公开(公告)号：US5547908A

公开(公告)日：1996-08-20

申请号：US278175

申请日：1994-07-20

申请人： Akira Furuzawa ,  Akifumi Sata ,  Takeshi Kubota ,  Kunihide Shikata

发明人： Akira Furuzawa ,  Akifumi Sata ,  Takeshi Kubota ,  Kunihide Shikata

IPC分类号： C04B35/46 ,  C04B35/465 ,  H01B3/12 ,  H01G4/12 ,  H01L23/08 ,  H01L23/15

CPC分类号： H01L23/15 ,  C04B35/465 ,  H01B3/12 ,  H01L2224/48091

摘要： A dielectric ceramic composition having a high dielectric constant and a coefficient of thermal expansion nearly comparable with that of alumina, and a package for packaging semiconductor. The dielectric ceramic composition contains 0.1 to 0.6 parts by weight of manganese reckoned as an oxide per 100 parts by weight of chief components of the formula xTiO.sub.2 .cndot.yMgO.cndot.zSrO or of the formula xTiO.sub.2 .cndot.yMgO.cndot.zCaO wherein x, y and z are numerals that lie within given ranges. The package for packaging semiconductor comprises a package body composed of alumina and having a semiconductor-mounting portion, and a capacitor made up of a dielectric layer and an electrode layer provided on said semiconductor-mounting portion, wherein the dielectric layer is composed of the TiO.sub.2 --MgO--SrO--MnO.sub.2 -type dielectric ceramic or the TiO.sub.2 --MgO--CaO--MnO.sub.2 -type dielectric ceramic.

摘要翻译： 具有高介电常数和与氧化铝近似相当的热膨胀系数的介电陶瓷组合物，以及用于封装半导体的封装。 电介质陶瓷组合物含有0.1-0.6重量份的锰作为氧化物，每100重量份式xTiO2.yMgO.zSrO或式xTiO2.yMgO.zCoO的主要组分，其中x，y和z是数字 位于给定范围内。 封装半导体封装包括由氧化铝构成并具有半导体安装部分的封装体，以及由电介质层和设置在所述半导体安装部上的电极层构成的电容器，其中所述电介质层由TiO 2 -MgO-SrO-MnO 2型电介质陶瓷或TiO 2 -MgO-CaO-MnO 2型电介质陶瓷。

公开(公告)号：US08383236B2

公开(公告)日：2013-02-26

申请号：US12866701

申请日：2009-02-06

申请人： Shunji Mikaki ,  Kunihide Shikata

发明人： Shunji Mikaki ,  Kunihide Shikata

IPC分类号： B32B5/16

CPC分类号： C04B35/488 ,  C04B35/49 ,  C04B35/6455 ,  C04B2235/3201 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3225 ,  C04B2235/3229 ,  C04B2235/3232 ,  C04B2235/3241 ,  C04B2235/3246 ,  C04B2235/3267 ,  C04B2235/3272 ,  C04B2235/3418 ,  C04B2235/449 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/762 ,  C04B2235/765 ,  C04B2235/785 ,  C04B2235/786 ,  C04B2235/96 ,  C04B2235/9661 ,  Y10T428/2982 ,  Y10T428/2993

摘要： Provided are a zirconia sintered body that has excellent mechanical characteristics, as well as semiconductivity that can allow static electricity to escape at an appropriate rate, and a manufacturing method that can manufacture the same at lower cost than in the past. The zirconia sintered body is made of 66-90 parts by weight of zirconia that contains a stabilizer, and a total of 10-34 parts by weight of iron, chromium and titanium oxides. Of the iron, chromium and titanium oxides, the proportion of iron oxide is 70-99.5 wt %, the proportion of chromium oxide is 0.4-20 wt % and the proportion of titanium oxide is 0.1-10 wt %. The combined proportion of tetragonal and cubic crystals in the zirconia crystal phase is 90% or more and the mean crystal grain size of the zirconia is 0.3-0.5 μm. The mean crystal grain size of the iron, chromium and titanium oxides is 0.5-2.0 μm. It has excellent mechanical characteristics, as well as semiconductivity.

