公开(公告)号：US20120068389A1

公开(公告)日：2012-03-22

申请号：US13064222

申请日：2011-03-11

申请人： Chan Park ,  Wook Jo ,  Jin-Sang Kim ,  O-Jong Kwon

发明人： Chan Park ,  Wook Jo ,  Jin-Sang Kim ,  O-Jong Kwon

IPC分类号： C04B35/645

CPC分类号： C04B35/01 ,  B32B18/00 ,  C04B35/6268 ,  C04B35/645 ,  C04B2235/3201 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3272 ,  C04B2235/3275 ,  C04B2235/5292 ,  C04B2235/604 ,  C04B2235/612 ,  C04B2235/663 ,  C04B2235/666 ,  C04B2235/787

摘要： Provided is a method of fabricating polycrystalline ceramic for thermoelectric devices. The method includes preparing calcined ceramic powders, forming a ceramic sheet by uni-axially pressing the calcined ceramic powders, stacking a plurality of the ceramic sheets in a uni-axial direction, and cofiring the stacked the plurality of the ceramic sheets.

摘要翻译： 提供一种制造用于热电装置的多晶陶瓷的方法。 该方法包括制备煅烧陶瓷粉末，通过单轴压制煅烧陶瓷粉末，沿单轴方向堆叠多个陶瓷片材，并共烧多个陶瓷片材，形成陶瓷片材。

公开(公告)号：US20110305079A1

公开(公告)日：2011-12-15

申请号：US13157343

申请日：2011-06-10

申请人： Chan Park ,  Changseok Kang ,  Sung-Il Chang ,  Byeong-In Choe

发明人： Chan Park ,  Changseok Kang ,  Sung-Il Chang ,  Byeong-In Choe

IPC分类号： G11C16/10

CPC分类号： G11C16/10 ,  G11C16/3418

摘要： A nonvolatile memory device including a dummy memory cell and a method of programming the same, wherein the nonvolatile memory device includes a dummy memory cell, and a plurality of memory cells serially connected to the dummy memory cell. The nonvolatile memory device sets a voltage provided to the dummy memory cell according to a distance between a selected memory cell among the plurality of memory cells and the dummy memory cell when a program operation is performed.

摘要翻译： 一种包括虚拟存储单元的非易失性存储器件及其编程方法，其中非易失性存储器件包括一个虚拟存储单元和与该虚拟存储单元串联连接的多个存储单元。 非易失性存储装置根据执行程序操作时的多个存储单元中的所选择的存储单元与虚拟存储单元之间的距离，设定提供给虚拟存储单元的电压。

公开(公告)号：US08019558B2

公开(公告)日：2011-09-13

申请号：US12666556

申请日：2009-05-08

申请人： Dae-Sung Cheon ,  Eui-Sub Park ,  Yong-Bok Jung ,  Chan Park ,  Joong-Ho Synn

发明人： Dae-Sung Cheon ,  Eui-Sub Park ,  Yong-Bok Jung ,  Chan Park ,  Joong-Ho Synn

IPC分类号： G01B5/28

CPC分类号： G01V1/008 ,  E02D1/022 ,  G10K11/002

摘要： Provided is a method of predicting failure in geotechnical structures using an AE method instead of a conventional displacement or stress measuring method, which belongs to a field of rock mechanics and geotechnical engineering. The method is a measurement technology for identifying signs of failure in geotechnical structures using Acoustic Emission (AE) signals generated by damage in the geotechnical structure and also providing management standard for failure prediction.

