公开(公告)号：US20080076256A1

公开(公告)日：2008-03-27

申请号：US11902046

申请日：2007-09-18

申请人： Akihito Kawai ,  Takashi Ono ,  Hiroshi Morikazu

发明人： Akihito Kawai ,  Takashi Ono ,  Hiroshi Morikazu

IPC分类号： H01L21/311

CPC分类号： H01L21/3065 ,  B23K26/389 ,  B24B7/228 ,  H01L21/02057 ,  H01L21/76898

摘要： A method of forming a via hole reaching a bonding pad in a wafer, which have a plurality of devices on the front surface of a substrate and bonding pads on each of the devices, by applying a pulse laser beam from the rear surface of the substrate, comprising the steps of:affixing a protective member to the front surface of the substrate;grinding the rear surface of the substrate having the protective member affixed to the front surface to reduce the thickness of the wafer to a predetermined value;forming via holes in the substrate by applying a pulse laser beam from the rear surface of the substrate of the wafer having the predetermined thickness; andetching the wafer having the via holes in the substrate from the rear surface of the substrate.

摘要翻译： 一种通过从衬底的后表面施加脉冲激光束，形成通孔到达衬底的接合焊盘的方法，该通孔在衬底的前表面上具有多个器件和每个器件上的接合焊盘 包括以下步骤：将保护构件固定在基板的前表面上; 研磨具有固定在前表面的保护构件的基板的后表面，以将晶片的厚度减小到预定值; 通过从具有预定厚度的晶片的衬底的后表面施加脉冲激光束，在衬底中形成通孔; 并且从衬底的后表面蚀刻在衬底中具有通孔的晶片。

公开(公告)号：US20080029715A1

公开(公告)日：2008-02-07

申请号：US11878909

申请日：2007-07-27

申请人： Hiroshi Morikazu ,  Eri Kawagishi

发明人： Hiroshi Morikazu ,  Eri Kawagishi

IPC分类号： G01N23/00

CPC分类号： B23K26/0853 ,  B23K26/04 ,  B23K26/043 ,  B23K26/044 ,  B23K26/0626 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/67294 ,  H01L21/682

摘要： An alignment method of a laser beam processing machine comprising a chuck table, a laser beam application means having a condenser for applying a laser beam to the workpiece held on the chuck table, an image pick-up means for picking up an image of the workpiece held on the chuck table and a control means having a memory for storing the specifications of the workpiece, the method comprising the steps of storing the design coordinates of a processing position set based on the mark indicating the crystal orientation of a wafer and alignment marks; picking up an image of the periphery of the wafer with the image pick-up means and locating the mark indicating the crystal orientation of the wafer at a predetermined position; positioning the design coordinate position of each of the alignment marks set based on the mark indicating the crystal orientation of the wafer right below the condenser and applying a laser beam from the condenser so as to remove the insulating film in the alignment mark areas; and picking up an image of the alignment marks with the image pick-up means and adjusting the coordinates of the processing position of the wafer on the chuck table based on the image of the alignment marks.

摘要翻译： 一种激光束处理机的对准方法，包括：卡盘台，具有用于将激光束施加到保持在卡盘台上的工件的聚光器的激光束施加装置，用于拾取工件图像的图像拾取装置 保持在卡盘台上的控制装置和具有用于存储工件规格的存储器的控制装置，该方法包括以下步骤：基于指示晶片的晶体取向的标记和对准标记来存储设置的处理位置的设计坐标; 用图像拾取装置拾取晶片周边的图像，并将指示晶片的晶体取向的标记定位在预定位置; 将基于指示晶片的晶体取向的标记设置在冷凝器正下方并将来自冷凝器的激光束设置的每个对准标记的设计坐标位置定位，以便去除对准标记区域中的绝缘膜; 并且利用图像拾取装置拾取对准标记的图像，并且基于对准标记的图像调整卡盘台上的晶片的处理位置的坐标。

公开(公告)号：US20080020548A1

公开(公告)日：2008-01-24

申请号：US11826911

申请日：2007-07-19

申请人： Hiroshi Morikazu ,  Ryugo Oba ,  Yukio Morishige ,  Toshio Tsuchiya ,  Koji Yamaguchi

发明人： Hiroshi Morikazu ,  Ryugo Oba ,  Yukio Morishige ,  Toshio Tsuchiya ,  Koji Yamaguchi

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B23K26/0622 ,  B23K26/40 ,  B23K2103/50

摘要： A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.

