12578556

申请日：2009-10-13

申请人： Xu GAO ,  Qingchun He ,  Nan Xu

发明人： Xu GAO ,  Qingchun He ,  Nan Xu

IPC分类号： H01L21/60 ,  H01L23/495 ,  B21D31/02

CPC分类号： H01L21/4842 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/48247 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame and a method of making a lead frame for a semiconductor package. The lead frame is formed by stamping a lead frame material into a desire configuration. The stamped lead frame is then affixed to a support material. When assembling a semiconductor package using the lead frame, during saw singuation, the saw does not have to cut through much lead frame material. Thus, the saw blade does not wear quickly.

摘要翻译： 引线框架和制造用于半导体封装的引线框架的方法。 引线框架通过将引线框架材料冲压成期望配置而形成。 然后将冲压的引线框架固定到支撑材料上。 当使用引线框组装半导体封装时，在锯切时，锯不必切割大量的引线框架材料。 因此，锯片不会很快磨损。

公开(公告)号：US09328425B2

公开(公告)日：2016-05-03

申请号：US13521347

申请日：2011-08-10

申请人： Qingchun He ,  Qi Zhou ,  Jian Li

发明人： Qingchun He ,  Qi Zhou ,  Jian Li

IPC分类号： C23G5/00 ,  C22F1/18 ,  C22C27/04

CPC分类号： C23G5/00 ,  C22C27/04 ,  C22F1/18

摘要： A device for cleaning the surface of a molybdenum wire at high temperature, comprises a wire pay-off mechanism, a first wire guiding wheel, a cleaning mechanism, a second wire guiding wheel, and a wire take-up mechanism; wherein the two ends of a furnace body of the cleaning mechanism are provided with an inlet hole and an outlet hole for the molybdenum wire. Electrodes connected to a power supply are provided at the inlet hole and in a central part inside the furnace body. An upper part of the furnace body is provided with a gas outlet and a lower part thereof is provided with a wet hydrogen inlet; a heating section is formed between the electrode located at the inlet hole and the electrode located in the central part, and a cooling section is formed between the electrode located in the central part and the outlet hole.

摘要翻译： 一种用于在高温下清洁钼丝表面的装置，包括线放线机构，第一线引导轮，清洁机构，第二线引导轮和引线机构; 其中清洁机构的炉体的两端设有用于钼丝的入口孔和出口孔。 连接到电源的电极设置在炉体的入口孔和中心部分。 炉体的上部设有气体出口，其下部设有湿氢入口; 在位于入口孔的电极和位于中心部分的电极之间形成加热部分，并且在位于中心部分的电极和出口孔之间形成冷却部分。

公开(公告)号：US08642395B2

公开(公告)日：2014-02-04

申请号：US12727258

申请日：2010-03-19

申请人： Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

发明人： Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L33/62

CPC分类号： H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83099 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.

摘要翻译： 芯片引线封装半导体器件的组装方法包括以下步骤：安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤，这大大提高了引线接合质量和第二成型质量。 此外，由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题，所以避免了环氧树脂和模具之间的脱层危险。

公开(公告)号：US08486540B2

公开(公告)日：2013-07-16

申请号：US13008914

申请日：2011-01-19

申请人： Ting Li ,  Qingchun He ,  Yongqiang Liu

发明人： Ting Li ,  Qingchun He ,  Yongqiang Liu

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L2924/0002 ,  Y10T428/12188 ,  Y10T428/12201 ,  Y10T428/12368 ,  H01L2924/00

摘要： A lead frame sheet made of an electrically conductive material has lead frames integrally formed on it. Spacing members also are formed from the sheet. A first one of the spacing members is proximal to a first longitudinal edge of the sheet and a second one of the spacing members is proximal to a second longitudinal edge of the sheet. The spacing members extend from an underside surface of the sheet and, in use, space the underside surface from a planar support such as a surface of a heating block.

