摘要:
A semiconductor device includes a group of fin structures. The group of fin structures includes a conductive material and is formed by growing the conductive material in an opening of an oxide layer. The semiconductor device further includes a source region formed at one end of the group of fin structures, a drain region formed at an opposite end of the group of fin structures, and at least one gate.
摘要:
A method of forming a semiconductor device includes forming a fin on an insulating layer, where the fin includes a number of side surfaces, a top surface and a bottom surface. The method also includes forming a gate on the insulating layer, where the gate has a substantially U-shaped cross-section at a channel region of the semiconductor device.
摘要:
A double-gate semiconductor device includes a substrate, an insulating layer, a fin, source and drain regions and a gate. The insulating layer is formed on the substrate and the fin is formed on the insulating layer. The source region is formed on the insulating layer adjacent a first side of the fin and the drain region is formed on the second side of the fin opposite the first side. The source and drain regions have a greater thickness than the fin in the channel region of the semiconductor device.
摘要:
A method of forming a gate in a FinFET device includes forming a fin on an insulating layer, forming source/drain regions and forming a gate oxide on the fin. The method also includes depositing a gate material over the insulating layer and the fin, depositing a barrier layer over the gate material and depositing a bottom anti-reflective coating (BARC) layer over the barrier layer. The method further includes forming a gate mask over the BARC layer, etching the BARC layer, where the etching terminates on the barrier layer, and etching the gate material to form the gate.
摘要:
A device and method for making a semiconductor-on-insulator (SOI) structure having a leaky, thermally conductive material (LTCIM) layer disposed between a semiconductor substrate and a semiconductor layer.
摘要:
Multiple dopant implantations are performed on a FinFET device to thereby distribute the dopant in a substantially uniform manner along a vertical depth of the FinFET in the source/drain junction. Each of the multiple implantations may be performed at different tilt angles.
摘要:
A method for forming a group of structures in a semiconductor device includes forming a conductive layer on a substrate, where the conductive layer includes a conductive material, and forming an oxide layer over the conductive layer. The method further includes etching at least one opening in the oxide layer, filling the at least one opening with the conductive material, etching the conductive material to form spacers along sidewalls of the at least one opening, and removing the oxide layer and a portion of the conductive layer to form the group of structures.
摘要:
An improved semiconductor device, such as a MOSFET with raised source/drain extensions on a substrate with isolation trenches etched into the surface of the substrate . The device has thin first dielectric spacers on the side of a gate and gate oxide and extend from the top of the gate to the surface of the substrate. Raised source/drain extensions are placed on the surface of a substrate, which extend from the first dielectric spacers to the isolation trenches. Thicker second dielectric spacers are placed adjacent to the first dielectric spacers and extend from the top of the first dielectric spacers to the raised source/drain extensions. Raised source/drain regions are placed on the raised source/drain extensions, and extend from the isolation trenches to the second dielectric spacers. The semiconductor device has very shallow source drain extensions which result in a reduced short channel effect.
摘要:
A method for making a ULSI MOSFET includes establishing a gate void in a field oxide layer above a silicon substrate, after source and drain regions with associated source and drain extensions have been established in the substrate. A gate electrode is deposited in the void and gate spacers are likewise deposited in the void on the sides of the gate electrode, such that the gate electrode is spaced from the walls of the void. The spacers, not the gate electrode, are located above the source/drain extensions, such that fringe coupling between the gate electrode and the source and drain extensions is suppressed.
摘要:
A triple gate metal-oxide semiconductor field-effect transistor (MOSFET) includes a fin structure, a first gate formed adjacent a first side of the fin structure, a second gate formed adjacent a second side of the fin structure opposite the first side, and a top gate formed on top of the fin structure. A gate around MOSFET includes multiple fins, a first sidewall gate structure formed adjacent one of the fins, a second sidewall gate structure formed adjacent another one of the fins, a top gate structure formed on one or more of the fins, and a bottom gate structure formed under one or more of the fins.