摘要翻译： 本发明提供一种氧化锆烧结体，其具有优异的机械特性以及允许静电以适当的速率逸出的半导体性，以及可以以比以往更低的成本制造相同的制造方法。 氧化锆烧结体由含有稳定剂的氧化锆66〜90重量份，铁，铬，钛氧化物总计10-34重量份构成。 在铁，铬和钛氧化物中，氧化铁的比例为70-99.5重量％，氧化铬的比例为0.4-20重量％，氧化钛的比例为0.1-10重量％。 氧化锆结晶相中四方晶体和立方晶体的组合比例为90％以上，氧化锆的平均结晶粒径为0.3〜0.5μm。 铁，铬和钛氧化物的平均晶粒尺寸为0.5-2.0μm。 它具有优异的机械特性以及半导体性。

公开(公告)号：US20080275568A1

公开(公告)日：2008-11-06

申请号：US10578025

申请日：2004-10-29

申请人： Kunihide Shikata ,  Takefumi Nakanishi ,  Yucong Wang

发明人： Kunihide Shikata ,  Takefumi Nakanishi ,  Yucong Wang

IPC分类号： A61F2/28 ,  A61F2/30

CPC分类号： C04B35/6455 ,  A61F2/32 ,  A61F2/34 ,  A61F2/38 ,  A61F2/3859 ,  A61F2/389 ,  A61F2002/30968 ,  A61F2002/3611 ,  A61F2310/00203 ,  A61L27/427 ,  C04B35/119 ,  C04B35/63 ,  C04B35/64 ,  C04B2235/3205 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3225 ,  C04B2235/3229 ,  C04B2235/3232 ,  C04B2235/3234 ,  C04B2235/3244 ,  C04B2235/3246 ,  C04B2235/3248 ,  C04B2235/3418 ,  C04B2235/404 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/6582 ,  C04B2235/661 ,  C04B2235/664 ,  C04B2235/77 ,  C04B2235/785 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/95 ,  C04B2235/96 ,  C04B2235/963

摘要： A biomedical member having high strength, high toughness and high hardness and an artificial joint that uses the same are provided. In addition, a biomedical member that exhibits high wear resistance even in in vivo environment and an artificial joint are provided.Such a composite ceramic is used that contains 65% by weight or more Al2O3, 4 to 34% by weight of ZrO2 and 0.1 to 4% by weight of SrO, while Sr forms a solid solution with part of the ZrO2 grains. The composite ceramics further contains TiO2, MgO and SiO2 as sintering additives, while controlling the amounts to 0.20% by weight or more SiO2, 0.22% by weight or more TiO2 and 0.12% by weight or more MgO, and the total amount of SiO2, TiO2 and MgO within a range from 0.6 to 4.5% by weight.

摘要翻译： 提供具有高强度，高韧性和高硬度的生物医学部件和使用其的人造关节。 此外，提供即使在体内环境中也显示高耐磨性的人造关节的生物医学部件。 使用这样的复合陶瓷，其含有65重量％以上的Al 2 O 3 3，4〜34重量％的ZrO 2 3和 0.1至4重量％的SrO，而Sr与部分ZrO 2颗粒形成固溶体。 复合陶瓷还含有TiO 2，MgO和SiO 2作为烧结添加剂，同时控制量为0.20重量％或更多的SiO 2， ，0.22重量％以上的TiO 2和0.12重量％以上的MgO，SiO 2的总量，TiO 2和 MgO在0.6〜4.5重量％的范围内。

公开(公告)号：US20060178257A1

公开(公告)日：2006-08-10

申请号：US11367088

申请日：2006-03-02

申请人： Kunihide Shikata ,  Shugo Onitsuka ,  Wang Yucong

发明人： Kunihide Shikata ,  Shugo Onitsuka ,  Wang Yucong

IPC分类号： C04B35/119 ,  C04B35/64

CPC分类号： C04B35/6455 ,  C04B35/119 ,  C04B35/64 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3229 ,  C04B2235/3246 ,  C04B2235/3284 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/662 ,  C04B2235/77 ,  C04B2235/785 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/94 ,  C04B2235/96 ,  C04B2235/9684

摘要： Composite ceramics having a high strength, a high toughness and an excellent abrasion resistance, and a method of producing the same. The composite ceramics comprises 10 to 30 mass % of a zirconia crystal phase including Ce-stabilized zirconia crystal particles which contain CeO2 in an amount of 9 to 12 mol % and Y-stabilized zirconia crystal particles which contain Y2O3 in an amount of 2.8 to 4.5 mol %; and 70 to 90 mass % of an alumina crystal phase, the zirconia crystal phase having an average crystal particle size of not larger than 1 μm.

