公开(公告)号：US09328425B2

公开(公告)日：2016-05-03

申请号：US13521347

申请日：2011-08-10

申请人： Qingchun He ,  Qi Zhou ,  Jian Li

发明人： Qingchun He ,  Qi Zhou ,  Jian Li

IPC分类号： C23G5/00 ,  C22F1/18 ,  C22C27/04

CPC分类号： C23G5/00 ,  C22C27/04 ,  C22F1/18

摘要： A device for cleaning the surface of a molybdenum wire at high temperature, comprises a wire pay-off mechanism, a first wire guiding wheel, a cleaning mechanism, a second wire guiding wheel, and a wire take-up mechanism; wherein the two ends of a furnace body of the cleaning mechanism are provided with an inlet hole and an outlet hole for the molybdenum wire. Electrodes connected to a power supply are provided at the inlet hole and in a central part inside the furnace body. An upper part of the furnace body is provided with a gas outlet and a lower part thereof is provided with a wet hydrogen inlet; a heating section is formed between the electrode located at the inlet hole and the electrode located in the central part, and a cooling section is formed between the electrode located in the central part and the outlet hole.

摘要翻译： 一种用于在高温下清洁钼丝表面的装置，包括线放线机构，第一线引导轮，清洁机构，第二线引导轮和引线机构; 其中清洁机构的炉体的两端设有用于钼丝的入口孔和出口孔。 连接到电源的电极设置在炉体的入口孔和中心部分。 炉体的上部设有气体出口，其下部设有湿氢入口; 在位于入口孔的电极和位于中心部分的电极之间形成加热部分，并且在位于中心部分的电极和出口孔之间形成冷却部分。

公开(公告)号：US20120291807A1

公开(公告)日：2012-11-22

申请号：US13521347

申请日：2011-08-10

申请人： Qingchun He ,  Qi Zhou ,  Jian Li

发明人： Qingchun He ,  Qi Zhou ,  Jian Li

IPC分类号： B08B7/04 ,  B08B5/00

CPC分类号： C23G5/00 ,  C22C27/04 ,  C22F1/18

摘要： A device for cleaning the surface of a molybdenum wire at high temperature, comprises a wire pay-off mechanism, a first wire guiding wheel, a cleaning mechanism, a second wire guiding wheel, and a wire take-up mechanism; wherein the two ends of a furnace body of the cleaning mechanism are provided with an inlet hole and an outlet hole for the molybdenum wire. Electrodes connected to a power supply are provided at the inlet hole and in a central part inside the furnace body. An upper part of the furnace body is provided with a gas outlet and a lower part thereof is provided with a wet hydrogen inlet; a heating section is formed between the electrode located at the inlet hole and the electrode located in the central part, and a cooling section is formed between the electrode located in the central part and the outlet hole.

摘要翻译： 一种用于在高温下清洁钼丝表面的装置，包括线放线机构，第一线引导轮，清洁机构，第二线引导轮和引线机构; 其中清洁机构的炉体的两端设有用于钼丝的入口孔和出口孔。 连接到电源的电极设置在炉体的入口孔和中心部分。 炉体的上部设有气体出口，其下部设有湿氢入口; 在位于入口孔的电极和位于中心部分的电极之间形成加热部分，并且在位于中心部分的电极和出口孔之间形成冷却部分。

公开(公告)号：US20160141230A1

公开(公告)日：2016-05-19

申请号：US14677964

申请日：2015-04-02

申请人： Peng Liu ,  Qingchun He ,  Ping Wu

发明人： Peng Liu ,  Qingchun He ,  Ping Wu

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L23/49551 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a lead frame having a die support area and a plurality of inner and outer row leads surrounding the die support area, and a semiconductor die mounted on the die support area and electrically connected to the leads with bond wires. A molding material encapsulates the semiconductor die, the bond wires, and the leads, and defines a package body. The semiconductor device further includes connection bars extending vertically from the leads to a top surface of the package body. The connection bars connect the inner row leads to respective ones of the outer row leads before the molding process is performed.

