摘要:
A main power supply and a backup power supply have the same set voltage. To prevent electrical power from being supplied from the backup power supply to a load circuit, during a normal operation, a power supply control unit gives a standby instruction to the backup power supply so that the backup power supply is on standby at a voltage lower than that of the main power supply. When an AC power supply is stopped, the backup power supply is operated at the set voltage and the main power supply is stopped.
摘要:
In a method for manufacturing a semiconductor device, a first high frequency power of a first frequency is applied to a processing gas to generate a plasma of the processing gas, a second high frequency power of a second frequency smaller than the first frequency is applied to a substrate to be processed. Further, a to-be-etched layer disposed under a resist film having a pattern of openings is etched by using the resist film as a mask, the to-be-etched layer being disposed on a surface of the substrate. In addition, dimensions of openings formed in the to-be-etched layer are controlled by varying an applied power of the first high frequency.
摘要:
Provided are a motion recognition apparatus, a motion recognition system and a motion recognition method that enable ‘event motions’ to be recognized with a small number of calculations. The motion recognition system, which recognizes user motions by using sensor data, is configured to be provided with: a cyclical loss detection means for detecting cyclical losses of sensor data when a user is moving; and a recognition processing means for setting data intervals to be used for recognizing motions in accordance with the cyclical losses of sensor data that were detected, and for recognizing user motions on the basis of sensor data for the data intervals that have been set.
摘要:
A method for protecting an exposed low-k surface is described. The method includes providing a substrate having a low-k insulation layer formed thereon and one or more mask layers overlying the low-k insulation layer with a pattern formed therein. Additionally, the method includes transferring the pattern in the one or more mask layers to the low-k insulation layer using one or more etching processes to form a trench and/or via structure in the low-k insulation layer. The method further includes forming an insulation protection layer on exposed surfaces of the trench and/or via structure during and/or following the one or more etching processes by exposing the substrate to a film forming compound containing C, H, and N. Thereafter, the method includes removing at least a portion of the one or more mask layers using a mask removal process.
摘要:
A site of interest extraction apparatus (10) includes: a passage section identification unit (4) that, for each user (20), renders a virtual line on a map using position information and direction information based on map information and on grid information identifying a plurality of sections, and identifies sections through which the virtual line passes, the position information and direction information being acquired for each user from a terminal device (21) owned by the user, and the virtual line being defined by the position information and direction information; an interest degree calculation unit (5) that, for each identified section, calculates an interest degree by adding a score in accordance with the virtual lines passing through the section; and a site of interest extraction unit (6) that selects one section based on the interest degrees and extracts the selected section as a site of interest to a plurality of users (20).
摘要:
A method for integrating metal-containing cap layers into copper (Cu) metallization of semiconductor devices. In one embodiment, the method includes providing a patterned substrate containing metal surfaces and dielectric layer surfaces, and modifying the dielectric layer surfaces by exposure to a reactant gas containing a hydrophobic functional group, where the modifying substitutes a hydrophilic functional group in the dielectric layer surfaces with a hydrophobic functional group. The method further includes depositing metal-containing cap layers selectively on the metal surfaces by exposing the modified dielectric layer surfaces and the metal surfaces to a deposition gas containing metal-containing precursor vapor.
摘要:
The present invention relates to a method of manufacturing a semiconductor device using a substrate including an organic low dielectric constant film containing a silicon, a carbon, an oxygen, and a hydrogen, with a resist pattern being formed on an upper layer side of the low dielectric constant film. The method comprising: an etching step in which the low dielectric constant film is etched by a plasma; an ashing step following to the etching step, in which the resist pattern is ashed by a plasma that is rich in oxygen radicals in such a manner that a relative dielectric constant of the low dielectric constant film can become 5.2 or more; and a recovering step following to the ashing step, in which an organic gas is supplied to the low dielectric constant film so as to recovery a damage of the low dielectric constant film caused by the plasma.
摘要:
A position information providing apparatus includes a sensor data acquiring unit acquiring sensor data, a feature amount calculating unit calculating a feature amount from the sensor data, and a confidence level calculating unit calculating a confidence level using the feature amount, wherein the sensor data is more than one, and the feature amount includes a statistical amount of more than one piece of the sensor data and an amount showing a form of the sensor data.
摘要:
A method for protecting an exposed low-k surface is described. The method includes providing a substrate having a low-k insulation layer formed thereon and one or more mask layers overlying the low-k insulation layer with a pattern formed therein. Additionally, the method includes transferring the pattern in the one or more mask layers to the low-k insulation layer using one or more etching processes to form a trench and/or via structure in the low-k insulation layer. The method further includes forming an insulation protection layer on exposed surfaces of the trench and/or via structure during and/or following the one or more etching processes by exposing the substrate to a film forming compound containing C, H, and N. Thereafter, the method includes removing at least a portion of the one or more mask layers using a mask removal process.
摘要:
The present invention is to provide a position information providing apparatus that allows the calculation of the confidence level of the measurement result with high accuracy.A position information providing apparatus includes a sensor data acquiring unit 110 acquiring sensor data, a feature amount calculating unit 120 calculating a feature amount from the sensor data, and a confidence level calculating unit 130 calculating a confidence level using the feature amount, wherein the sensor data is more than one, and the feature amount includes a statistical amount of more than one piece of the sensor data and an amount showing a form of the sensor data.