摘要翻译： 一种晶片激光加工方法，用于沿着街道施加脉冲激光束，沿着街道形成沟槽，用于将由具有由绝缘膜和功能膜构成的层叠体构成的多个器件的晶片的多个器件分隔开， 衬底的前表面，其中脉冲激光束被设置为具有150kHz至100MHz的重复频率和5至25J / m的每单位长度的能量。

公开(公告)号：US20070235430A1

公开(公告)日：2007-10-11

申请号：US11783190

申请日：2007-04-06

申请人： Ryugo Oba ,  Hiroshi Morikazu

发明人： Ryugo Oba ,  Hiroshi Morikazu

IPC分类号： B23K26/03 ,  B23K26/06

CPC分类号： B23K26/0853 ,  B23K26/0736

摘要： A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table, a processing-feed means, an indexing-feed means, a processing-feed amount detection means for detecting the amount of feed, an indexing-feed amount detection means, and a control means, wherein the condenser constituting the laser beam application means comprises an elliptic spot forming means for forming a focal spot into an elliptic shape and a focal spot turning means for turning the elliptic focal spot on an optical axis as the center thereof; and the control means comprises a storage means for storing the X, Y coordinate values of a processing line formed on the workpiece, obtains the X, Y coordinate values of the current position of a laser beam application position based on detection signals from the processing-feed amount detection means and the indexing-feed amount detection means, and controls the focal spot turning means to ensure that the long axis of the focal spot should follow along the processing line based on the X, Y coordinate values of the detected current position and the X, Y coordinate values of the processing line stored in the storage means.

摘要翻译： 一种激光束处理机，包括用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，加工进给装置，分度供给装置，用于检测进给量的加工进给量检测装置 ，分度供给量检测装置和控制装置，其中构成激光束施加装置的电容器包括用于将焦点形成为椭圆形的椭圆点形成装置和用于转动椭圆焦点的焦斑转动装置 在光轴上作为其中心; 并且所述控制装置包括用于存储在所述工件上形成的处理线的X，Y坐标值的存储装置，基于来自所述处理对象的检测信号，获得所述激光束施加位置的当前位置的X，Y坐标值， 进给量检测装置和分度供给量检测装置，并且控制焦点转动装置，以基于检测到的当前位置的X，Y坐标值，确保焦斑的长轴沿着处理线跟随， 存储在存储装置中的处理线的X，Y坐标值。

公开(公告)号：US20070138156A1

公开(公告)日：2007-06-21

申请号：US11635539

申请日：2006-12-08

申请人： Keiji Nomaru ,  Yasuomi Kaneuchi ,  Hiroshi Morikazu

发明人： Keiji Nomaru ,  Yasuomi Kaneuchi ,  Hiroshi Morikazu

IPC分类号： B23K26/06

CPC分类号： B23K26/0869 ,  B23K26/082 ,  B23K26/0853 ,  B23K2101/40

摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application means comprises a laser oscillation means for oscillating a laser beam, a first acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the processing-feed direction (X-axis direction), and a second acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the indexing-feed direction (Y-axis direction).

摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置 （X轴方向）彼此相对移动夹具台和激光束施加机构的分度供给机构，使其相对于彼此垂直的分度方向（Y轴方向）相对移动 到处理供给方向（X轴方向），其中激光束施加装置包括用于振荡激光束的激光振荡装置，用于偏转激光振荡的激光束的光轴的第一声光偏转装置 光束振荡意味着处理进给方向（X轴方向），以及用于偏转由激光束振荡振荡的激光束的光轴的第二声光偏转装置 意味着分度进给方向（Y轴方向）。

公开(公告)号：US20070109526A1

公开(公告)日：2007-05-17

申请号：US11593045

申请日：2006-11-06

申请人： Hiroshi Morikazu ,  Toshio Tsuchiya ,  Tomoaki Endo ,  Koichi Takeyama

发明人： Hiroshi Morikazu ,  Toshio Tsuchiya ,  Tomoaki Endo ,  Koichi Takeyama

IPC分类号： G03B27/02 ,  G03B27/04

CPC分类号： B23K26/0736 ,  B23K26/0853 ,  B23K26/364 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/67092

摘要： A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.

摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，所述激光束施加装置包括用于振荡激光束的激光束振荡装置， 用于会聚由激光束振荡装置振荡的激光束的聚光器，其中所述聚光器包括具有第一柱面透镜的第一柱面透镜单元，具有第二柱面透镜的第二柱面透镜单元，所述第二柱面透镜单元被定位使得其会聚方向变为垂直 朝向第一柱面透镜的会聚方向，以及间隔调整机构，用于调整第一柱面透镜单元与第二柱面透镜单元之间的间隔。

公开(公告)号：US20060201920A1

公开(公告)日：2006-09-14

申请号：US11369945

申请日：2006-03-08

申请人： Hiroshi Morikazu ,  Keiji Nomaru ,  Katsuharu Negishi

发明人： Hiroshi Morikazu ,  Keiji Nomaru ,  Katsuharu Negishi

IPC分类号： B23K26/08

CPC分类号： B23K37/0235 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/40 ,  B23K37/0408 ,  B23K37/0435 ,  B23K2103/172 ,  B23K2103/50

摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y) perpendicular to the processing-feed direction (X), wherein the machine further comprises a processing-feed amount detection means for detecting a processing-feed amount; an indexing-feed amount detection means for detecting an indexing-feed amount; and a control means, which has a storage means for storing the X and Y coordinate values of a minute hole to be formed in the workpiece, and controls the laser beam application means based on the X and Y coordinate values of the minute hole stored in the storage means and detection signals from the processing-feed amount detection means and the indexing-feed amount detection means.

摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置 以及分度供给装置，用于使卡盘台和激光束施加装置相对于垂直于加工供给方向的分度方向（Y）相对移动， （X），其中所述机器还包括用于检测加工进给量的加工进给量检测装置; 用于检测分度供给量的分度供给量检测单元; 以及控制装置，其具有用于存储要在工件中形成的微孔的X和Y坐标值的存储装置，并且基于存储在所述微孔的X和Y坐标值来控制激光束施加装置 存储装置和来自处理供给量检测装置和分度供给量检测装置的检测信号。

公开(公告)号：US09174306B2

公开(公告)日：2015-11-03

申请号：US13413827

申请日：2012-03-07

申请人： Hiroshi Morikazu ,  Yoko Nishino

发明人： Hiroshi Morikazu ,  Yoko Nishino

IPC分类号： B23K26/00 ,  B23K26/06 ,  B23K26/40

CPC分类号： B23K26/064 ,  B23K26/0624 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/50

摘要： A laser processing method for a nonlinear crystal substrate having a plurality of crossing division lines which includes the step of applying a pulsed laser beam to a work surface of the nonlinear crystal substrate along the division lines to thereby form a plurality of laser processed grooves on the work surface along the division lines. The pulse width of the pulsed laser beam is set to 200 ps or less and the repetition frequency of the pulsed laser beam is set to 50 kHz or less.