摘要翻译： 一种半导体器件包括具有管芯支撑区域的引线框架和围绕模具支撑区域的多个内部和外部引线引线，以及安装在管芯支撑区域上并与引线电连接的引线的半导体管芯。 成型材料封装半导体管芯，接合线和引线，并且限定封装主体。 半导体器件还包括从引线垂直延伸到封装主体的顶表面的连接杆。 在执行模制过程之前，连接杆将内排引线连接到相应的外排引线。

公开(公告)号：US08969135B2

公开(公告)日：2015-03-03

申请号：US14077174

申请日：2013-11-11

申请人： Peng Liu ,  Qingchun He ,  Zhaobin Qi ,  Liqiang Xu ,  Tong Zhao

发明人： Peng Liu ,  Qingchun He ,  Zhaobin Qi ,  Liqiang Xu ,  Tong Zhao

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/495 ,  H01L25/00

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

摘要： A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process.

摘要翻译： 半导体器件包括具有下焊接区域的引线框架，管芯附着区域和形成在下焊接区域和管芯附着区域之间的坝。 大坝的底部附着在引线框架的表面上。 大坝可防止下模接合区域从芯片附着材料中的污染，这可能在芯片附着过程中发生。

公开(公告)号：US08692134B2

公开(公告)日：2014-04-08

申请号：US13210392

申请日：2011-08-16

申请人： Jie Yang ,  Qingchun He ,  Hanmin Zhang

发明人： Jie Yang ,  Qingchun He ,  Hanmin Zhang

IPC分类号： H05K1/11

CPC分类号： H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4811 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48992 ,  H01L2224/85138 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/20753 ,  H01L2224/85399

摘要： An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation.

摘要翻译： 电连接包括结合到靠近模具边缘的相邻接合焊盘的第一引线和第二引线，其中一端接合到芯片边缘远离管芯接合焊盘，第二端接合引线框架的引线指 或基板的连接垫。 第二根线穿过并被第一根线支撑。 第一线作为防止第二线接触芯片边缘的支架。 第一根线也防止了第二根线在封装期间过度的横向运动。

公开(公告)号：US20110165729A1

公开(公告)日：2011-07-07

申请号：US12830424

申请日：2010-07-05

申请人： Peng LIU ,  Xu Gao ,  Qingchun He ,  Zhaobin Qi ,  Dehong Ye

发明人： Peng LIU ,  Xu Gao ,  Qingchun He ,  Zhaobin Qi ,  Dehong Ye

IPC分类号： H01L21/78 ,  H01L21/98 ,  H01L21/60

CPC分类号： H01L23/3107 ,  H01L21/4842 ,  H01L23/49558 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Quad Flat No-Lead packaged devices are manufactured using two singulation operations with two different saw blades of varying widths with the first singulation operation using a wider saw blade than the second singulation operation. Between singulation operations, the exposed portions of the leads are plated with a solderable metal. By performing the second singulation operation within the first cut made by the first singulation, at least half of the exposed metal of the leads remains plated. Thus, better solder joints may be formed, which allows for simpler visual inspection.

摘要翻译： 使用具有不同宽度的两个不同锯片的两个单独操作制造四边形无铅封装装置，其中使用比第二单分割操作更宽的锯片进行第一次分割操作。 在切割操作之间，引线的暴露部分镀有可焊接的金属。 通过在由第一单片化制成的第一切割内进行第二切割操作，引线的裸露金属的至少一半保持镀覆。 因此，可以形成更好的焊点，这允许更简单的目视检查。

公开(公告)号：US08643158B2

公开(公告)日：2014-02-04

申请号：US13413652

申请日：2012-03-07

申请人： Peng Liu ,  Qingchun He ,  Ping Wu

发明人： Peng Liu ,  Qingchun He ,  Ping Wu

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49537 ,  H01L21/4828 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor package is assembled using first and second lead frames. The first lead frame includes a die flag and the second lead frame includes lead fingers. When the first and second lead frames are mated, the lead fingers surround the die flag. Side surfaces of the die flag are partially etched to form an extended die attach surface on the die flag, and portions of the top surface of each of the lead fingers also are partially etched to form lead finger surfaces that are complementary with the etched side surfaces of the die flag. A semiconductor die is attached to the extended die attach surface and bond pads of the semiconductor die are electrically connected to the lead fingers. An encapsulating material covers the die, electrical connections, and top surfaces of the die flag and lead fingers.