摘要翻译： 具有高强度，高韧性和优异耐磨性的复合陶瓷及其制造方法。 该复合陶瓷包含10〜30质量％的氧化锆结晶相，其含有Ce-N 2 O 3的Ce稳定化氧化锆结晶粒子，其含量为9〜12摩尔％，Y稳定化的氧化锆结晶粒子含有 Y 2 O 3 3，其量为2.8〜4.5摩尔％; 和70〜90质量％的氧化铝结晶相，所述氧化锆结晶相的平均结晶粒径不大于1μm。

公开(公告)号：US09820379B2

公开(公告)日：2017-11-14

申请号：US14124227

申请日：2012-05-30

申请人： Kiyotaka Nakamura ,  Yoshio Ohashi ,  Yuuichi Abe ,  Eisuke Hirano ,  Kunihide Shikata ,  Keiichi Sekiguchi

发明人： Kiyotaka Nakamura ,  Yoshio Ohashi ,  Yuuichi Abe ,  Eisuke Hirano ,  Kunihide Shikata ,  Keiichi Sekiguchi

IPC分类号： H05K1/09 ,  H01L23/367 ,  H01L23/498 ,  H01L23/15 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/40

CPC分类号： H05K1/09 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/0266 ,  H05K2201/0326 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.

公开(公告)号：US20140268589A1

公开(公告)日：2014-09-18

申请号：US14124227

申请日：2012-05-30

申请人： Kiyotaka Nakamura ,  Yshio Ohashi ,  Yuuichi Abe ,  Eisuke Hirano ,  Kunihide Shikata ,  Kiichi Sekiguchi

发明人： Kiyotaka Nakamura ,  Yshio Ohashi ,  Yuuichi Abe ,  Eisuke Hirano ,  Kunihide Shikata ,  Kiichi Sekiguchi

IPC分类号： H05K1/09 ,  H05K1/11

CPC分类号： H05K1/09 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/0266 ,  H05K2201/0326 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.

摘要翻译： 具有包括陶瓷烧结体，贯通导体和金属布线层的电路板的电路板和电子装置。 陶瓷烧结体包括从第一主表面贯穿其第二主表面的通孔。 贯通导体位于通孔中，具有第一和第二端。 金属布线层覆盖第一端并电连接到贯通导体。 贯通导体包括：具有中空圆筒形状的第一部分，与通孔的内壁接触并从第一端延伸到第二端; 以及第二部分，其具有柱状并且设置在第一部分的内部。 第二部分具有大于第一部分的金属的平均粒度。

公开(公告)号：US20100234207A1

公开(公告)日：2010-09-16

申请号：US12740346

申请日：2008-10-28

申请人： Kunihide Shikata ,  Teruaki Katagiri

发明人： Kunihide Shikata ,  Teruaki Katagiri

IPC分类号： C04B35/14 ,  C04B35/10

CPC分类号： F04B53/14 ,  C04B35/14 ,  F04B53/16 ,  F05C2201/021 ,  F05C2203/08 ,  F05C2203/0869 ,  F05C2203/0878 ,  F16C33/043 ,  F16C2202/10 ,  F16C2206/42 ,  F16C2240/48

摘要： The present invention provides a dense, abrasion resistant ceramic. The ceramic of the invention includes alumina crystal particles and a grain boundary phase. The invention also includes an abrasion resistant sliding member and a pump comprising the same.

摘要翻译： 本发明提供致密的耐磨陶瓷。 本发明的陶瓷包括氧化铝晶体颗粒和晶界相。 本发明还包括耐磨滑动构件和包括该滑动构件的泵。

公开(公告)号：US07148167B2

公开(公告)日：2006-12-12

申请号：US10927266

申请日：2004-08-26

申请人： Kunihide Shikata ,  Shugo Onitsuka ,  Yucong Wang ,  Hiroaki Seno

发明人： Kunihide Shikata ,  Shugo Onitsuka ,  Yucong Wang ,  Hiroaki Seno

IPC分类号： C04B35/119

CPC分类号： C04B35/6455 ,  C04B35/119 ,  C04B35/6303 ,  C04B35/64 ,  C04B2235/3205 ,  C04B2235/3206 ,  C04B2235/3213 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3229 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3246 ,  C04B2235/3418 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/6582 ,  C04B2235/664 ,  C04B2235/76 ,  C04B2235/765 ,  C04B2235/785 ,  C04B2235/786 ,  C04B2235/788 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2235/963

摘要： Alumina/zirconia ceramics containing Al2O3 in an amount of not less than 65 mass % and ZrO2 in an amount of 4 to 34 mass %, and further containing TiO2, MgO and SiO2. The ceramics effectively suppresses the growth of shape isotropic particles of alumina, suppresses the growth of zirconia particles, and has a high strength and a high hardness. Besides, the ceramics containing SrO features a high fracture toughness.