摘要翻译： 一种具有多个交叉分割线的非线性晶体基板的激光加工方法，其特征在于，包括：沿着分割线向所述非线性晶体基板的工作面施加脉冲激光束，从而在所述非线性晶体基板上形成多个激光加工槽 工作面沿分界线。 脉冲激光束的脉冲宽度设定为200ps以下，将脉冲激光束的重复频率设定为50kHz以下。

公开(公告)号：US08912464B2

公开(公告)日：2014-12-16

申请号：US13592974

申请日：2012-08-23

申请人： Hiroshi Morikazu

发明人： Hiroshi Morikazu

IPC分类号： B23K26/03 ,  B23K26/40 ,  B23K26/00 ,  B23K26/36 ,  B23K26/06 ,  B23K26/08 ,  B23K26/38 ,  H01L21/768

CPC分类号： B23K26/032 ,  B23K26/0006 ,  B23K26/0626 ,  B23K26/0853 ,  B23K26/361 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/50 ,  H01L21/76802

摘要： A laser processed hole is formed in a workpiece. The workpiece has a first member formed of a first material bonded to a second member formed of a second material. A value is set representing the minimum number of shots of a pulsed laser beam when the spectral wavelength of plasma has changed from the spectral wavelength inherent in the first material to that of the second material. A maximum shot number is set representing a maximum value of the number of beam shots when the spectral wavelength of the plasma has completely changed. The beam is stopped if the number of shots has reached the minimum value and the spectral wavelength of the plasma has changed whereas the beam is continued until the number of shots reaches the maximum value if the spectral wavelength of the plasma has not changed even after the number of shots has reached the minimum value.

摘要翻译： 在工件上形成激光加工孔。 工件具有由与由第二材料形成的第二构件结合的第一材料形成的第一构件。 当等离子体的光谱波长从第一材料中固有的光谱波长变为第二材料的光谱波长时，设置表示脉冲激光束的最小照射数的值。 当等离子体的光谱波长完全改变时，设定最大拍摄数量，表示射束数量的最大值。 如果拍摄次数达到最小值，并且等离子体的光谱波长已经改变，则光束停止，而如果等离子体的光谱波长甚至在 拍摄张数达到最小值。

公开(公告)号：US08314014B2

公开(公告)日：2012-11-20

申请号：US12795887

申请日：2010-06-08

申请人： Hiroshi Morikazu

发明人： Hiroshi Morikazu

IPC分类号： H01L21/302

CPC分类号： B23K26/0853 ,  B23K26/0608 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0676 ,  B23K26/073 ,  B23K26/082 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/50 ,  H01L21/268

摘要： A laser processing apparatus including a laser beam applying unit. The laser beam applying unit includes a laser beam generating unit, a focusing unit, and an optical system for guiding a laser beam from the laser beam generating unit to the focusing unit. The optical system includes a first polarization beam splitter for splitting the laser beam generated from the laser beam generating unit into a first laser beam and a second laser beam, a half-wave plate inserted between the laser beam generating unit and the first polarization beam splitter, a first mirror for reflecting the first laser beam transmitted through the first polarization beam splitter to an optical path parallel to the optical path of the second laser beam, a second mirror for reflecting the second laser beam in a direction perpendicular to the direction of incidence of the second laser beam, and a second polarization beam splitter located at a position where the first laser beam reflected by the first mirror intersects the second laser beam reflected by the second mirror.

摘要翻译： 一种激光加工装置，包括激光束施加单元。 激光束施加单元包括激光束产生单元，聚焦单元和用于将来自激光束产生单元的激光束引导到聚焦单元的光学系统。 光学系统包括：第一偏振分束器，用于将从激光束产生单元产生的激光束分成第一激光束和第二激光束;半波片，其插入在激光束发生单元和第一偏振分束器 用于将通过第一偏振分束器传输的第一激光束反射到与第二激光束的光路平行的光路的第一反射镜，用于在垂直于入射方向的方向上反射第二激光束的第二反射镜 以及位于第一反射镜反射的第一激光束与由第二反射镜反射的第二激光束相交的位置的第二偏振光束分离器。