公开(公告)号：US07934037B2

公开(公告)日：2011-04-26

申请号：US12847965

申请日：2010-07-30

Applicant: Horng-Yee Chou ,  Szu-Kuang Chou ,  Kuang-Yu Wang ,  I-Kang Yu

Inventor： Horng-Yee Chou ,  Szu-Kuang Chou ,  Kuang-Yu Wang ,  I-Kang Yu

IPC: G06F3/00 ,  G06F13/12 ,  H05K7/10

CPC classification number: G06F13/385 ,  G06K19/07732 ,  G06K19/07733 ,  H01R13/26 ,  Y02D10/14 ,  Y02D10/151

Abstract: Systems and methods for communicating using various protocols through the Secured Digital (SD) physical interface are disclosed. The invention covers, among others, single-mode and multi-mode hosts, single-mode and multi-mode devices, as well as techniques for initializing these hosts and devices in order to facilitate the aforementioned communication.

Abstract translation: 公开了使用各种协议通过安全数字（SD）物理接口进行通信的系统和方法。 本发明尤其涉及单模和多模式主机，单模和多模式装置，以及用于初始化这些主机和装置以便于上述通信的技术。

公开(公告)号：US07296345B1

公开(公告)日：2007-11-20

申请号：US10991313

申请日：2004-11-16

Applicant: Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee

Inventor： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee

IPC: H05K3/30 ,  H01R12/00

CPC classification number: G11B33/025 ,  B29C45/0055 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/14852 ,  B29C2045/1673 ,  B29C2045/2683 ,  B29L2031/3061 ,  B29L2031/3425 ,  H01R13/504 ,  H05K3/284 ,  H05K5/0278 ,  H05K5/065 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2203/1316 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/4922

Abstract: A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing portion is produced by injection molding using a first apparatus, and then the lower housing portion is transferred to a second molding apparatus. The PCBA is mounted onto the lower housing such that the plug connector is received in a protected region. The second molding apparatus is then closed, and an upper housing portion is injected molded over the PBCA and exposed peripheral edges of the lower housing portion such that the upper housing portion becomes fused to the lower housing portion. Multiple lower housing portions connected together by plastic tethers to form a plastic strip, which facilitates efficient transfer to the second molding apparatus as a unit. The tethers are subsequently removed (e.g., singulated) to form individual memory devices.

Abstract translation: 便携式存储装置包括模制外壳和封装有模制外壳的印刷电路板组件（PCBA），使得插头连接器从一端延伸。 通过使用第一装置的注射成型制造下壳体部分，然后将下壳体部分转移到第二模制装置。 PCBA安装在下壳体上，使得插头连接器被接收在受保护的区域中。 然后关闭第二模制设备，并且在PBCA上注入模塑上部壳体部分，并且将下部壳体部分暴露的外围边缘注入模塑，使得上部壳体部分熔化到下壳体部分。 通过塑料系绳连接在一起的多个下壳体部分形成塑料条，这有助于作为一个单元有效地转移到第二模制装置。 随后将系绳移除（例如，单个化）以形成单独的存储装置。

公开(公告)号：US07173826B1

公开(公告)日：2007-02-06

申请号：US10796311

申请日：2004-03-08

Applicant: Ren-Kang Chiou ,  Edward W. Lee ,  Kuang-Yu Wang

Inventor： Ren-Kang Chiou ,  Edward W. Lee ,  Kuang-Yu Wang

IPC: H05K1/14

CPC classification number: H05K5/0269

Abstract: A PC card frame kit for housing a printed circuit board assembly (PCBA) including a board (PCB) and a connector mounted on a back edge of the PCB. The frame kit includes a frame including first and second parallel side rails and an end rail extending between first ends of the first and second side rails. The frame defines an open end and a longitudinal slot for slidably receiving the PCB. Side panels of the PC card frame kit are then snap-coupled onto the frame.

Abstract translation: 用于容纳印刷电路板组件（PCBA）的PC卡框架套件，包括板（PCB）和安装在PCB后边缘的连接器。 框架套件包括框架，该框架包括第一和第二平行侧轨道以及在第一和第二侧轨道的第一端之间延伸的端轨。 框架限定开放端和用于可滑动地接收PCB的纵向槽。 然后将PC卡框架套件的侧面板快速连接到框架上。

公开(公告)号：US20050195581A1

公开(公告)日：2005-09-08

申请号：US10796716

申请日：2004-03-08

Applicant: Ren-Kang Chiou ,  Edward Lee ,  Kuang-Yu Wang

Inventor： Ren-Kang Chiou ,  Edward Lee ,  Kuang-Yu Wang

IPC: H05K7/14

CPC classification number: H05K5/0269

Abstract: A PC card frame kit for housing a printed circuit board (PCB) assembly including a PC board and a connector mounted on a back edge of the PCB. The frame kit includes a frame including first and second parallel side rails and an end rail extending between first ends of the first and second side rails. A pair of panels is connected to opposite sides of the frame by substantially identical (e.g., male-type) connection structures that are provided on both panels. A pair of ground contacts is provided on opposite sides of the PCB assembly connector that respectively contact the two panels. A metal support (shroud) is incorporated into the frame to receive the ends of the connection structures extending from both panels.