摘要翻译： 由导电材料制成的引线框架片一体地形成在其上。 间距构件也由片材形成。 间隔构件中的第一个靠近片材的第一纵向边缘，并且间隔构件中的第二个靠近片材的第二纵向边缘。 间隔构件从片材的下侧表面延伸，并且在使用中将下表面从诸如加热块的表面的平面支撑件间隔开。

公开(公告)号：US20120248590A1

公开(公告)日：2012-10-04

申请号：US13413652

申请日：2012-03-07

申请人： Peng LIU ,  Qingchun He ,  Ping Wu

发明人： Peng LIU ,  Qingchun He ,  Ping Wu

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49537 ,  H01L21/4828 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor package is assembled using first and second lead frames. The first lead frame includes a die flag and the second lead frame includes lead fingers. When the first and second lead frames are mated, the lead fingers surround the die flag. Side surfaces of the die flag are partially etched to form an extended die attach surface on the die flag, and portions of the top surface of each of the lead fingers also are partially etched to form lead finger surfaces that are complementary with the etched side surfaces of the die flag. A semiconductor die is attached to the extended die attach surface and bond pads of the semiconductor die are electrically connected to the lead fingers. An encapsulating material covers the die, electrical connections, and top surfaces of the die flag and lead fingers.

摘要翻译： 使用第一和第二引线框组装半导体封装。 第一引线框架包括管芯标记，并且第二引线框架包括引线指。 当第一和第二引线框架配合时，引线指环围绕管芯标记。 模具标记的侧表面被部分蚀刻以在模具标记上形成延伸的芯片附接表面，并且每个引线指的顶表面的部分也被部分地蚀刻以形成与蚀刻的侧表面互补的引线指表面 的旗帜。 半导体管芯附着到延伸管芯附接表面，并且半导体管芯的接合焊盘电连接到引线指。 封装材料覆盖管芯标记和引线指的管芯，电连接和顶表面。

公开(公告)号：US09355944B1

公开(公告)日：2016-05-31

申请号：US14677964

申请日：2015-04-02

申请人： Peng Liu ,  Qingchun He ,  Ping Wu

发明人： Peng Liu ,  Qingchun He ,  Ping Wu

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/49551 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a lead frame having a die support area and a plurality of inner and outer row leads surrounding the die support area, and a semiconductor die mounted on the die support area and electrically connected to the leads with bond wires. A molding material encapsulates the semiconductor die, the bond wires, and the leads, and defines a package body. The semiconductor device further includes connection bars extending vertically from the leads to a top surface of the package body. The connection bars connect the inner row leads to respective ones of the outer row leads before the molding process is performed.

摘要翻译： 一种半导体器件包括具有管芯支撑区域的引线框架和围绕模具支撑区域的多个内部和外部引线引线，以及安装在管芯支撑区域上并与引线电连接的引线的半导体管芯。 成型材料封装半导体管芯，接合线和引线，并且限定封装主体。 半导体器件还包括从引线垂直延伸到封装主体的顶表面的连接杆。 在执行模制过程之前，连接杆将内排引线连接到相应的外排引线。

公开(公告)号：US09177836B1

公开(公告)日：2015-11-03

申请号：US14554065

申请日：2014-11-26

申请人： Peng Liu ,  Qingchun He ,  Ping Wu

发明人： Peng Liu ,  Qingchun He ,  Ping Wu

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49555 ,  H01L23/49582 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method for assembling a quad flat no-lead (QFN) device includes mounting and electrically connecting a die to a pre-plated lead frame (PPF) to form a sub-assembly, where the plating is solder-wettable and the lead frame has notches in the lead fingers located along the device boundary. The sub-assembly is then encapsulated to (1) leave the distal ends of the lead fingers exposed and (2) have the edge of the encapsulant adjacent to the notches. The sub-assembly is then singulated to leave distal lead segments protruding from the resulting device. The protruding exposed segments are then bent to be substantially parallel to the device sidewalls. Consequently, the plated surface of each lead extends along portions of both the bottom and one side of the device.

