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公开(公告)号：US20100148380A1
公开(公告)日：2010-06-17
申请号：US12637359
申请日：2009-12-14
CPC分类号： C08G59/3245 , C08G59/186 , C08G59/42 , C08L63/00 , C08L63/06 , H01L23/24 , H01L23/293 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: R11—COO—R12 (1) wherein R11 and R12 are CnH2n+1 and n is 1 to 30 and a compound represented by: wherein R1, R2, and R3 are selected from H, —OH, —OR, and —OCOCaHb with the proviso that at least one includes —OCOCaHb; R is CnH2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.
摘要翻译： 一种热固性环氧树脂组合物，其包含（A）三嗪衍生物环氧树脂和酸酐的反应混合物，其中环氧基当量相对于酸酐当量为0.6-2.0; （B）内部脱模剂; （C）反射材料; （D）无机填料; 和（E）固化催化剂。 组分（B）的内部脱模剂包含由以下化合物表示的羧酸酯：R11-COO-R12（1）其中R11和R12为CnH2n + 1且n为1至30，以及由下式表示的化合物：其中R1，R2， 并且R 3选自H，-OH，-OR和-OCOCaHb，条件是至少一个包括-OCOCaHb; R为C n H 2n + 1（n为1〜30的整数），a为10〜30，b为17〜61。
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12.发明授权Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit 有权树脂组合物，发光半导体器件的反射器和发光半导体单元公开(公告)号：US08455899B2
公开(公告)日：2013-06-04
申请号：US13074317
申请日：2011-03-29
申请人： Yusuke Taguchi , Toshio Shiobara
发明人： Yusuke Taguchi , Toshio Shiobara
CPC分类号： H01L33/60 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01012 , H01L2924/01029 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein is a resin composition including 100 parts by weight of an organic resin and 50 to 1,000 parts by weight of an inorganic filler, wherein 10 to 100% of the inorganic filler is composed of an oxide of a rare earth element.
摘要翻译： 本发明公开了一种树脂组合物，其包含100重量份的有机树脂和50-1000重量份的无机填料，其中10-100重量％的无机填料由稀土元素的氧化物组成。
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公开(公告)号：US08088856B2
公开(公告)日：2012-01-03
申请号：US12617919
申请日：2009-11-13
CPC分类号： C08G59/306 , C08G59/3245 , C08G59/42
摘要： A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).
摘要翻译： 产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。 热固性树脂组合物包含下列成分（A）〜（E）：（A）在各分子内含有至少一个环氧基的异氰脲酸衍生物，其量为100质量份，（B）有机硅树脂 在各分子内含有至少一个环氧基，其量为10〜1000质量份，（C）酸酐固化剂，其量使得[组分（A）和组分 （C）成分中的（B）/羧基当量]在0.6〜2.2的范围内，（D）固化促进剂的含量为0.05〜5质量份，相对于100质量份 组分（A），（B）和（C）的质量和（E）无机填料的量为每100质量份组分（A），（B ）和（C）。
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公开(公告)号：US20100260680A1
公开(公告)日：2010-10-14
申请号：US12663202
申请日：2008-06-05
申请人： Hisataka Yasuda , Yuriko Furuya , Yusuke Taguchi
发明人： Hisataka Yasuda , Yuriko Furuya , Yusuke Taguchi
IPC分类号： A61K38/16 , A61K49/00 , A61K39/395 , C12Q1/02
CPC分类号： A61K38/1793 , A61K38/1875 , A61K38/45 , A61K39/39541 , A61K45/06 , C07K16/2875 , C07K2317/76 , G01N33/5047 , A61K2300/00
摘要： The present invention provides an osteogenesis enhancer comprising a molecule capable of acting on RANKL that enhances differentiation, proliferation, maturation, or calcification of osteoblasts or cells capable of differentiating into osteoblasts. A pharmaceutical composition for treatment or prevention of bone metabolism diseases associated with osteopenia, which comprising, as an active ingredient, a compound that acts on RANKL located on osteoblasts or cells capable of differentiating into osteoblasts and promotes differentiation, proliferation, maturation, or calcification of osteoblasts or cells capable of differentiating into osteoblasts is provided.
摘要翻译： 本发明提供了一种成骨增强剂，其包含能够作用于RANKL的分子，其增强成骨细胞或能够分化成成骨细胞的细胞的分化，增殖，成熟或钙化。 一种用于治疗或预防与骨质减少相关的骨代谢疾病的药物组合物，其包含作用于位于成骨细胞上的RANKL或能够分化成成骨细胞的细胞作为活性成分，并促进分化，增殖，成熟或钙化的化合物 提供能够分化成成骨细胞的成骨细胞或细胞。
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公开(公告)号：US20100125116A1
公开(公告)日：2010-05-20
申请号：US12617919
申请日：2009-11-13
CPC分类号： C08G59/306 , C08G59/3245 , C08G59/42
摘要： A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).
