Abstract:
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilicon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
Abstract:
Microchannels for conducting and expelling a fluid are embedded in a surface of a silicon substrate. A channel seal is made of plural cross structures formed integrally with the silicon substrate. The cross structures are arranged sequentially over each channel, each cross structure having a chevron shape. The microchannel is sealed by oxidizing at least partially the cross structures, whereby the spaces therebetween are filled. A dielectric seal which overlies the thermally oxidized cross structures forms a complete seal and a substantially planar top surface to the silicon substrate. The dielectric seal is formed of a low pressure chemical vapor deposition (LPCVD) dielectric layer. The channel is useful in the production of an ink jet print in head, and has a polysilicon heater overlying the dielectric seal. A current passing through the heater causes a corresponding increase in the temperature of the ink in the microchannel, causing same to be expelled therefreom. After expulsion of the fluid, the microchannel is refilled by capillary action. Control circuitry, including bonding pads and sensors, can be formed integrally on the silicon substrate. In drug or chemical delivery systems, sensors and/or stimulation circuitry for sensing or inducing neural and other response can be formed directly in the silicon substrate which contains the microchannel. The sensor is disposed in close proximity to the chemical distribution nozzle, facilitating neural and other studies. Microvalve arrangements can be formed with the microchannel, controlled by the on-chip circuitry.
Abstract:
Method and device for forming a membrane includes providing a glass substrate, and depositing a thin layer of chromium on the glass substrate. The thin layer of chromium is patterned to form a deflection electrode and interconnect leads. A sacrificial layer of aluminum is deposited on top of the patterned chromium layer, then the sacrificial layer is patterned to define anchor regions. On top of the sacrificial layer, a thick layer of chromium is deposited, and the thick layer of chromium is patterned to form a membrane. The sacrificial layer is then etched to release the membrane.
Abstract:
A micro-optical device having an aligned waveguide switch. The device includes a stationary input part, a stationary output part and a movable part. The stationary input part and the stationary output part each have a plurality of input and output waveguides, respectively. The movable part has a plurality of switching waveguides and is movable relative to the stationary input and output parts. A stop block limits movement of the movable part in order to align at least one of the switching waveguides with the applicable input waveguide(s) and output waveguide(s). The movement of the movable part is substantially transverse.
Abstract:
A heterogeneous device comprises a substrate and a plurality of heterogeneous circuit devices defined in the substrate. In embodiments, a plurality of heterogeneous circuit devices are integrated by successively masking and ion implanting the substrate. The heterogeneous device may further comprise at least one microelectromechanical system-based element and/or at least one photodiode. In embodiments, the heterogeneous circuit devices comprise at least one CMOS transistor and at least one DMOS transistor. In embodiments, the substrate comprises a layer of silicon or a layer of p-type silicon. In other embodiments, the substrate comprises a silicon-on-insulator wafer comprising a single-crystal-silicon layer or a single-crystal-P-silicon layer, a substrate and an insulator layer therebetween.
Abstract:
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
Abstract:
A micro-optoelectromechanical system based device with aligned structures comprises at least one optical structure formed in a silicon layer of the device and at least one optical fiber connection structure that is self-aligned with the at least one optical structure. In embodiments, the at least one optical fiber connection structure is formed in a substrate of the device and may comprise a V-groove. In other embodiments, the at least one optical structure may comprise a waveguide. A nitride layer may be formed on at least a portion of the waveguide. In various embodiments, the silicon layer may be a single-crystal-silicon layer of a silicon-on-insulator wafer. A method for fabricating a micro-optoelectromechanical system based device with aligned structures is provided in which the at least one optical structure and the at least one optical fiber connection structure are defined using the same masking layer.
Abstract:
A microoptomechanical structure produced by defining a microoptical structure in a single-crystal silicon layer separated by an insulator layer from a handle wafer, such as a SOI wafer, selectively etching the single crystal silicon layer, depositing a sacrificial oxide layer on the etched single crystal silicon layer, depositing and etching a polysilicon layer on the sacrificial oxide layer, with remaining polysilcon forming hinge elements, and releasing formed microoptical structures. Embodiments use an oxide as an insulator, and other embodiments provide for wafer bonding of the silicon layer to the insulator layer.
Abstract:
A method and structure are described for a monolithic roofshooter ink jet printhead which has nozzles and ink channels formed in a polyimide layer overlying a silicon substrate. Resistor heaters, addressing logic circuitry, and ink inlets are formed in a silicon substrate. A fabrication process, simple and monolithic, is performed at low temperatures resulting in a structure which has nozzle diameters of 30 .mu. separated by distances of 10 .mu. or less. This structure results in a printhead which has a printing resolution of 630 dpi.
Abstract:
Microchannels for conducting and expelling a fluid are embedded in a surface of a silicon substrate. A channel seal is made of plural cross structures formed integrally with the silicon substrate. The cross structures are arranged sequentially over each channel, each cross structure having a chevron shape. The microchannel is sealed by oxidizing at least partially the cross structures, whereby the spaces therebetween are filled. A dielectric seal which overlies the thermally oxidized cross structures forms a complete seal and a substantially planar top surface to the silicon substrate. The dielectric seal is formed of a low pressure chemical vapor deposition (LPCVD) dielectric layer. The channel is useful in the production of an ink jet print head, and has a polysilicon heater overlying the dielectric seal. A current passing through the heater causes a corresponding increase in the temperature of the ink in the microchannel, causing same to be expelled therefreom. After expulsion of the fluid, the microchannel is refilled by capillary action. Control circuitry, including bonding pads and sensors, can be formed integrally on the silicon substrate. In drug or chemical delivery systems, sensors and/or stimulation circuitry for sensing or inducing neural and other response can be formed directly in the silicon substrate which contains the microchannel. The sensor is disposed in close proximity to the chemical distribution nozzle, facilitating neural and other studies. Microvalve arrangements can be formed with the microchannel, controlled by the on-chip circuitry.