摘要翻译： 提供了一种使用AE方法代替岩石力学和岩土工程领域的常规位移或应力测量方法来预测岩土结构失效的方法。 该方法是使用由岩土结构中的损伤产生的声发射（AE）信号识别岩土结构失效迹象的测量技术，并提供故障预测的管理标准。

公开(公告)号：US20110204468A1

公开(公告)日：2011-08-25

申请号：US13064914

申请日：2011-04-26

申请人： Jae-ho Song ,  Chan Park ,  Young-hoon Park ,  Sang-il Jung ,  Jong-wook Hong ,  Keo-sung Park ,  Eun-soo Kim ,  Won-je Park ,  Jin-Hyeong Park ,  Dae-cheol Seong ,  Won-jeong Lee ,  Pu-ra Kim

发明人： Jae-ho Song ,  Chan Park ,  Young-hoon Park ,  Sang-il Jung ,  Jong-wook Hong ,  Keo-sung Park ,  Eun-soo Kim ,  Won-je Park ,  Jin-Hyeong Park ,  Dae-cheol Seong ,  Won-jeong Lee ,  Pu-ra Kim

IPC分类号： H01L27/146

CPC分类号： H01L27/14603 ,  H01L27/14609 ,  H01L27/14689

摘要： Example embodiments disclose an image sensor capable of preventing or reducing image lag and a method of manufacturing the same. Example methods may include forming a gate insulating film and a gate conductive film doped with a first-conductive-type dopant on a semiconductor substrate; forming a transfer gate pattern by patterning the gate insulating film and the gate conductive film; and fabricating a transfer gate electrode by forming a first-conductive-type photodiode in the semiconductor substrate adjacent to one region of the transfer gate pattern, by forming a second-conductive-type photodiode on the first-conductive-type photodiode, and by forming a first-conductive-type floating diffusion region in the semiconductor substrate adjacent to the other region of the transfer gate pattern.

公开(公告)号：US20110163362A1

公开(公告)日：2011-07-07

申请号：US13064176

申请日：2011-03-09

申请人： Won-je Park ,  Chan Park ,  Young-hoon Park ,  Jae-ho Song ,  Jong-wook Hong ,  Keo-sung Park

发明人： Won-je Park ,  Chan Park ,  Young-hoon Park ,  Jae-ho Song ,  Jong-wook Hong ,  Keo-sung Park

IPC分类号： H01L31/14

CPC分类号： H01L27/14643 ,  H01L27/14603 ,  H01L27/14609 ,  H01L27/14641 ,  H01L27/14689

摘要： A method of fabricating an image sensor may include providing a substrate including light-receiving and non-light-receiving regions; forming a plurality of gates on the non-light-receiving region; ion-implanting a first-conductivity-type dopant into the light-receiving region to form a first dopant region of a pinned photodiode; primarily ion-implanting a second-conductivity-type dopant, different from the first-conductivity-type dopant, into an entire surface of the substrate, using the gates as a first mask; forming spacers on both side walls of the gates; and secondarily ion-implanting the second-conductivity-type dopant into the entire surface of the substrate, using the plurality of gates including the spacers as a second mask, to complete a second dopant region of the pinned photodiode. An image sensor may include the substrate; a transfer gate formed on the non-light-receiving region; a first dopant region in the light-receiving region; and a second dopant region formed on a surface of the light-receiving region.

摘要翻译： 制造图像传感器的方法可以包括提供包括光接收和非光接收区域的基板; 在非光接收区域上形成多个栅极; 将第一导电型掺杂剂离子注入到光接收区域中以形成钉扎光电二极管的第一掺杂区域; 主要使用栅极作为第一掩模，将与第一导电类型掺杂剂不同的第二导电型掺杂剂离子注入基板的整个表面; 在门的两个侧壁上形成间隔物; 并且其次使用包括间隔物的多个栅极作为第二掩模将第二导电型掺杂剂离子注入到基板的整个表面中，以完成被钉扎的光电二极管的第二掺杂区域。 图像传感器可以包括基板; 形成在非光接收区域上的传输门; 在所述光接收区域中的第一掺杂剂区域; 以及形成在光接收区域的表面上的第二掺杂剂区域。

公开(公告)号：US20080157397A1

公开(公告)日：2008-07-03

申请号：US12003562

申请日：2007-12-28

申请人： Chan Park

发明人： Chan Park

IPC分类号： H01L23/48 ,  H01L21/02

CPC分类号： H01L21/563 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/16105 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/014

