公开(公告)号：US10242844B2

公开(公告)日：2019-03-26

申请号：US14553870

申请日：2014-11-25

Applicant: Lam Research Corporation

Inventor： Jon McChesney ,  Alex Paterson

IPC: H01J37/32

Abstract: A plasma processing chamber includes a substrate support for receiving and holding a substrate. A window in the plasma processing chamber is oriented over the substrate support. A plurality of transformer coupled plasma coils is disposed over the window. The TCP coils are disposed radially equidistant from one another. Each TCP coil is connected to a power circuitry at one end and the opposite end is electrically grounded. The power circuitry includes an RF source and a phase-shift modulator. The RF source is used to apply RF power to the TCP coils at a generator frequency to generate RF electric field. The phase-shift modulator coupled to the RF source is configured to apply a modulation frequency that is phase-shifted to allow the RF electric field applied to each of the TCP coils to transition in a rotating pattern.

公开(公告)号：US11887819B2

公开(公告)日：2024-01-30

申请号：US17960576

申请日：2022-10-05

Applicant: Lam Research Corporation

Inventor： Jon McChesney ,  Saravanapriyan Sriraman ,  Richard A. Marsh ,  Alexander Miller Paterson ,  John Holland

IPC: H01J37/32

CPC classification number: H01J37/32522 ,  H01J37/32082 ,  H01J37/32119 ,  H01J37/32238

Abstract: In one embodiment, a plasma processing device may include a dielectric window, a vacuum chamber, an energy source, and at least one air amplifier. The dielectric window may include a plasma exposed surface and an air exposed surface. The vacuum chamber and the plasma exposed surface of the dielectric window can cooperate to enclose a plasma processing gas. The energy source can transmit electromagnetic energy through the dielectric window and form an elevated temperature region in the dielectric window. The at least one air amplifier can be in fluid communication with the dielectric window. The at least one air amplifier can operate at a back pressure of at least about 1 in-H2O and can provide at least about 30 cfm of air.

公开(公告)号：US10770339B2

公开(公告)日：2020-09-08

申请号：US16398107

申请日：2019-04-29

Applicant: Lam Research Corporation

Inventor： Damon Tyrone Genetti ,  Jon McChesney ,  Alex Paterson ,  Derek John Witkowicki ,  Austin Ngo

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/683

Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module. The lift mechanism is configured to receive the consumable part provided for replacement by the exchange handler and lower the consumable part to an installed position. The replacement by the exchange handler and the process module is conducted while the process module and the replacement station are maintained in a vacuum state.

公开(公告)号：US20170287682A1

公开(公告)日：2017-10-05

申请号：US15403786

申请日：2017-01-11

Applicant: LAM RESEARCH CORPORATION

Inventor： Marcus Musselman ,  Andrew D. Bailey, III ,  Jon McChesney

IPC: H01J37/32 ,  H01L21/673

Abstract: A substrate support in a substrate processing system includes an inner portion arranged to support a substrate, an edge ring surrounding the inner portion, and a controller. The controller at least one of lowers the edge ring to selectively cause the edge ring to engage the substrate and raises the inner portion to selectively cause the edge ring to engage the substrate. The controller determines when the edge ring engages the substrate and calculates at least one characteristic of the substrate processing system based on the determination of when the edge ring engages the substrate.

公开(公告)号：US20170103875A1

公开(公告)日：2017-04-13

申请号：US15384209

申请日：2016-12-19

Applicant: Lam Research Corporation

Inventor： Jon McChesney ,  Alex Paterson

IPC: H01J37/32

Abstract: Systems, methods, and computer programs are presented for controlling the temperature of a window in a semiconductor manufacturing chamber. One apparatus includes a heater for receiving and heating a flow of air and an air amplifier coupled to pressurized gas. The air amplifier has an input that receives the flow of air from the heater, and the air amplifier having an output. A duct is coupled to the output of the air amplifier and a plenum is coupled to the duct. The plenum receives the flow of air and distributes the flow of air over a window of a plasma chamber. A temperature sensor is situated about the window of the plasma chamber and a controller is provided to control the air amplifier and the heater based on a temperature measured by the temperature sensor.