Abstract translation: 用于容纳印刷电路板（PCB）组件的PC卡框架套件，其包括PC板和安装在PCB的后边缘上的连接器。 框架套件包括框架，该框架包括第一和第二平行侧轨道以及在第一和第二侧轨道的第一端之间延伸的端轨。 一对面板通过设置在两个面板上的基本相同（例如，阳型）连接结构连接到框架的相对侧。 一对接地触头设置在分别接触两个面板的PCB组件连接器的相对两侧。 金属支撑件（护罩）被并入框架中以接纳从两个板延伸的连接结构的端部。

公开(公告)号：US20080038877A1

公开(公告)日：2008-02-14

申请号：US11872685

申请日：2007-10-15

Applicant: Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  I-Kang Yu

Inventor： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  I-Kang Yu

IPC: H01L21/00

CPC classification number: H05K5/0269 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G07C9/00087 ,  H05K5/026 ,  Y10T29/49128

Abstract: A light-weight flash hard drive includes a printed circuit board assembly (PCBA) mounted in a housing formed by a plastic frame and a pair of metal panels that are mounted on the plastic frame over the PCBA. The PCBA includes a PC board and a plug connector that is mounted on a front edge of the PCB. The plastic frame includes first and second parallel side rails and a back end rail extending between back ends of the first and second side rails. The frame defines an open front end and a longitudinal platform for receiving and supporting the PCBA such that the plug connector is exposed through the open front end. The metal panels are either snap-coupled to the plastic frame or to each other. Alternatively, or in addition, an adhesive or insulating film is provided between the metal panels and the IC devices mounted on the PCBA.

Abstract translation: 重量轻的闪存硬盘驱动器包括安装在由塑料框架形成的壳体中的印刷电路板组件（PCBA）和安装在PCBA上的塑料框架上的一对金属板。 PCBA包括安装在PCB前端的PC板和插头连接器。 塑料框架包括第一和第二平行侧轨道和在第一和第二侧轨道的后端之间延伸的后端轨道。 框架限定了开放的前端和用于接收和支撑PCBA的纵向平台，使得插头连接器通过敞开的前端露出。 金属面板或者卡扣联接到塑料框架或彼此。 或者或另外，在金属板和安装在PCBA上的IC器件之间提供粘合剂或绝缘膜。

公开(公告)号：US07301776B1

公开(公告)日：2007-11-27

申请号：US10990887

申请日：2004-11-16

Applicant: Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  I-Kang Yu

Inventor： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  I-Kang Yu

IPC: H05K1/14

CPC classification number: H05K5/0269 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G07C9/00087 ,  H05K5/026 ,  Y10T29/49128

Abstract: A light-weight flash hard drive includes a printed circuit board assembly (PCBA) mounted in a housing formed by a plastic frame and a pair of metal panels that are mounted on the plastic frame over the PCBA. The PCBA includes a PC board and a plug connector that is mounted on a front edge of the PCB. The plastic frame includes first and second parallel side rails and a back end rail extending between back ends of the first and second side rails. The frame defines an open front end and a longitudinal platform for receiving and supporting the PCBA such that the plug connector is exposed through the open front end. The metal panels are either snap-coupled to the plastic frame or to each other. Alternatively, or in addition, an adhesive or insulating film is provided between the metal panels and the IC devices mounted on the PCBA.

Abstract translation: 重量轻的闪存硬盘驱动器包括安装在由塑料框架形成的壳体中的印刷电路板组件（PCBA）和安装在PCBA上的塑料框架上的一对金属板。 PCBA包括安装在PCB前端的PC板和插头连接器。 塑料框架包括第一和第二平行侧轨道和在第一和第二侧轨道的后端之间延伸的后端轨道。 框架限定了开放的前端和用于接收和支撑PCBA的纵向平台，使得插头连接器通过敞开的前端露出。 金属面板或者卡扣联接到塑料框架或彼此。 或者或另外，在金属板和安装在PCBA上的IC器件之间提供粘合剂或绝缘膜。

公开(公告)号：US07264992B2

公开(公告)日：2007-09-04

申请号：US10913868

申请日：2004-08-06

Applicant: Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

Inventor： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/498

CPC classification number: G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

Abstract translation: 可拆卸的Flash集成内存模块卡具有塑料外壳和集成闪存模块。 在卡的背面，有暴露的接触垫。 当卡插入卡主机设备时，卡可以通过暴露的焊盘与设备通信。 该制造方法包括制造存储器模块并利用塑料模制技术来制造卡外壳。 该方法包括准备基板，安装部件，测试模块，准备模制装置和模制卡体。