摘要： A flip-chip package may include: a semiconductor chip having first pads arranged substantially along a first direction; a substrate having second pads, arranged substantially in a zigzag form aligned with the first pads as a center line, and facing the semiconductor chip; and conductive bumps for electrically connecting the first pads to the second pads in a one-to-one relationship. Adjacent conductive bumps may extend in different directions. A method of manufacturing a flip-chip package may include: forming conductive bumps that extend along different directions on first pads of a semiconductor chip; and connecting second pads of a substrate to the conductive bumps in a one-to-one relationship. A method of manufacturing a flip-chip package may include: forming conductive bumps that extend along different directions on second pads of a substrate; and connecting first pads of a semiconductor chip to the conductive bumps in a one-to-one relationship.

摘要翻译： 倒装芯片封装可以包括：半导体芯片，其具有基本上沿着第一方向布置的第一焊盘; 具有第二焊盘的基板，其基本上以与所述第一焊盘为中心线对齐的锯齿形状并且面向所述半导体芯片; 以及用于以一对一关系将第一焊盘电连接到第二焊盘的导电凸块。 相邻的导电凸块可以在不同的方向上延伸。 制造倒装芯片封装的方法可以包括：在半导体芯片的第一焊盘上形成沿着不同方向延伸的导电凸块; 并且以一对一的关系将衬底的第二焊盘连接到导电凸块。 制造倒装芯片封装的方法可以包括：形成沿衬底的第二焊盘沿不同方向延伸的导电凸块; 并且以一对一的关系将半导体芯片的第一焊盘连接到导电凸块。

公开(公告)号：US20070114114A1

公开(公告)日：2007-05-24

申请号：US11656459

申请日：2007-01-23

申请人： Chan Park ,  Min Song

发明人： Chan Park ,  Min Song

IPC分类号： H01H9/00

CPC分类号： G05G9/04796 ,  G05G2009/04744 ,  G05G2009/04777 ,  H01H25/041 ,  H01H2025/045

摘要： Embodiments of the invention provide an information input system for a terminal and a multifunctional button assembly for use in the information input system and methods for operating the same. The multifunctional button assembly can include a lever control button, a rotary button and a switch that can be mounted on a substrate. The multifunctional button assembly of the invention can provide advantages in that since the number of functions provided by the multifunctional button assembly is relatively increased, more functions can be concurrently employed, and a terminal employing the multifunctional button assembly can be manufactured to be light, thin, short and compact.

公开(公告)号：US20070000221A1

公开(公告)日：2007-01-04

申请号：US11363205

申请日：2006-02-28

申请人： Chan Park ,  Young Kim ,  Sun Oh

发明人： Chan Park ,  Young Kim ,  Sun Oh

IPC分类号： B01D46/00

CPC分类号： B01D46/10 ,  B01D46/0023 ,  B01D46/0075 ,  B01D2277/20

摘要： An air purifier designed to allow dust collected on a surface of a dust filter therein to be conveniently and rapidly removed from the dust filter without separating the dust filter from the air purifier unit. The air purifier includes a vibrating member equipped adjacent to the dust filter, and a vibration motor assembly equipped to the vibrating member to remove dust attached to the dust filter through vibratory motion. The dust filter is equipped at an angle within the housing for the air purifier such that an upper end of the dust filter is closer to a front side of the housing than a lower end of the dust filter. The air purifier may further include a tray equipped below the dust filter to collect the dust that drops from the dust filter when the dust filter is vibrated by vibration of the vibrating member. The tray has a rear plate extending towards the lower end of the dust filter to prevent the dust collected in the tray from being scattered and then reattached to the dust filter. One or more surfaces of the dust filter may be coated to prevent static electricity from accumulating thereon so as to easily remove the dust.