公开(公告)号：US20160211165A1

公开(公告)日：2016-07-21

申请号：US14598943

申请日：2015-01-16

Applicant: Lam Research Corporation

Inventor： Jon McChesney ,  Alex Paterson

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/3213 ,  H01L21/311 ,  H01L21/3065

CPC classification number: H01L21/67069 ,  H01J37/32642 ,  H01L21/68735 ,  H01L21/68742

Abstract: A substrate processing system includes a processing chamber. A pedestal is arranged in the processing chamber. An edge coupling ring is arranged adjacent to the pedestal and around a radially outer edge of the substrate. An actuator is configured to selectively move a first portion of the edge coupling ring relative to the substrate to alter an edge coupling profile of the edge coupling ring.

Abstract translation: 基板处理系统包括处理室。 处理室中设有基座。 边缘耦合环布置成与基座相邻并且围绕衬底的径向外边缘。 致动器构造成选择性地移动边缘联接环的第一部分相对于基底以改变边缘联接环的边缘联接轮廓。

公开(公告)号：US12237154B2

公开(公告)日：2025-02-25

申请号：US16487703

申请日：2017-11-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Hiran Rajitha Rathnasinghe ,  Shawn E S Tokairin ,  Jon McChesney

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: A bottom ring is configured to support a moveable edge ring. The edge ring is configured to be raised and lowered relative to a substrate support. The bottom ring includes an upper surface that is stepped, an annular inner diameter, an annular outer diameter, a lower surface, and a plurality of vertical guide channels provided through the bottom ring from the lower surface to the upper surface of the bottom ring. Each of the guide channels includes a first region having a smaller diameter than the guide channel, and the guide channels are configured to receive respective lift pins for raising and lowering the edge ring.

公开(公告)号：US10690374B2

公开(公告)日：2020-06-23

申请号：US15885728

申请日：2018-01-31

Applicant: Lam Research Corporation

Inventor： Saravanapriyan Sriraman ,  John Drewery ,  Jon McChesney ,  Alex Paterson

IPC: C23C16/00 ,  H01L21/306 ,  F24F13/00 ,  H01J37/32

Abstract: A chamber is provided. The chamber includes a Faraday shield positioned above a substrate support of the chamber. A dielectric window is disposed over the Faraday shield, and the dielectric window has a center opening. A hub having an internal plenum for passing a flow of fluid received from an input conduit and removing the flow of fluid from an output conduit is further provided. The hub has sidewalls and a center cavity inside of the sidewalls for an optical probe, and the internal plenum is disposed in the sidewalls. The hub has an interface surface that is in physical contact with a back side of the Faraday shield. The physical contact provides for a thermal couple to the Faraday shield at a center region around said center opening, and an outer surface of the sidewalls of the hub are disposed within the center opening of the dielectric window.

公开(公告)号：US10304717B2

公开(公告)日：2019-05-28

申请号：US15668673

申请日：2017-08-03

Applicant: Lam Research Corporation

Inventor： Damon Tyrone Genetti ,  Jon McChesney ,  Alex Paterson ,  Derek John Witkowicki ,  Austin Ngo

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/683

Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module. The lift mechanism is configured to receive the consumable part provided for replacement by the exchange handler and lower the consumable part to an installed position. The replacement by the exchange handler and the process module is conducted while the process module and the replacement station are maintained in a vacuum state.

公开(公告)号：US10062599B2

公开(公告)日：2018-08-28

申请号：US15048960

申请日：2016-02-19

Applicant: Lam Research Corporation

Inventor： Damon Tyrone Genetti ,  Jon McChesney ,  Alex Paterson ,  Derek John Witkowicki ,  Austin Ngo

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67 ,  H01L21/673 ,  H01L21/683

CPC classification number: H01L21/6875 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67386 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68735 ,  H01L21/68785

Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module. The lift mechanism is configured to receive the consumable part provided for replacement by the exchange handler and lower the consumable part to an installed position. The replacement by the exchange handler and the process module is conducted while the process module and the replacement station are maintained in a vacuum state.