摘要翻译： 用于组装四边形无引线（QFN）器件的方法包括将管芯安装并电连接到预镀引线框架（PPF），以形成子组件，其中电镀可焊接润湿，并且引线框具有 引线指沿设备边界的凹口。 然后将子组件封装成（1）使引线的远端露出，（2）使密封剂的边缘邻近凹口。 然后将子组件分开以使远离的引导部分从所得到的装置突出。 突出的暴露的段然后被弯曲成基本上平行于器件侧壁。 因此，每个引线的电镀表面沿设备的底部和一侧的部分延伸。

公开(公告)号：US20120112333A1

公开(公告)日：2012-05-10

申请号：US13210393

申请日：2011-08-16

申请人： Qiang Liu ,  Qingchun He ,  Zhaojun Tian

发明人： Qiang Liu ,  Qingchun He ,  Zhaojun Tian

IPC分类号： H01L23/495 ,  H01L21/78 ,  H01L21/50

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48479 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48471 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A molded surface mount semiconductor device has electrical contact elements disposed in a set of pairs of zigzag rows extending adjacent and generally parallel to opposite edges of an active face of a semiconductor die. Each of the pairs of rows includes an inner zigzag row of electrical contact elements nested inside an outer zigzag row of electrical contact elements. The electrical contact elements of the inner and outer zigzag rows are partially inter-digitated. A lead frame used in making the device also has a die pad located inside the set of pairs of zigzag rows, and an outer frame element located outside the set of pairs of zigzag rows, and which support the electrical contact elements of the inner and outer zigzag rows respectively.

摘要翻译： 模制的表面安装半导体器件具有设置在一组相对于半导体管芯的有源面的相邻并且大致平行的相对边缘延伸的一组锯齿形行中的电接触元件。 每对成对的行包括嵌套在外部之字形行的电接触元件内的内部之字形的电接触元件行。 内部和外部之字形行的电接触元件被部分地进行数字化。 用于制造该装置的引线框架还具有位于成对的之字形行内的管芯焊盘，以及位于一组成对的之字形行之外的外部框架元件，并且其支撑内部和外部的电接触元件 之字形行。

公开(公告)号：US20140246767A1

公开(公告)日：2014-09-04

申请号：US14077174

申请日：2013-11-11

申请人： Peng Liu ,  Qingchun He ,  Zhaobin Qi ,  Liqiang Xu ,  Tong Zhao

发明人： Peng Liu ,  Qingchun He ,  Zhaobin Qi ,  Liqiang Xu ,  Tong Zhao

IPC分类号： H01L23/495 ,  H01L25/00

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

摘要： A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process.

摘要翻译： 半导体器件包括具有下焊接区域的引线框架，管芯附着区域和形成在下焊接区域和管芯附着区域之间的坝。 大坝的底部附着在引线框架的表面上。 大坝可防止下模接合区域从芯片附着材料中的污染，这可能在芯片附着过程中发生。

公开(公告)号：US20120291807A1

公开(公告)日：2012-11-22

申请号：US13521347

申请日：2011-08-10

申请人： Qingchun He ,  Qi Zhou ,  Jian Li

发明人： Qingchun He ,  Qi Zhou ,  Jian Li

IPC分类号： B08B7/04 ,  B08B5/00

CPC分类号： C23G5/00 ,  C22C27/04 ,  C22F1/18

摘要： A device for cleaning the surface of a molybdenum wire at high temperature, comprises a wire pay-off mechanism, a first wire guiding wheel, a cleaning mechanism, a second wire guiding wheel, and a wire take-up mechanism; wherein the two ends of a furnace body of the cleaning mechanism are provided with an inlet hole and an outlet hole for the molybdenum wire. Electrodes connected to a power supply are provided at the inlet hole and in a central part inside the furnace body. An upper part of the furnace body is provided with a gas outlet and a lower part thereof is provided with a wet hydrogen inlet; a heating section is formed between the electrode located at the inlet hole and the electrode located in the central part, and a cooling section is formed between the electrode located in the central part and the outlet hole.

摘要翻译： 一种用于在高温下清洁钼丝表面的装置，包括线放线机构，第一线引导轮，清洁机构，第二线引导轮和引线机构; 其中清洁机构的炉体的两端设有用于钼丝的入口孔和出口孔。 连接到电源的电极设置在炉体的入口孔和中心部分。 炉体的上部设有气体出口，其下部设有湿氢入口; 在位于入口孔的电极和位于中心部分的电极之间形成加热部分，并且在位于中心部分的电极和出口孔之间形成冷却部分。