公开(公告)号：US07032827B2

公开(公告)日：2006-04-25

申请号：US10871741

申请日：2004-06-18

Applicant: Kuang-Yu Wang ,  Jim Ni ,  Sun-Teck See

Inventor： Kuang-Yu Wang ,  Jim Ni ,  Sun-Teck See

IPC: G06K19/06

CPC classification number: G06K19/07732 ,  G06K19/077 ,  H05K1/0295 ,  H05K1/117 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09954

Abstract: A memory card including a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The housing includes an enlarged window (or windows) that exposes two or more contact pads in each of the multiple rows, thereby facilitating slidable insertion of the memory card into a socket of a host system. Alignment notches are formed in the side edges of the PCB, and/or alignment pins are utilized for properly aligning the PCBA within the housing.

Abstract translation: 包括与现有13焊盘MMC机械外形尺寸一致的PCB组件的存储卡，以及与SD机械外形尺寸一致的外壳，从而提供单个PCBA和外壳布置，可用于生产MMC和 SD存储卡。 十三个接触垫支持所有MMC和SD接触焊盘图案，但是被修改以便于写保护开关。 壳体包括在多行中的每一行中暴露两个或更多个接触垫的放大窗口（或窗户），从而有助于存储卡可滑动地插入到主机系统的插座中。 对准凹口形成在PCB的侧边缘中，和/或对准销用于使PCBA在壳体内正确对准。

公开(公告)号：US07009846B1

公开(公告)日：2006-03-07

申请号：US10903939

申请日：2004-07-30

Applicant: Kuang-Yu Wang ,  Jim Ni ,  I-Kang Yu

Inventor： Kuang-Yu Wang ,  Jim Ni ,  I-Kang Yu

IPC: H05K7/02

CPC classification number: H05K5/0286 ,  Y10S439/945

Abstract: A socket having thirteen contact springs arranged in a manner that supports existing MMC and SD form factors, and also supports a combination SD/MMC flash memory card. The combination memory card includes a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The contacts springs of the socket are arranged to make contact with the modified pad pattern, but to also be backward compatible with existing SD and MMC form factors. A system including the socket and combination SD/MMC flash memory card is also disclosed.

Abstract translation: 具有十三个接触弹簧的插座，其以支持现有MMC和SD形状因子的方式布置，并且还支持SD / MMC组合闪存卡。 组合存储卡包括与现有13焊盘MMC机械外形尺寸一致的PCB组件，以及与SD机械外形尺寸一致的外壳，从而提供可用于生产MMC的单个PCBA和外壳布置 和SD存储卡。 十三个接触垫支持所有MMC和SD接触焊盘图案，但是被修改以便于写保护开关。 插座的接触弹簧被布置成与修改的焊盘图案接触，但也向下兼容现有的SD和MMC外形。 还公开了一种包括插座和组合SD / MMC闪存卡的系统。

公开(公告)号：US20050281010A1

公开(公告)日：2005-12-22

申请号：US10871133

申请日：2004-06-18

Applicant: Kuang-Yu Wang ,  Jim Ni ,  Sun-Teck See

Inventor： Kuang-Yu Wang ,  Jim Ni ,  Sun-Teck See

IPC: H05K1/11 ,  H05K5/04 ,  H05K7/06

CPC classification number: H05K1/117 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09409 ,  H05K2203/167

Abstract: A memory card having thirteen contact pads arranged on a PCB in a manner that supports an integrated SD/MMC system. Eight contact pads form a front row, four contact pads form a second row behind the front row, and a thirteenth contact pad is located between the front and back rows adjacent to a chamfer formed on the PCB. An L-shaped gap region is provided between the first and second rows, and between the second row and side edge of the PCB. An optional alignment notch is defined along the side edge adjacent the second row. An optional alignment hole is defined between adjacent contact pads of the second row that receives an alignment pin passing between two covers of a two-part housing. The memory card electronics are compatible with either the MMC or SD protocols, and the housing is consistent with either the MMC or SD mechanical form factors.

Abstract translation: 一种具有以支持集成的SD / MMC系统的方式布置在PCB上的十三个接触垫的存储卡。 八个接触垫形成前排，四个接触垫在前排后面形成第二排，并且第十三接触垫位于与形成在PCB上的倒角相邻的前排和后排之间。 在第一行和第二行之间以及PCB的第二行和侧边缘之间设置L形间隙区域。 沿着与第二排相邻的侧边缘限定可选的对准凹口。 在第二行的相邻接触垫之间限定了可选的对准孔，该接触垫接收通过两部分壳体的两个盖之间的对准销。 存储卡电子设备与MMC或SD协议兼容，外壳与MMC或SD机械外形尺寸一致。