Determining coordinates for an area of interest on a specimen

    公开(公告)号:US10127653B2

    公开(公告)日:2018-11-13

    申请号:US14804102

    申请日:2015-07-20

    Abstract: Methods and systems for determining coordinates for an area of interest on a specimen are provided. One system includes one or more computer subsystems configured for, for an area of interest on a specimen being inspected, identifying one or more targets located closest to the area of interest. The computer subsystem(s) are also configured for aligning one or more images for the one or more targets to a reference for the specimen. The image(s) for the target(s) and an image for the area of interest are acquired by an inspection subsystem during inspection of the specimen. The computer subsystem(s) are further configured for determining an offset between the image(s) for the target(s) and the reference based on results of the aligning and determining modified coordinates of the area of interest based on the offset and coordinates of the area of interest reported by the inspection subsystem.

    Voltage Contrast Based Fault and Defect Inference in Logic Chips
    14.
    发明申请
    Voltage Contrast Based Fault and Defect Inference in Logic Chips 审中-公开
    逻辑芯片中基于电压对比的故障和缺陷推理

    公开(公告)号:US20160341791A1

    公开(公告)日:2016-11-24

    申请号:US15136680

    申请日:2016-04-22

    Inventor: Brian Duffy

    Abstract: A voltage contrast imaging defect detection system includes a voltage contrast imaging tool and a controller coupled to the voltage contrast imaging tool. The controller is configured to generate one or more voltage contrast imaging metrics for one or more structures on a sample, determine one or more target areas on the sample based on the one or more voltage contrast imaging metrics, receive a voltage contrast imaging dataset for the one or more target areas on the sample from the voltage contrast imaging tool, and detect one or more defects based on the voltage contrast imaging dataset.

    Abstract translation: 电压对比度成像缺陷检测系统包括电压对比度成像工具和耦合到电压对比度成像工具的控制器。 所述控制器被配置为针对样本上的一个或多个结构生成一个或多个电压对比度成像度量,基于所述一个或多个电压对比度成像度量来确定所述样本上的一个或多个目标区域,接收所述电压对比成像数据集 来自电压对比成像工具的样本上的一个或多个目标区域,并且基于电压对比度成像数据集检测一个或多个缺陷。

    Generalized Virtual Inspector
    15.
    发明申请
    Generalized Virtual Inspector 有权
    广义虚拟检查员

    公开(公告)号:US20140241610A1

    公开(公告)日:2014-08-28

    申请号:US14184417

    申请日:2014-02-19

    Abstract: Generalized virtual inspectors are provided. One system includes two or more actual systems configured to perform one or more processes on specimen(s) while the specimen(s) are disposed within the actual systems. The system also includes one or more virtual systems coupled to the actual systems to thereby receive output generated by the actual systems and to send information to the actual systems. The virtual system(s) are configured to perform one or more functions using at least some of the output received from the actual systems. The virtual system(s) are not capable of having the specimen(s) disposed therein.

    Abstract translation: 提供广泛的虚拟检查员。 一个系统包括两个或更多个实际系统,其被配置为在样本被布置在实际系统内时对样本执行一个或多个过程。 该系统还包括耦合到实际系统的一个或多个虚拟系统,从而接收由实际系统产生的输出并向实际系统发送信息。 虚拟系统被配置为使用从实际系统接收的至少一些输出来执行一个或多个功能。 虚拟系统不能将样本置于其中。

    And noise based care areas
    17.
    发明授权

    公开(公告)号:US10832396B2

    公开(公告)日:2020-11-10

    申请号:US16364161

    申请日:2019-03-25

    Abstract: Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.

    ACTIVE LEARNING FOR DEFECT CLASSIFIER TRAINING

    公开(公告)号:US20190370955A1

    公开(公告)日:2019-12-05

    申请号:US16424431

    申请日:2019-05-28

    Abstract: Methods and systems for performing active learning for defect classifiers are provided. One system includes one or more computer subsystems configured for performing active learning for training a defect classifier. The active learning includes applying an acquisition function to data points for the specimen. The acquisition function selects one or more of the data points based on uncertainty estimations associated with the data points. The active learning also includes acquiring labels for the selected one or more data points and generating a set of labeled data that includes the selected one or more data points and the acquired labels. The computer subsystem(s) are also configured for training the defect classifier using the set of labeled data. The defect classifier is configured for classifying defects detected on the specimen using the images generated by the imaging subsystem.

    Virtual inspection systems for process window characterization

    公开(公告)号:US10402461B2

    公开(公告)日:2019-09-03

    申请号:US14946777

    申请日:2015-11-20

    Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing.

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