公开(公告)号：US5223454A

公开(公告)日：1993-06-29

申请号：US760889

申请日：1991-09-17

申请人： Takayuki Uda ,  Tasuku Tanaka ,  Yoshiaki Emoto ,  Shigeo Kuroda

发明人： Takayuki Uda ,  Tasuku Tanaka ,  Yoshiaki Emoto ,  Shigeo Kuroda

IPC分类号： H01L23/31 ,  H01L25/065 ,  H01L25/16

CPC分类号： H01L23/3121 ,  H01L25/0655 ,  H01L25/165 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/16145 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10S148/10 ,  Y10S438/951

摘要： A method of manufacturing a semiconductor integrated circuit device wherein a conductor film is formed on a front surface of a substrate by a lift-off technique; comprising forming a first resist film on that area of the substrate surface on which the conductor film is not formed, forming a second resist film on the whole substrate surface including the first resist film and a conductor film forming area of the substrate surface, providing a first opening for forming the conductor film in a conductor film forming area of the second resist film and also providing a second opening for forming a dummy conductor film in that area of the second resist film in which the conductor film is not formed, depositing the conductor film on the whole substrate surface including the substrate surface inside the first opening, the first resist film inside the second opening and the second resist film, and removing the second resist film and the first resist film respectively, so as to leave the conductor film inside the first opening and to remove the conductor film on the second resist film and the dummy conductor film on the first resist film.

摘要翻译： 一种制造半导体集成电路器件的方法，其中通过剥离技术在衬底的前表面上形成导体膜; 包括在其上未形成导体膜的基板表面的区域上形成第一抗蚀剂膜，在包括第一抗蚀剂膜和基板表面的导体膜形成区域的整个基板表面上形成第二抗蚀剂膜， 用于在第二抗蚀剂膜的导体膜形成区域中形成导体膜的第一开口，并且还在其中未形成导体膜的第二抗蚀剂膜的区域中提供用于形成虚设导体膜的第二开口， 在包括第一开口内的基板表面，第二开口内的第一抗蚀剂膜和第二抗蚀剂膜的整个基板表面上分别去除第二抗蚀剂膜和第一抗蚀剂膜，以便将导体膜留在内部 第一开口并且去除第二抗蚀剂膜上的导体膜和第一抗蚀剂膜上的虚设导体膜。

公开(公告)号：US20050020116A1

公开(公告)日：2005-01-27

申请号：US10740545

申请日：2003-12-22

申请人： Katsuro Kawazoe ,  Takayuki Uda ,  Kouichi Yamamoto ,  Tsutomu Sakamoto ,  Maria Katsuki

发明人： Katsuro Kawazoe ,  Takayuki Uda ,  Kouichi Yamamoto ,  Tsutomu Sakamoto ,  Maria Katsuki

IPC分类号： H01R13/24 ,  H01R33/76 ,  H01R13/62

CPC分类号： H01R13/24 ,  H01R12/52

摘要： There is provided a connector used for connecting a plurality of first terminals formed on a first electronic part to a plurality of respective second terminals formed on a second electronic part. The connector comprises an intermediate basis material having a spring characteristic, a plurality of first electrically conductive members provided on a first surface of the intermediate basis material, a plurality of second electrically conductive members provided on a second surface of the intermediate basis material, and wiring for connecting each of the first electrically conductive members to corresponding one of the second electrically conductive members.

摘要翻译： 提供了一种用于将形成在第一电子部件上的多个第一端子连接到形成在第二电子部件上的多个相应的第二端子的连接器。 连接器包括具有弹簧特性的中间基材料，设置在中间基材的第一表面上的多个第一导电构件，设置在中间基材的第二表面上的多个第二导电构件和布线 用于将每个第一导电构件连接到相应的一个第二导电构件。

公开(公告)号：US6121687A

公开(公告)日：2000-09-19

申请号：US987771

申请日：1997-12-09

申请人： Kazuhisa Miyamoto ,  Ryo Yamagata ,  Takayuki Uda

发明人： Kazuhisa Miyamoto ,  Ryo Yamagata ,  Takayuki Uda

IPC分类号： H01L21/822 ,  H01L21/82 ,  H01L23/50 ,  H01L27/04 ,  H01L29/80 ,  H01L31/112

CPC分类号： H01L23/50 ,  H01L2224/16 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011

摘要： An input-output circuit cell includes an input-output circuit formed on a semiconductor chip and having a signal terminal and an electric source terminal and a plurality of input-output bumps connected to the signal and electric-source terminals of the input-output circuit through wirings respectively, the plurality of input-output bumps being made to correspond to the input-output circuit and arranged at a center in a plane of projection of the input-output circuit. Accordingly, the input-output circuit is disposed in an arbitrary position on the semiconductor chip.

公开(公告)号：US5973406A

公开(公告)日：1999-10-26

申请号：US918019

申请日：1997-08-25

申请人： Masahide Harada ,  Toru Nishikawa ,  Ryohei Satoh ,  Osamu Yamada ,  Takayuki Uda ,  Mitsugu Shirai

发明人： Masahide Harada ,  Toru Nishikawa ,  Ryohei Satoh ,  Osamu Yamada ,  Takayuki Uda ,  Mitsugu Shirai

IPC分类号： H01L21/60 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/81 ,  H05K3/3436 ,  H01L2224/13111 ,  H01L2224/17517 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/09781 ,  H05K2201/2036 ,  H05K2203/0182 ,  H05K2203/086 ,  Y02P70/613

摘要： An electronic device is solder bonded properly without using fluxes nor precise positioning with respect to a substrate. A bond pad with a size about twice the size of terminal pad of the electronic device is formed in a region on the substrate where the electronic device is to be mounted. After placing the electronic device of the substrate surface, the whole unit is heated in a nitrogen atmosphere to melt a bump formed on the terminal pad of the electronic device. The molten solder wets and spreads over the bond pads formed on the substrate, thereby establishing reflow soldering between the bond pads and the terminal pads. The position of the electronic device with respect to the substrate is spontaneously corrected due to a self-alignment function induced by wetting and spreading of the molten solder over the bond pad of the substrate.

摘要翻译： 无需使用焊剂即可正确焊接电子设备，也不会对基板进行精确定位。 在要安装电子装置的基板上的区域中形成尺寸约为电子装置的端子焊盘尺寸的两倍的焊盘。 在放置基板表面的电子装置之后，将整个单元在氮气气氛中加热以熔化形成在电子装置的端子板上的凸块。 熔融的焊料润湿并扩散在形成在衬底上的接合焊盘上，从而在接合焊盘和端子焊盘之间建立回流焊接。 电子器件相对于衬底的位置由于通过在衬底的焊盘上的熔融焊料的润湿和扩散而引起的自对准功能自发校正。