摘要:
An underwater laser processing system has a laser torch; a laser torch driving mechanism for changing a laser emission position of the laser torch; and a chamber with one end opened to an external environment, which contains the laser torch; wherein a partitioning wall for preventing permeation of water is provided between a free end of the chamber and the laser torch. The system is used for detecting a sensitized portion and repairing it at one time using a sensitization detecting arrangement. Moreover, it is used for forming an alloying layer by melting a sprayed coating film, and for forming a new surface layer by emitting a laser beam through a solution containing a metal component.
摘要:
The invention is a fastening device for fastening a plurality of structures using a bolt and a nut. At least two bolts are provided each having a screw portion at one end. At least one nut is provided for each of the bolts. The nut has a flange having a diameter greater than a distance between axes of the bolts with relative rotation of the nuts being restricted by fixing mutually overlapping portions of the flanges of the nuts threaded on the bolts to each other.
摘要:
Novel derivatives of 1-phenyl-1H-pyrazolo[3,4-d]pyrimidine substituted at the 4-position of the pyrimidine ring are provided. A typical example is 1-phenyl-1H-pyrazolo[3,4-d]pyrimidine-4-carbonitrile. The compounds exhibit excellent anti-carcinogenic activities as evidenced by the animal test with mice.
摘要:
A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.
摘要:
A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film, during the second polishing process and the third polishing process, monitoring a polishing state of the substrate with an eddy current sensor, and terminating the third polishing process when an output signal of the eddy current sensor reaches a predetermined threshold.
摘要:
The present invention provides a apparatus for polishing an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.
摘要:
An image transmitting system includes: an image transmitting unit that receives a projection command to project an annotation image onto an object, and transmits a captured image formed by capturing an image of the object designated by the projection command as an object onto which the annotation image is to be projected, the annotation image representing an annotation about the object; a projector that projects the annotation image in an artificially continuous manner, using an afterimage formed by intermittently projecting light onto the object; and an image capturing unit that captures an image of the object including the portion onto which the light is projected during a period between a time when the projector ends the light projection onto the object and a time when the projector starts the next light projection, and forms the captured image to be transmitted by the image transmitting unit.
摘要:
The layer thickness of an object including a substrate and a layer formed thereon is measured by the following steps. First, with regard to a reference system consisting of a reference substrate and a reference layer formed thereon, which are formed of the same materials as those of the object, and an ultrasonic wave propagation medium, the incident angle .theta. at which an ultrasonic wave is applied through the propagation medium to the reference layer and the product H of the frequency of the ultrasonic wave and the thickness of the reference layer are calculated, the incident angle .theta. and product H having such values as minimize the intensity of the ultrasonic wave reflected from the reference layer. The layer of the object is put in contact with the ultrasonic wave propagation medium, and an ultrasonic wave is applied to the layer through the propagation medium at the incident angle .theta.. Then, the frequency of the ultrasonic wave reflected from the layer is measured to detect the frequency of the incident ultrasonic wave for the minimum reflected wave intensity. The thickness of the layer of the object is calculated from the detected frequency and the value H.
摘要:
An improved lith-type silver halide photosensitive material of a wide latitude for infectious developing is disclosed which comprises, in an amount of 5 mg to 5 g per mole of silver halide, a compound represented by the following general formula: ##STR1## wherein R.sub.1 is a substituted or unsubstituted alkyl, aryl, aralkyl, arythio or aryloxy group, and R.sub.2 is hydrogen, halogen, alkyl, alkoxy or nitro.
摘要:
An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.