摘要翻译： 使用第一和第二引线框组装半导体封装。 第一引线框架包括管芯标记，并且第二引线框架包括引线指。 当第一和第二引线框架配合时，引线指环围绕管芯标记。 模具标记的侧表面被部分蚀刻以在模具标记上形成延伸的芯片附接表面，并且每个引线指的顶表面的部分也被部分地蚀刻以形成与蚀刻的侧表面互补的引线指表面 的旗帜。 半导体管芯附着到延伸管芯附接表面，并且半导体管芯的接合焊盘电连接到引线指。 封装材料覆盖管芯标记和引线指的管芯，电连接和顶表面。

公开(公告)号：US08080448B1

公开(公告)日：2011-12-20

申请号：US13092170

申请日：2011-04-22

申请人： Ping Wu ,  Qingchun He ,  Peng Liu

发明人： Ping Wu ,  Qingchun He ,  Peng Liu

IPC分类号： H01L21/00

CPC分类号： H01L23/49537 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49558 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making semiconductor devices includes producing an array of first lead frames having rows of first electrical contact elements on respective sides. Sub-assemblies are produced by applying a first molding compound peripherally to provide support between the first electrical contact elements of each of the first lead frames, and singulating the sub-assemblies. An array of assemblies is produced, each of which includes a second lead frame having rows of second electrical contact elements on respective sides, a respective one of the sub-assemblies disposed in the second lead frame with the rows of first electrical contact elements nested adjacent to and inside the rows of second electrical contact elements, and a semiconductor die mounted on the sub-assembly. The assemblies are encapsulated using a second molding compound with the rows of first and second electrical contact elements exposed on adjacent sides of an active face of the respective assembly.

摘要翻译： 一种制造半导体器件的方法包括制造具有在相应侧面上具有第一电接触元件行的第一引线框阵列。 子组件通过在周边施加第一模塑料以在第一引线框架中的每一个的第一电接触元件之间提供支撑并且分割子组件来制造。 产生一组组件，每个组件包括在相应侧面上具有一列第二电接触元件的第二引线框架，设置在第二引线框架中的相应的一个子组件，第一电接触元件列嵌套在相邻 第二电接触元件的行内和内部，以及安装在子组件上的半导体管芯。 使用第二模制化合物封装组件，其中第一和第二电接触元件排暴露在相应组件的有效面的相邻侧上。

公开(公告)号：US20110065240A1

公开(公告)日：2011-03-17

申请号：US12578556

申请日：2009-10-13

申请人： Xu GAO ,  Qingchun He ,  Nan Xu

发明人： Xu GAO ,  Qingchun He ,  Nan Xu

IPC分类号： H01L21/60 ,  H01L23/495 ,  B21D31/02

CPC分类号： H01L21/4842 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/48247 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame and a method of making a lead frame for a semiconductor package. The lead frame is formed by stamping a lead frame material into a desire configuration. The stamped lead frame is then affixed to a support material. When assembling a semiconductor package using the lead frame, during saw singuation, the saw does not have to cut through much lead frame material. Thus, the saw blade does not wear quickly.

摘要翻译： 引线框架和制造用于半导体封装的引线框架的方法。 引线框架通过将引线框架材料冲压成期望配置而形成。 然后将冲压的引线框架固定到支撑材料上。 当使用引线框组装半导体封装时，在锯切时，锯不必切割大量的引线框架材料。 因此，锯片不会很快磨损。

公开(公告)号：US08642395B2

公开(公告)日：2014-02-04

申请号：US12727258

申请日：2010-03-19

申请人： Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

发明人： Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L33/62

CPC分类号： H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83099 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.

摘要翻译： 芯片引线封装半导体器件的组装方法包括以下步骤：安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤，这大大提高了引线接合质量和第二成型质量。 此外，由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题，所以避免了环氧树脂和模具之间的脱层危险。