摘要翻译： 含有不少于65质量％的Al 2 O 3 3的氧化铝/氧化锆陶瓷和ZrO 2 2的量为4〜34的氧化铝/氧化锆陶瓷 质量％，还含有TiO 2，MgO和SiO 2。 陶瓷有效抑制氧化铝形状各向同性颗粒的生长，抑制氧化锆颗粒的生长，并具有高强度和高硬度。 此外，含有SrO的陶瓷具有高断裂韧性。

公开(公告)号：US06255376B1

公开(公告)日：2001-07-03

申请号：US09123756

申请日：1998-07-27

申请人： Kunihide Shikata ,  Toshihiko Maeda

发明人： Kunihide Shikata ,  Toshihiko Maeda

IPC分类号： C08K338

CPC分类号： C08K3/28 ,  C08K3/08 ,  C08K3/22 ,  C08K5/0016 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  C08L23/08 ,  H01L2924/00 ,  H01L2224/05599

摘要： A thermally conductive compound which comprises 15 to 60 volume % of thermoplastic carrier resin consisting of a copolymer of a plasticizer with ethylene or of a polymer of the plasticizer, polyethylene and the copolymer, 40 to 85 volume % of thermally conductive filler particles dispersed in the carrier resin, and 0.5 to 5 weight % (for the filler particles) of a dispersing agent having (a) hydrophilic group(s) and (a) hydrophobic group(s). The thermally conductive compound has a high thermal conductivity and a plasticity in the range of temperatures of −40 to 50° C., and when it is interposed between an insulator body and a semiconductor element mounted thereon or between the semiconductor element and a cap, the heat generated by an operation of the semiconductor element is rapidly transferred and the thermal stress caused by the difference of coefficients of thermal expansion between the semiconductor element and the insulator body or cap is absorbed and relieved to cause no phase separation between them. The semiconductor device using the thermal compound, accordingly, is highly reliable.

摘要翻译： 包含15至60体积％的由增塑剂与乙烯的共聚物或增塑剂的聚合物，聚乙烯和共聚物组成的热塑性载体树脂的导热性化合物，分散在其中的40至85体积％的导热填料颗粒 载体树脂和0.5至5重量％（对于填料颗粒）具有（a）亲水基团和（a）疏水基团的分散剂。 导热性化合物在-40〜50℃的温度范围内具有高导热性和可塑性，并且当介于绝缘体和安装在其上的半导体元件之间或半导体元件与盖之间时， 由半导体元件的工作产生的热量被快速转移，并且由半导体元件和绝缘体或帽之间的热膨胀系数的差引起的热应力被吸收和释放，从而不会导致它们之间的相分离。 因此，使用热化合物的半导体器件是高度可靠的。

公开(公告)号：US5830819A

公开(公告)日：1998-11-03

申请号：US424782

申请日：1995-04-19

申请人： Kunihide Shikata ,  Kenichi Nagae ,  Toshihiko Uemura ,  Masaki Hayashi ,  Tsuneo Muchi

发明人： Kunihide Shikata ,  Kenichi Nagae ,  Toshihiko Uemura ,  Masaki Hayashi ,  Tsuneo Muchi

IPC分类号： C04B35/117 ,  H01J29/48 ,  C04B35/10

CPC分类号： H01J29/485 ,  C04B35/117

摘要： An aluminous sintered product comprising 70 to 96% by weight of an alumina component and 4 to 30% by weight of additives, said additives including at least the one selected from oxides of elements of the Group 5a of periodic table and at least the one selected from oxides of metals of the iron family and oxides of manganese, titanium, calcium, magnesium, chromium and silica, and said aluminous sintered product exhibiting a volume resistivity of from 1.times.10.sup.7 to 1.times.10.sup.13 .OMEGA.-cm over a temperature range of from 25.degree. to 75.degree. C. and an absolute value of the temperature coefficient of volume resistivity of not larger than 1.8%/.degree.C. under the application of high voltages. The sintered product is used as antistatic part such as conveyer arm, handling jig, tweezers for holding wafers and the like that must not be electrostatically charged in an apparatus for producing semiconductors, and as resistance substrate, electrically conducting material, contact, heater, part in vacuum tubes, and part for electron guns in a CRT such as of TVs and the like.

摘要翻译： 包含70至96重量％的氧化铝组分和4至30重量％的添加剂的高铝烧结产品，所述添加剂至少包括选自周期表第5a组元素的氧化物和至少一种选自 由铁族金属的氧化物和锰，钛，钙，镁，铬和二氧化硅的氧化物组成，所述铝烧结产品在25℃至75℃的温度范围内体积电阻率为1×10 7至1×10 13欧姆 - ℃，体积电阻率的温度系数的绝对值不大于1.8％/℃。 烧结体作为防静电部件，例如输送臂，处理夹具，用于保持晶片等的镊子，在用于制造半导体的装置中不得静电，并且作为电阻基板，导电材料，接触，加热器，部件 在真空管中，以及诸如电视机等的CRT中的电子枪的部件。