摘要翻译： 产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。 热固性树脂组合物包含下列成分（A）〜（E）：（A）在各分子内含有至少一个环氧基的异氰脲酸衍生物，其量为100质量份，（B）有机硅树脂 在各分子内含有至少一个环氧基，其量为10〜1000质量份，（C）酸酐固化剂，其量使得[组分（A）和组分 （C）成分中的（B）/羧基当量]在0.6〜2.2的范围内，（D）固化促进剂的含量为0.05〜5质量份，相对于100质量份 组分（A），（B）和（C）的质量和（E）无机填料的量为每100质量份组分（A），（B ）和（C）。
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公开(公告)号：US09303115B2
公开(公告)日：2016-04-05
申请号：US12637359
申请日：2009-12-14
IPC分类号： C08K5/10 , C08L63/00 , C08G59/32 , C08G59/18 , C08G59/42 , C08L63/06 , H01L23/29 , H01L23/00 , H01L23/24
CPC分类号： C08G59/3245 , C08G59/186 , C08G59/42 , C08L63/00 , C08L63/06 , H01L23/24 , H01L23/293 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: R11—COO—R12 (1) wherein R11 and R12 are CnH2n+1 and n is 1 to 30 and a compound represented by: wherein R1, R2, and R3 are selected from H, —OH, —OR, and —OCOCaHb with the proviso that at least one includes —OCOCaHb; R is CnH2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.
摘要翻译： 一种热固性环氧树脂组合物，其包含（A）三嗪衍生物环氧树脂和酸酐的反应混合物，其中环氧基当量相对于酸酐当量为0.6-2.0; （B）内部脱模剂; （C）反射材料; （D）无机填料; 和（E）固化催化剂。 组分（B）的内部脱模剂包含由以下化合物表示的羧酸酯：R11-COO-R12（1）其中R11和R12为CnH2n + 1且n为1至30，以及由下式表示的化合物：其中R1，R2， 并且R 3选自H，-OH，-OR和-OCOCaHb，条件是至少一个包括-OCOCaHb; R为C n H 2n + 1（n为1〜30的整数），a为10〜30，b为17〜61。
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17.发明授权White heat-curable silicone resin composition, optoelectronic part case, and molding method 有权白色可热固化硅树脂组合物，光电部件外壳和成型方法公开(公告)号：US08013056B2
公开(公告)日：2011-09-06
申请号：US12344048
申请日：2008-12-24
CPC分类号： C08L83/04 , C08G77/16 , C08G77/18 , C08K3/011 , C08K3/10 , C08K3/22 , C08K5/0025 , C08K5/56 , C08K2003/2241 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
摘要翻译： 一种有机硅树脂组合物，其包含（A）熔点为40-130℃的可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）固化催化剂的转移或压缩 在高温下成型为具有白色，耐热性，耐光性和最小黄化的固化产物。 固化产品适用于封装有光电子部件的情况。
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18.发明申请HEAT-CURABLE SILICONE RESIN-EPOXY RESIN COMPOSITION, AND PREMOLDED PACKAGE MOLDED FROM SAME 有权可固化硅氧烷树脂环氧树脂组合物和从其模塑的预制包装公开(公告)号：US20100001311A1
公开(公告)日：2010-01-07
申请号：US12496460
申请日：2009-07-01
申请人： Yusuke Taguchi , Toshio Shiobara
发明人： Yusuke Taguchi , Toshio Shiobara
CPC分类号： H01L23/49861 , C08G77/16 , C08G77/18 , C08L63/00 , C08L63/06 , C08L83/04 , C08L83/06 , H01L23/295 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , C08L2666/14 , C08L2666/22 , H01L2924/00
摘要： A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.
摘要翻译： 作为用于高亮度LED或太阳能电池的预先包装的理想的可热固化的有机硅树脂 - 环氧树脂组合物。 该组合物含有（A）可热固化的有机硅树脂，（B）三嗪衍生物环氧树脂和酸酐的组合，或通过它们反应获得的预聚物，（C）无机填料和（D） 固化促进剂。 该组合物表现出优异的固化性，并且产生均匀的固化产物，其在长时间内显示出优异的耐热性和耐光性保持性，并且几乎不发黄。
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