摘要翻译： 一种空气净化器，其设计成可以将灰尘过滤器的表面上收集的灰尘从灰尘过滤器方便地快速地除去，而不会将灰尘过滤器与空气净化器单元分离。 空气净化器包括与防尘过滤器相邻配置的振动部件，以及振动电动机组件，其配置在振动部件上，以通过振动运动除去附着在尘埃过滤器上的灰尘。 防尘过滤器在空气净化器的壳体内成角度设置，使得防尘过滤器的上端比防尘过滤器的下端更靠近壳体的前侧。 空气净化器还可以包括设置在防尘过滤器下方的托盘，用于当通过振动构件的振动而使灰尘过滤器振动时收集从防尘过滤器滴落的灰尘。 托盘具有朝向防尘过滤器的下端延伸的后板，以防止收集在托盘中的灰尘散开，然后重新连接到除尘过滤器。 可以涂覆防尘过滤器的一个或多个表面以防止静电积聚在其上，以便容易地除去灰尘。

公开(公告)号：US20060146651A1

公开(公告)日：2006-07-06

申请号：US11025250

申请日：2004-12-30

申请人： Chan Park ,  Christine Park ,  Seo Park

发明人： Chan Park ,  Christine Park ,  Seo Park

IPC分类号： G04C17/00 ,  G04B19/24

CPC分类号： G07F7/08 ,  G07F7/0833

摘要： The method for encoding a date for universal recognition provides a representation of a date that eliminates ambiguities that may arise because of different date formats widely used throughout the world. A date is encoded by first expressing the date as at least a calendar month and a calendar year within a calendar system. A month identifier is encoded for the calendar month. The month identifier comprises a first identifier field having a first association with the name of the month, and a second identifier field having a second association with the name of the month. Next, a year identifier is formed for the calendar year. A date representation is formed by formatting the month identifier together with the year identifier. Visual indicia of the date representation are formed on an article to express a date of interest, such as an expiration date on a credit card.

摘要翻译： 用于编码通用识别日期的方法提供了一个日期的表示，消除了由于世界各地广泛使用的不同日期格式而可能出现的歧义。 日期通过在日历系统中首先将日期表达为至少日历月和日历年来进行编码。 一个月的标识符是编号为日历月。 月份标识符包括具有与月份的名称的第一关联的第一标识符字段和与该月份的名称具有第二关联的第二标识符字段。 接下来，为日历年形成年份标识符。 通过将月份标识符与年份标识符格式化来形成日期表示。 日期表示的视觉标记形成在文章上以表达感兴趣的日期，例如信用卡上的到期日。

公开(公告)号：US20060002675A1

公开(公告)日：2006-01-05

申请号：US11159206

申请日：2005-06-23

申请人： Chul Choi ,  Min Noh ,  Hyun Oh ,  Chan Park

发明人： Chul Choi ,  Min Noh ,  Hyun Oh ,  Chan Park

IPC分类号： G02B6/10 ,  F21V7/04

CPC分类号： G02B6/0038 ,  G02B6/005 ,  G02B6/0065

摘要： A light guide plate for a surface light-emitting device and a method of manufacturing the same are disclosed wherein the light guide plate is constructed in the form of an optical waveguide including an upper cladding film, core films formed with V-cut grooves, and a lower cladding film, so that since the upper and lower cladding films with a relatively low refractive index are respectively located on upper and lower surfaces of the core films, external foreign substances cannot penetrate into the core films, and the core films are not brought into contact with other components, whereby optical transmission properties are not changed and brightness can be also enhanced, and since the V-cut grooves are formed or both the V-cut grooves and optical waveguides are formed at the same time by means of a simple hot embossing process, the manufacturing costs can be saved.

摘要翻译： 公开了一种用于表面发光器件的导光板及其制造方法，其中导光板被构造为包括上包层膜的光波导，形成有V切槽的芯膜，以及 下包层膜，因为折射率相对较低的上包层和下包层膜分别位于芯膜的上表面和下表面上，外部异物不能渗透到芯膜中，并且芯膜不被带入 与其他部件接触，由此光传输性能不变，并且还可以提高亮度，并且由于形成V切槽，或者通过简单的方式同时形成V形槽和光波导 热压花工艺，可节省制造成本。